| Patent | Date |
|---|
Architecture and processes to enable high capacity memory packages through memory die stacking
Grant 11,456,281 - Li , et al. September 27, 2 | 2022-09-27 |
Integrated circuit package with test circuitry for testing a channel between dies
Grant 11,450,613 - Xie , et al. September 20, 2 | 2022-09-20 |
Microelectronic assemblies having magnetic core inductors
Grant 11,450,560 - Bharath , et al. September 20, 2 | 2022-09-20 |
Dielectric-filled Trench Isolation Of Vias
App 20220270974 - Aygun; Kemal ; et al. | 2022-08-25 |
Clock Phase Management For Die-to-die (d2d) Interconnect
App 20220271912 - Pasdast; Gerald ; et al. | 2022-08-25 |
High density interconnect structures configured for manufacturing and performance
Grant 11,387,188 - Braunisch , et al. July 12, 2 | 2022-07-12 |
Power-forwarding Bridge For Inter-chip Data Signal Transfer
App 20220199537 - Qian; Zhiguo ; et al. | 2022-06-23 |
Shield Structures In Microelectronic Assemblies Having Direct Bonding
App 20220199546 - Elsherbini; Adel A. ; et al. | 2022-06-23 |
Horizontal Pitch Translation Using Embedded Bridge Dies
App 20220157706 - SHARAN; Sujit ; et al. | 2022-05-19 |
Enabling Long Interconnect Bridges
App 20220130763 - Mahajan; Ravindranath V. ; et al. | 2022-04-28 |
Ground Via Clustering For Crosstalk Mitigation
App 20220130742 - QIAN; Zhiguo ; et al. | 2022-04-28 |
Dielectric-filled trench isolation of vias
Grant 11,296,031 - Aygun , et al. April 5, 2 | 2022-04-05 |
Selectively Roughened Copper Architectures For Low Insertion Loss Conductive Features
App 20220102259 - Kong; Jieying ; et al. | 2022-03-31 |
Power Delivery For Embedded Bridge Die Utilizing Trench Structures
App 20220093516 - AYGUN; Kemal ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093547 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Capacitors And Resistors At Direct Bonding Interfaces In Microelectronic Assemblies
App 20220093725 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Horizontal pitch translation using embedded bridge dies
Grant 11,276,635 - Sharan , et al. March 15, 2 | 2022-03-15 |
Ground via clustering for crosstalk mitigation
Grant 11,244,890 - Qian , et al. February 8, 2 | 2022-02-08 |
Power delivery for embedded bridge die utilizing trench structures
Grant 11,222,848 - Aygun , et al. January 11, 2 | 2022-01-11 |
Enabling long interconnect bridges
Grant 11,222,847 - Mahajan , et al. January 11, 2 | 2022-01-11 |
Scalable And Interoperable Phyless Die-to-die Io Solution
App 20210398906 - QIAN; Zhiguo ; et al. | 2021-12-23 |
Airgap Structures For High Speed Signal Integrity
App 20210375746 - Feng; Hongxia ; et al. | 2021-12-02 |
Package Substrates With Magnetic Build-up Layers
App 20210327795 - QIAN; Zhiguo ; et al. | 2021-10-21 |
Side Mounted Interconnect Bridges
App 20210296242 - Hossain; MD Altaf ; et al. | 2021-09-23 |
Bridge die design for high bandwidth memory interface
Grant 11,094,633 - Qian , et al. August 17, 2 | 2021-08-17 |
Package substrates with magnetic build-up layers
Grant 11,081,434 - Qian , et al. August 3, 2 | 2021-08-03 |
Side mounted interconnect bridges
Grant 11,031,341 - Hossain , et al. June 8, 2 | 2021-06-08 |
Die Interconnect Structures And Methods
App 20210167015 - Qian; Zhiguo ; et al. | 2021-06-03 |
Minimizing Package Impedance Discontinuity Through Dielectric Structure Optimizations
App 20210125912 - QIAN; Zhiguo ; et al. | 2021-04-29 |
Interconnect Loss Of High Density Package With Magnetic Material
App 20210104476 - QIAN; Zhiguo ; et al. | 2021-04-08 |
Semiconductor package with through bridge die connections
Grant 10,950,550 - Qian , et al. March 16, 2 | 2021-03-16 |
Ground Via Clustering For Crosstalk Mitigation
App 20210057321 - Qian; Zhiguo ; et al. | 2021-02-25 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20210057345 - Braunisch; Henning ; et al. | 2021-02-25 |
Die interconnect structures and methods
Grant 10,892,225 - Qian , et al. January 12, 2 | 2021-01-12 |
High density interconnect structures configured for manufacturing and performance
Grant 10,867,926 - Braunisch , et al. December 15, 2 | 2020-12-15 |
Dielectric-filled Trench Isolation Of Vias
App 20200388572 - Aygun; Kemal ; et al. | 2020-12-10 |
Horizontal Pitch Translation Using Embedded Bridge Dies
App 20200381350 - SHARAN; Sujit ; et al. | 2020-12-03 |
Ground via clustering for crosstalk mitigation
Grant 10,854,539 - Qian , et al. December 1, 2 | 2020-12-01 |
Package Substrates With Magnetic Build-up Layers
App 20200373232 - QIAN; Zhiguo ; et al. | 2020-11-26 |
Coreless package architecture for multi-chip opto-electronics
Grant 10,845,552 - Liff , et al. November 24, 2 | 2020-11-24 |
Trace modulations in connectors for integrated-circuit packages
Grant 10,840,196 - Geyik , et al. November 17, 2 | 2020-11-17 |
High density interconnect structures configured for manufacturing and performance
Grant 10,833,020 - Braunisch , et al. November 10, 2 | 2020-11-10 |
Optimal Signal Routing Performance Through Dielectric Material Configuration Designs In Package Substrate
App 20200343175 - QIAN; Zhiguo ; et al. | 2020-10-29 |
Rlink--die to die channel interconnect configurations to improve signaling
Grant 10,784,204 - Aygun , et al. Sept | 2020-09-22 |
MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (TSVs)
App 20200279793 - XIE; Jianyong ; et al. | 2020-09-03 |
High power terahertz impulse for fault isolation
Grant 10,746,780 - Xie , et al. A | 2020-08-18 |
Package substrates with magnetic build-up layers
Grant 10,748,842 - Qian , et al. A | 2020-08-18 |
Semiconductor Package With Through Bridge Die Connections
App 20200243448 - Qian; Zhiguo ; et al. | 2020-07-30 |
Power Delivery For Embedded Bridge Die Utilizing Trench Structures
App 20200235053 - AYGUN; Kemal ; et al. | 2020-07-23 |
Intra-semiconductor Die Communication Via Waveguide In A Multi-die Semiconductor Package
App 20200203293 - Aygun; Kemal ; et al. | 2020-06-25 |
Inorganic interposer for multi-chip packaging
Grant 10,692,847 - Sobieski , et al. | 2020-06-23 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20200168553 - Braunisch; Henning ; et al. | 2020-05-28 |
High density package interconnects
Grant 10,658,279 - Ganesan , et al. | 2020-05-19 |
Architecture And Processes To Enable High Capacity Memory Packages Through Memory Die Stacking
App 20200105719 - LI; Yi ; et al. | 2020-04-02 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
Grant 10,607,951 - Zhang , et al. | 2020-03-31 |
Microelectronic Assemblies Having Magnetic Core Inductors
App 20200098621 - Bharath; Krishna ; et al. | 2020-03-26 |
Microelectronic Assemblies
App 20200091128 - Elsherbini; Adel A. ; et al. | 2020-03-19 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
Grant 10,580,734 - Zhang , et al. | 2020-03-03 |
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling
App 20200066641 - AYGUN; Kemal ; et al. | 2020-02-27 |
Side Mounted Interconnect Bridges
App 20190341349 - Hossain; MD Altaf ; et al. | 2019-11-07 |
Ground Via Clustering For Crosstalk Mitigation
App 20190333848 - QIAN; Zhiguo ; et al. | 2019-10-31 |
Enabling Long Interconnect Bridges
App 20190318993 - Mahajan; Ravindranath V. ; et al. | 2019-10-17 |
Coreless Package Architecture For Multi-chip Opto-electronics
App 20190317285 - LIFF; Shawna M. ; et al. | 2019-10-17 |
Package Substrates With Magnetic Build-up Layers
App 20190295936 - QIAN; ZHIGUO ; et al. | 2019-09-26 |
Integrated Circuit Package With Test Circuitry For Testing A Channel Between Dies
App 20190295953 - XIE; Mayue ; et al. | 2019-09-26 |
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contact
Grant 10,396,036 - Zhang , et al. A | 2019-08-27 |
Ground via clustering for crosstalk mitigation
Grant 10,396,022 - Qian , et al. A | 2019-08-27 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20190252322 - Braunisch; Henning ; et al. | 2019-08-15 |
Die Interconnect Structures And Methods
App 20190229058 - Qian; Zhiguo ; et al. | 2019-07-25 |
Bridge Die Design For High Bandwidth Memory Interface
App 20190229056 - Qian; Zhiguo ; et al. | 2019-07-25 |
Capacitive structures for crosstalk reduction
Grant 10,317,932 - Zhang , et al. | 2019-06-11 |
High Density Package Interconnects
App 20190172778 - GANESAN; Sanka ; et al. | 2019-06-06 |
Interconnect routing configurations and associated techniques
Grant 10,283,453 - Qian , et al. | 2019-05-07 |
High density package interconnects
Grant 10,204,851 - Ganesan , et al. Feb | 2019-02-12 |
Ground Plane Vertical Isolation Of, Ground Line Coaxial Isolation Of, And Impedance Tuning Of Horizontal Data Signal Transmission Lines Routed Through Package Devices
App 20180374804 - ZHANG; Yu Amos ; et al. | 2018-12-27 |
High Power Terahertz Impulse For Fault Isolation
App 20180335465 - Xie; Mayue ; et al. | 2018-11-22 |
Ground Plane Vertical Isolation Of, Ground Line Coaxial Isolation Of, And Impedance Tuning Of Horizontal Data Signal Transmission Lines Routed Through Package Devices
App 20180331036 - ZHANG; Yu Amos ; et al. | 2018-11-15 |
Rlink-ground Shielding Attachment Structures And Shadow Voiding For Data Signal Contacts Of Package Devices; Vertical Ground Shielding Structures And Shield Fencing Of Vertical Data Signal Interconnects Of Package Devices; And Ground Shielding For Electro Optical Module Connector Data Signal Contact
App 20180331043 - ZHANG; Yu Amos ; et al. | 2018-11-15 |
Ground Via Clustering For Crosstalk Mitigation
App 20180315688 - Qian; Zhiguo ; et al. | 2018-11-01 |
Coupled vias for channel cross-talk reduction
Grant 10,103,054 - Zhang , et al. October 16, 2 | 2018-10-16 |
Apparatus And Method For Classifying And Locating Electrical Faults In Circuitry
App 20180284185 - Xie; Mayue ; et al. | 2018-10-04 |
Apparatus and method for classifying and locating electrical faults in circuitry
Grant 10,088,518 - Xie , et al. October 2, 2 | 2018-10-02 |
Inorganic Interposer For Multi-chip Packaging
App 20180240788 - Sobieski; Daniel ; et al. | 2018-08-23 |
Interposer structures, semiconductor assembly and methods for forming interposer structures
Grant 10,056,528 - Qian , et al. August 21, 2 | 2018-08-21 |
Ground via clustering for crosstalk mitigation
Grant 10,026,682 - Qian , et al. July 17, 2 | 2018-07-17 |
High Density Package Interconnects
App 20180182696 - GANESAN; Sanka ; et al. | 2018-06-28 |
Bridge interconnect with air gap in package assembly
Grant 10,008,451 - Chiu , et al. June 26, 2 | 2018-06-26 |
High density package interconnects
Grant 9,922,916 - Ganesan , et al. March 20, 2 | 2018-03-20 |
Capacitive Structures For Crosstalk Reduction
App 20180007782 - ZHANG; ZHICHAO ; et al. | 2018-01-04 |
Non-uniform substrate stackup
Grant 9,806,011 - Zhang , et al. October 31, 2 | 2017-10-31 |
Non-uniform Substrate Stackup
App 20170221727 - Zhang; Zhichao ; et al. | 2017-08-03 |
Bridge Interconnect With Air Gap In Package Assembly
App 20170221828 - Chiu; Chia-Pin ; et al. | 2017-08-03 |
Ground Via Clustering For Crosstalk Mitigation
App 20170148714 - Qian; Zhiguo ; et al. | 2017-05-25 |
Routing design for high speed input/output links
Grant 9,622,339 - Qian , et al. April 11, 2 | 2017-04-11 |
Bridge interconnect with air gap in package assembly
Grant 9,589,866 - Chiu , et al. March 7, 2 | 2017-03-07 |
Interconnect Routing Configurations And Associated Techniques
App 20170040264 - Qian; Zhiguo ; et al. | 2017-02-09 |
Smart impedance matching for high-speed I/O
Grant 9,548,734 - Song , et al. January 17, 2 | 2017-01-17 |
Interconnect routing configurations and associated techniques
Grant 9,542,522 - Qian , et al. January 10, 2 | 2017-01-10 |
Ground via clustering for crosstalk mitigation
Grant 9,515,017 - Qian , et al. December 6, 2 | 2016-12-06 |
High Density Package Interconnects
App 20160284635 - GANESAN; Sanka ; et al. | 2016-09-29 |
Bridge Interconnect With Air Gap In Package Assembly
App 20160204049 - Chiu; Chia-Pin ; et al. | 2016-07-14 |
Ground Via Clustering For Crosstalk Mitigation
App 20160181189 - Qian; Zhiguo ; et al. | 2016-06-23 |
High density package interconnects
Grant 9,368,437 - Ganesan , et al. June 14, 2 | 2016-06-14 |
Non-uniform Substrate Stackup
App 20160104632 - Zhang; Zhichao ; et al. | 2016-04-14 |
Interconnect Routing Configurations And Associated Techniques
App 20160085899 - Qian; Zhiguo ; et al. | 2016-03-24 |
Bridge interconnect with air gap in package assembly
Grant 9,275,971 - Chiu , et al. March 1, 2 | 2016-03-01 |
X-line routing for dense multi-chip-package interconnects
Grant 9,240,377 - Qian , et al. January 19, 2 | 2016-01-19 |
Ground via clustering for crosstalk mitigation
Grant 9,230,900 - Qian , et al. January 5, 2 | 2016-01-05 |
Non-uniform substrate stackup
Grant 9,232,639 - Zhang , et al. January 5, 2 | 2016-01-05 |
X-line Routing For Dense Multi-chip-package Interconnects
App 20150102477 - Qian; Zhiguo ; et al. | 2015-04-16 |
X-line routing for dense multi-chip-package interconnects
Grant 8,946,900 - Qian , et al. February 3, 2 | 2015-02-03 |
Bridge Interconnect With Air Gap In Package Assembly
App 20150011050 - Chiu; Chia-Pin ; et al. | 2015-01-08 |
Bridge interconnect with air gap in package assembly
Grant 8,872,349 - Chiu , et al. October 28, 2 | 2014-10-28 |
Coupled Vias For Channel Cross-talk Reduction
App 20140268614 - ZHANG; Zhichao ; et al. | 2014-09-18 |
High Density Package Interconnects
App 20140217579 - Ganesan; Sanka ; et al. | 2014-08-07 |
Non-uniform Substrate Stackup
App 20140160707 - Zhang; Zhichao ; et al. | 2014-06-12 |
X-line Routing For Dense Multi-chip-package Interconnects
App 20140117552 - Qian; Zhiguo ; et al. | 2014-05-01 |
Bridge Interconnect With Air Gap In Package Assembly
App 20140070380 - Chiu; Chia-Pin ; et al. | 2014-03-13 |
Routing Design For High Speed Input/output Links
App 20140071646 - Qian; Zhiguo ; et al. | 2014-03-13 |
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