Qin; Ce
Patent Applications and Registrations
Patent applications and USPTO patent grants for Qin; Ce.The latest application filed is for "semiconductor mask reshaping using a sacrificial layer".
- Qin; Ce - Fremont CA
| Patent | Date |
|---|---|
| Semiconductor Mask Reshaping Using A Sacrificial Layer App 20220076962 - Tan; Zhongkui ; et al. | 2022-03-10 |
| Silicon Oxide Silicon Nitride Stack Stair Step Etch App 20210407811 - QIN; Ce ; et al. | 2021-12-30 |
| Amorphous carbon layer opening process Grant 11,037,784 - Qin , et al. June 15, 2 | 2021-06-15 |
| Amorphous Carbon Layer Opening Process App 20210035796 - QIN; Ce ; et al. | 2021-02-04 |
| Hybrid stair-step etch Grant 9,741,563 - Xiang , et al. August 22, 2 | 2017-08-22 |
| Hybrid Stair-step Etch App 20170213723 - XIANG; Hua ; et al. | 2017-07-27 |
| Method for forming stair-step structures Grant RE46,464 - Fu , et al. July 4, 2 | 2017-07-04 |
| Method for forming stair-step structures Grant 8,535,549 - Fu , et al. September 17, 2 | 2013-09-17 |
| Method For Forming Stair-step Structures App 20120149203 - Fu; Qian ; et al. | 2012-06-14 |
| Multi-workpiece processing chamber Grant 8,066,815 - Devine , et al. November 29, 2 | 2011-11-29 |
| Method and Apparatus for Plasma Process Performance Matching in Multiple Wafer Chambers App 20090206056 - Xu; Songlin ; et al. | 2009-08-20 |
| Selective etching method and apparatus App 20080124937 - Xu; Songlin ; et al. | 2008-05-29 |
| Multi-workpiece processing chamber Grant 7,276,122 - Devine , et al. October 2, 2 | 2007-10-02 |
| Multi-workpiece processing chamber App 20050247265 - Devine, Daniel J. ; et al. | 2005-11-10 |
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