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Patent applications and USPTO patent grants for Pun; Tai Wai.The latest application filed is for "method of manufacturing enhanced thermal dissipation integrated circuit package".
Patent | Date |
---|---|
Solar cell module on molded lead-frame and method of manufacture Grant 9,178,093 - Tam , et al. November 3, 2 | 2015-11-03 |
Method of manufacturing enhanced thermal dissipation integrated circuit package App 20060223237 - Combs; Edward G. ;   et al. | 2006-10-05 |
Method of manufacturing an enhanced thermal dissipation integrated circuit package Grant 7,015,072 - Combs , et al. March 21, 2 | 2006-03-21 |
Method of manufacturing an enhanced thermal dissipation integrated circuit package App 20050003585 - Combs, Edward G. ;   et al. | 2005-01-06 |
Enhanced thermal dissipation integrated circuit package Grant 6,734,552 - Combs , et al. May 11, 2 | 2004-05-11 |
Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package App 20030011064 - Combs, Edward G. ;   et al. | 2003-01-16 |
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