Punzalan; Jeffrey D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Punzalan; Jeffrey D..The latest application filed is for "semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection".

Company Profile

0.79.70

Punzalan; Jeffrey D. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection Grant 9,589,876 - Camacho , et al. March 7, 2	2017-03-07
Semiconductor device with bump interconnection Grant 9,129,971 - Camacho , et al. September 8, 2	2015-09-08
Integrated circuit package system with relief Grant 8,981,548 - Shim , et al. March 17, 2	2015-03-17
Integrated circuit packaging system with protective coating and method of manufacture thereof Grant 8,803,300 - Bathan , et al. August 12, 2	2014-08-12
Integrated circuit package system including wide flange leadframe Grant 8,698,294 - Camacho , et al. April 15, 2	2014-04-15
Integrated circuit package system with flex bump Grant 8,637,394 - Pisigan , et al. January 28, 2	2014-01-28
Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof Grant 8,633,062 - Punzalan , et al. January 21, 2	2014-01-21
Integrated circuit package system with laminate base Grant 8,633,578 - Camacho , et al. January 21, 2	2014-01-21
Padless die support integrated circuit package system Grant 8,629,537 - Camacho , et al. January 14, 2	2014-01-14
Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection App 20130341789 - Camacho; Zigmund R. ; et al.	2013-12-26
Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection Grant 8,546,189 - Camacho , et al. October 1, 2	2013-10-01
Packaging system with hollow package and method for the same Grant 8,493,748 - Camacho , et al. July 23, 2	2013-07-23
Non-leaded integrated circuit package system with multiple ground sites Grant 8,415,778 - Punzalan , et al. April 9, 2	2013-04-09
Non-leaded integrated circuit package system Grant 8,399,968 - Punzalan , et al. March 19, 2	2013-03-19
Integrated circuit package to package stacking system Grant 8,395,251 - Shim , et al. March 12, 2	2013-03-12
Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof Grant 8,362,601 - Camacho , et al. January 29, 2	2013-01-29
Integrated circuit package system with leads separated from a die paddle Grant 8,278,148 - Punzalan , et al. October 2, 2	2012-10-02
Integrated circuit package system with encapsulating features Grant 8,207,600 - Bathan , et al. June 26, 2	2012-06-26
Integrated circuit package system with flashless leads Grant 8,207,597 - Punzalan , et al. June 26, 2	2012-06-26
Integrated circuit package in package system with adhesiveless package attach Grant 8,203,214 - Bathan , et al. June 19, 2	2012-06-19
Integrated circuit package system with multiple device units and method for manufacturing thereof Grant 8,203,220 - Tay , et al. June 19, 2	2012-06-19
Integrated circuit package system with leadfinger Grant 8,148,825 - Camacho , et al. April 3, 2	2012-04-03
Integrated circuit package system with package encapsulation having recess Grant 8,129,827 - Camacho , et al. March 6, 2	2012-03-06
Integrated circuit package system with dual connectivity Grant 8,120,150 - Badakere Govindaiah , et al. February 21, 2	2012-02-21
Integrated circuit package system with die on base package Grant 8,120,156 - Camacho , et al. February 21, 2	2012-02-21
Integrated circuit package system Grant 8,120,149 - Camacho , et al. February 21, 2	2012-02-21
Non-leaded Integrated Circuit Package System With Multiple Ground Sites App 20110298108 - Punzalan; Jeffrey D. ; et al.	2011-12-08
Integrated Circuit Package System With Laminate Base App 20110284842 - Camacho; Zigmund Ramirez ; et al.	2011-11-24
Integrated circuit package system with ground bonds Grant 8,062,934 - Punzalan , et al. November 22, 2	2011-11-22
Integrated circuit package system with different mold locking features Grant 8,039,947 - Punzalan , et al. October 18, 2	2011-10-18
Large die package structures and fabrication method therefor Grant 8,035,204 - Punzalan , et al. October 11, 2	2011-10-11
Integrated circuit package system with leadfinger support Grant 8,022,514 - Bathan , et al. September 20, 2	2011-09-20
Integrated Circuit Packaging System Including Non-leaded Package App 20110204501 - Punzalan; Jeffrey D. ; et al.	2011-08-25
Non-leaded integrated circuit package system with multiple ground sites Grant 8,003,443 - Punzalan , et al. August 23, 2	2011-08-23
Integrated circuit package system with laminate base Grant 7,993,939 - Camacho , et al. August 9, 2	2011-08-09
Multiple flip-chip integrated circuit package system Grant 7,977,579 - Bathan , et al. July 12, 2	2011-07-12
Integrated circuit packaging system including a non-leaded package Grant 7,947,534 - Punzalan , et al. May 24, 2	2011-05-24
Semiconductor Device with Bump Interconnection App 20110101524 - Camacho; Zigmund R. ; et al.	2011-05-05
Integrated circuit package system with lead structures including a dummy tie bar Grant 7,936,053 - Punzalan , et al. May 3, 2	2011-05-03
Integrated circuit package system Grant 7,928,540 - Shim , et al. April 19, 2	2011-04-19
Integrated Circuit Packaging System With Protective Coating And Method Of Manufacture Thereof App 20110079888 - Bathan; Henry Descalzo ; et al.	2011-04-07
Integrated circuit package system with leadframe array Grant 7,915,716 - Pisigan , et al. March 29, 2	2011-03-29
Integrated circuit packaging system with base structure device Grant 7,915,724 - Ha , et al. March 29, 2	2011-03-29
Integrated circuit package system with interconnection support and method of manufacture thereof Grant 7,901,996 - Bathan , et al. March 8, 2	2011-03-08
Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die Grant 7,888,181 - Camacho , et al. February 15, 2	2011-02-15
Integrated circuit package system with multiple molding Grant 7,871,863 - Camacho , et al. January 18, 2	2011-01-18
Integrated circuit package-in-package system with leads Grant 7,868,471 - Camacho , et al. January 11, 2	2011-01-11
Integrated Circuit Package System With Integral Inner Lead And Paddle And Method Of Manufacture Thereof App 20100264529 - Punzalan; Jeffrey D. ; et al.	2010-10-21
Integrated Circuit Package System With Multiple Device Units And Method For Manufacturing Thereof App 20100244273 - Tay; Lionel Chien Hui ; et al.	2010-09-30
Integrated circuit package system with integral inner lead and paddle Grant 7,777,310 - Punzalan , et al. August 17, 2	2010-08-17
Integrated circuit package system with multiple device units Grant 7,759,806 - Tay , et al. July 20, 2	2010-07-20
Large Die Package Structures And Fabrication Method Therefor App 20100140766 - Punzalan; Jeffrey D. ; et al.	2010-06-10
Wire-on-lead Package System And Method Of Manufacture Thereof App 20100140764 - Camacho; Zigmund Ramirez ; et al.	2010-06-10
Large die package structures and fabrication method therefor Grant 7,700,404 - Punzalan , et al. April 20, 2	2010-04-20
Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection App 20100072599 - Camacho; Zigmund R. ; et al.	2010-03-25
Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection App 20100072618 - Camacho; Zigmund R. ; et al.	2010-03-25
Integrated circuit package system with ground ring Grant 7,671,463 - Camacho , et al. March 2, 2	2010-03-02
Integrated Circuit Package System With Interconnect Support App 20090250798 - Bathan; Henry D. ; et al.	2009-10-08
Integrated circuit package system with interconnect support Grant 7,563,647 - Bathan , et al. July 21, 2	2009-07-21
Integrated Circuit Package System With Leadfinger Support App 20090179314 - Bathan; Henry D. ; et al.	2009-07-16
Multi-leadframe semiconductor package and method of manufacture Grant 7,554,179 - Shim , et al. June 30, 2	2009-06-30
Integrated circuit package system with stiffener Grant 7,545,032 - Bathan , et al. June 9, 2	2009-06-09
Integrated circuit package system with leadfinger support Grant 7,541,221 - Bathan , et al. June 2, 2	2009-06-02
Integrated Circuit Packaging System With Base Structure Device App 20090085178 - Ha; Jong-Woo ; et al.	2009-04-02
Integrated Circuit Package System With Leadframe Array App 20090085177 - Pisigan; Jairus Legaspi ; et al.	2009-04-02
Integrated Circuit Package System With Multiple Device Units App 20090079096 - Tay; Lionel Chien ; et al.	2009-03-26
Integrated Circuit Package System With Package Encapsulation Having Recess App 20090072412 - Camacho; Zigmund Ramirez ; et al.	2009-03-19
Integrated Circuit Package-in-package System With Leads App 20090072363 - Camacho; Zigmund Ramirez ; et al.	2009-03-19
Integrated Circuit Package System With Dual Connectivity App 20090072366 - Badakere Govindaiah; Guruprasad ; et al.	2009-03-19
Integrated Circuit Package System With Leads Separated From A Die Paddle App 20090072364 - Punzalan; Jeffrey D. ; et al.	2009-03-19
Integrated circuit leadless package system Grant 7,498,665 - Alabin , et al. March 3, 2	2009-03-03
Integrated circuit package with elevated edge leadframe Grant 7,479,409 - Camacho , et al. January 20, 2	2009-01-20
Integrated circuit package system with heat sink Grant 7,479,692 - Dimaano, Jr. , et al. January 20, 2	2009-01-20
Integrated Circuit Package System With Multiple Molding App 20090014849 - Camacho; Zigmund Ramirez ; et al.	2009-01-15
Integrated Circuit Package System With Flex Bump App 20090008761 - Pisigan; Jairus Legaspi ; et al.	2009-01-08
Packaging System With Hollow Package App 20090002961 - Camacho; Zigmund Ramirez ; et al.	2009-01-01
Integrated Circuit Package In Package System With Adhesiveless Package Attach App 20090001563 - Bathan; Henry Descalzo ; et al.	2009-01-01
Integrated Circuit Package System With Leadfinger App 20080303123 - Camacho; Zigmund Ramirez ; et al.	2008-12-11
Integrated Circuit Package System With Relief App 20080290485 - Shim; Il Kwon ; et al.	2008-11-27
Integrated circuit package system with multiple molding Grant 7,449,369 - Camacho , et al. November 11, 2	2008-11-11
Integrated circuit package system with downset lead Grant 7,443,015 - Punzalan , et al. October 28, 2	2008-10-28
Stacked Integrated Circuit Package System App 20080251901 - Camacho; Zigmund Ramirez ; et al.	2008-10-16
Integrated Circuit Package System With Encapsulating Features App 20080237816 - Bathan; Henry Descalzo ; et al.	2008-10-02
Integrated circuit package system with integrated circuit support Grant 7,420,265 - Bathan , et al. September 2, 2	2008-09-02
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor Grant 7,413,933 - Punzalan , et al. August 19, 2	2008-08-19
Integrated Circuit Package System With Integral Inner Lead And Paddle App 20080185693 - Punzalan; Jeffrey D. ; et al.	2008-08-07
Integrated circuit package system with heat sink Grant 7,400,049 - Shim , et al. July 15, 2	2008-07-15
Integrated Circuit Package With Elevated Edge Leadframe App 20080142934 - Camacho; Zigmund Ramirez ; et al.	2008-06-19
Integrated Circuit Package System With Heat Sink App 20080111217 - Dimaano; Antonio B. ; et al.	2008-05-15
Integrated Circuit Package System App 20080111215 - Shim; Il Kwon ; et al.	2008-05-15
Overhang integrated circuit package system Grant 7,365,417 - Camacho , et al. April 29, 2	2008-04-29
Dual row leadframe and fabrication method Grant 7,339,258 - Punzalan , et al. March 4, 2	2008-03-04
Integrated Circuit Package System With Laminate Base App 20080017960 - Camacho; Zigmund Ramirez ; et al.	2008-01-24
Integrated Circuit Package System With Flashless Leads App 20080012100 - Punzalan; Jeffrey D. ; et al.	2008-01-17
Integrated Circuit Package System With Stiffener App 20080006926 - Bathan; Henry D. ; et al.	2008-01-10
Integrated Circuit Package System With Ground Bonds App 20080006929 - Punzalan; Jeffrey D. ; et al.	2008-01-10
Integrated Circuit Package System With Different Mold Locking Features App 20070267731 - Punzalan; Jeffrey D. ; et al.	2007-11-22
Large die package and method for the fabrication thereof Grant 7,298,026 - Shim , et al. November 20, 2	2007-11-20
Integrated Circuit Package System With Ground Ring App 20070235854 - Camacho; Zigmund Ramirez ; et al.	2007-10-11
Multiple Flip-chip Integrated Circuit Package System App 20070235215 - Bathan; Henry D. ; et al.	2007-10-11
Integrated circuit package system with adhesive restraint Grant 7,274,089 - Punzalan , et al. September 25, 2	2007-09-25
Non-leaded Integrated Circuit Package System With Multiple Ground Sites App 20070212903 - Punzalan; Jeffrey D. ; et al.	2007-09-13
Integrated Circuit Package System With Die On Base Package App 20070194424 - Camacho; Zigmund Ramirez ; et al.	2007-08-23
Integrated Circuit Package System With Heat Sink App 20070187839 - Shim; Il Kwon ; et al.	2007-08-16
Integrated Circuit Package With Leadframe Locked Encapsulation And Method Of Manufacture Therefor App 20070190694 - Punzalan; Jeffrey D. ; et al.	2007-08-16
Integrated Circuit Packaging System Including A Non-leaded Package App 20070182024 - Punzalan; Jeffrey D. ; et al.	2007-08-09
Integrated Circuit Package System With Leadfinger Support App 20070181982 - Bathan; Henry D. ; et al.	2007-08-09
Integrated Circuit Package System Having Die-attach Pad With Elevated Bondline Thickness App 20070176271 - Trasporto; Arnel ; et al.	2007-08-02
Integrated Circuit Package System Including Wide Flange Leadframe App 20070170570 - Camacho; Zigmund Ramirez ; et al.	2007-07-26
Integrated circuit package system with multiple molding App 20070170554 - Camacho; Zigmund Ramirez ; et al.	2007-07-26
Stacked Integrated Circuit Package System App 20070170558 - Camacho; Zigmund Ramirez ; et al.	2007-07-26
Padless die support integrated circuit package system App 20070170555 - Camacho; Zigmund Ramirez ; et al.	2007-07-26
Integrated Circuit Package System App 20070170559 - Camacho; Zigmund Ramirez ; et al.	2007-07-26
Overhang Integrated Circuit Package System App 20070158792 - Camacho; Zigmund Ramirez ; et al.	2007-07-12
Integrated Circuit Package System Configured For Singulation App 20070114645 - Punzalan; Jeffrey D. ; et al.	2007-05-24
Non-leaded Integrated Circuit Package System App 20070114650 - Punzalan; Jeffrey D. ; et al.	2007-05-24
Integrated Circuit Package To Package Stacking System App 20070108568 - Shim; Il Kwon ; et al.	2007-05-17
Integrated Circuit Package System With Interconnect Support App 20070108569 - Bathan; Henry D. ; et al.	2007-05-17
Integrated Circuit Package System With Downset Lead App 20070108624 - Punzalan; Jeffrey D. ; et al.	2007-05-17
Integrated Circuit Package System With Integrated Circuit Support App 20070108559 - Bathan; Henry D. ; et al.	2007-05-17
Integrated Circuit Leadless Package System App 20070108567 - Alabin; Leocadio M. ; et al.	2007-05-17
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor Grant 7,217,599 - Punzalan , et al. May 15, 2	2007-05-15
Integrated Circuit Package System With Adhesive Restraint App 20070063320 - Punzalan; Jeffrey D. ; et al.	2007-03-22
Large Die Package Structures And Fabrication Method Therefor App 20070018290 - Punzalan; Jeffrey D. ; et al.	2007-01-25
Large die package and method for the fabrication thereof App 20060249830 - Shim; Il Kwon ; et al.	2006-11-09
Large die package structures and fabrication method therefor Grant 7,129,569 - Punzalan , et al. October 31, 2	2006-10-31
Dual Row Leadframe And Fabrication Method App 20060186515 - Punzalan; Jeffrey D. ; et al.	2006-08-24
Multi-leadframe semiconductor package and method of manufacture App 20060175689 - Shim; Il Kwon ; et al.	2006-08-10
Dual row leadframe and fabrication method Grant 7,060,536 - Punzalan , et al. June 13, 2	2006-06-13
Dual row leadframe and fabrication method App 20050260787 - Punzalan, Jeffrey D. ; et al.	2005-11-24
Large die package structures and fabrication method therefor App 20050253230 - Punzalan, Jeffrey D. ; et al.	2005-11-17
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor App 20040253763 - Punzalan, Jeffrey D. ; et al.	2004-12-16
Ground plane for exposed package App 20040070055 - Punzalan, Jeffrey D. ; et al.	2004-04-15
Ground plane for exposed package Grant 6,630,373 - Punzalan , et al. October 7, 2	2003-10-07
Ground Plane For Exposed Package App 20030160309 - Punzalan, Jeffrey D. ; et al.	2003-08-28