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Patent applications and USPTO patent grants for PYXIS CF PTE. LTD..The latest application filed is for "plating apparatus and operation method thereof".
Patent | Date |
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Panel level packaging for devices Grant 11,456,259 - Sen September 27, 2 | 2022-09-27 |
Plating Apparatus And Operation Method Thereof App 20220178044 - SEN; Amlan ;   et al. | 2022-06-09 |
Apparatus And Method For Bonding A Plurality Of Dies To A Carrier Panel App 20220102189 - CHEW; HWEE SENG ;   et al. | 2022-03-31 |
Plating apparatus and operation method thereof Grant 11,261,535 - Sen , et al. March 1, 2 | 2022-03-01 |
Precision Reconstruction For Panel-level Packaging App 20220028703 - Sen; Amlan ;   et al. | 2022-01-27 |
Automation line for processing a molded panel Grant 11,107,716 - Sen August 31, 2 | 2021-08-31 |
Automation Line For Processing A Molded Panel App 20210249290 - SEN; AMLAN | 2021-08-12 |
Post Bond Inspection Of Devices For Panel Packaging App 20210118841 - SEN; Amlan ;   et al. | 2021-04-22 |
Wetting Processing Apparatus And Operation Method Thereof App 20210111045 - SEN; Amlan ;   et al. | 2021-04-15 |
Panel Level Packaging For Devices App 20200312780 - Sen; Amlan | 2020-10-01 |
Compression Molding Machine And Method Of Compression Molding App 20200307037 - SEN; AMLAN | 2020-10-01 |
Plating Apparatus And Operation Method Thereof App 20200299854 - SEN; Amlan ;   et al. | 2020-09-24 |
Apparatus And Method For Semiconductor Device Bonding App 20200083193 - SEN; Amlan | 2020-03-12 |
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