Pymento; Larry G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pymento; Larry G..The latest application filed is for "method to improve strain rate control of small lead free printed circuit board assembly during in circuit test process".

Company Profile

0.9.9

Pymento; Larry G. - Cary NC
Pymento; Larry G - Cary NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Land grid array interconnect formed with discrete pads Grant 9,769,924 - Pymento , et al. September 19, 2	2017-09-19
Method to improve strain rate control of small lead free printed circuit board assembly during in circuit test process Grant 9,347,984 - Davis, Jr. , et al. May 24, 2	2016-05-24
Component rework nozzle Grant 9,302,277 - Davis, Jr. , et al. April 5, 2	2016-04-05
Dual side staggered surface mount dual in-line memory module Grant 9,265,152 - Pymento , et al. February 16, 2	2016-02-16
Method To Improve Strain Rate Control Of Small Lead Free Printed Circuit Board Assembly During In Circuit Test Process App 20160025804 - Davis, JR.; Willie T. ; et al.	2016-01-28
Dual Side Staggered Surface Mount Dual In-Line Memory Module App 20150173194 - Pymento; Larry G. ; et al.	2015-06-18
Land Grid Array Interconnect Formed With Discrete Pads App 20140326491 - Pymento; Larry G. ; et al.	2014-11-06
Method of forming a land grid array with discrete pads Grant 8,850,699 - Pymento , et al. October 7, 2	2014-10-07
Modified 0402 footprint for a printed circuit board (`PCB`) Grant 8,664,541 - Andresen , et al. March 4, 2	2014-03-04
Component Rework Nozzle App 20140001291 - Davis, JR.; Willie T. ; et al.	2014-01-02
Land Grid Array Interconnect Formed With Discrete Pads App 20130033833 - Pymento; Larry G. ; et al.	2013-02-07
Modified 0402 Footprint For A Printed Circuit Board ('PCB') App 20130025927 - Andresen; Mark E. ; et al.	2013-01-31

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