Qin; Meifang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Qin; Meifang.The latest application filed is for "single-loop octane enrichment".
- Qin; Meifang - Princeton NJ
- Qin; Meifang - Princton NJ
- Qin, Meifang - Branchburg NJ
| Patent | Date |
|---|---|
| Single-loop octane enrichment Grant 10,808,179 - Qin , et al. October 20, 2 | 2020-10-20 |
| Single-loop Octane Enrichment App 20200010766 - QIN; Meifang ; et al. | 2020-01-09 |
| Single-loop octane enrichment Grant 10,450,512 - Qin , et al. Oc | 2019-10-22 |
| Configuration in single-loop synfuel generation Grant 10,214,694 - Fang , et al. Feb | 2019-02-26 |
| Novel Configuration In Single-loop Synfuel Generation App 20170260458 - FANG; Howard L. ; et al. | 2017-09-14 |
| Single-loop Octane Enrichment App 20170226427 - QIN; Meifang ; et al. | 2017-08-10 |
| Configuration in single-loop synfuel generation Grant 9,670,416 - Fang , et al. June 6, 2 | 2017-06-06 |
| Novel Configuration In Single-loop Synfuel Generation App 20160168476 - Fang; Howard L. ; et al. | 2016-06-16 |
| Fuel composition Grant 8,722,951 - Fang , et al. May 13, 2 | 2014-05-13 |
| Novel Fuel Composition App 20140018587 - FANG; Howard L. ; et al. | 2014-01-16 |
| Fuel composition Grant 8,569,554 - Fang , et al. October 29, 2 | 2013-10-29 |
| Catalytical Gasifier Configuration For Biomass Pyrolysis App 20130270483 - BEN-REUVEN; Moshe ; et al. | 2013-10-17 |
| Lasable bond-ply materials for high density printed wiring boards App 20040170795 - Haas, David R. ; et al. | 2004-09-02 |
| Lasable bond-ply materials for high density printed wiring boards Grant 6,673,190 - Haas , et al. January 6, 2 | 2004-01-06 |
| Lasable bond-ply materials for high density printed wiring boards App 20020004352 - Haas, David ; et al. | 2002-01-10 |
| Lasable bond-ply materials for high density printed wiring boards Grant 6,245,696 - Haas , et al. June 12, 2 | 2001-06-12 |
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