Puri; Puneesh
Patent Applications and Registrations
Patent applications and USPTO patent grants for Puri; Puneesh.The latest application filed is for "through-body via liner deposition".
- Puri; Puneesh - Bengaluru IN
- Puri; Puneesh - Aloha OR
| Patent | Date |
|---|---|
| Through-body via liner deposition Grant 9,748,180 - Puri , et al. August 29, 2 | 2017-08-29 |
| Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias Grant 9,716,066 - Lee , et al. July 25, 2 | 2017-07-25 |
| Through-body Via Liner Deposition App 20170018509 - PURI; PUNEESH ; et al. | 2017-01-19 |
| Interconnect Structure Comprising Fine Pitch Backside Metal Redistribution Lines Combined With Vias App 20160049371 - Lee; Kevin J. ; et al. | 2016-02-18 |
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