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Patent applications and USPTO patent grants for Pugliese, Jr.; Roberto A.The latest application filed is for "atomic layer deposition passivation for via".
Patent | Date |
---|---|
Atomic layer deposition passivation for via Grant 10,232,613 - Chen , et al. | 2019-03-19 |
Atomic Layer Deposition Passivation For Via App 20170368823 - Chen; Zhizhang ;   et al. | 2017-12-28 |
Protecting a fluid ejection device resistor Grant 8,727,499 - Pugliese, Jr. , et al. May 20, 2 | 2014-05-20 |
Protecting A Fluid Ejection Device Resistor App 20130162724 - Pugliese, JR.; Roberto A. ;   et al. | 2013-06-27 |
Method of forming a slotted substrate with partially patterned layers Grant 7,594,328 - Pugliese, Jr. , et al. September 29, 2 | 2009-09-29 |
Thin film coating of a slotted substrate and techniques for forming slotted substrates Grant 6,945,634 - Pugliese, Jr. , et al. September 20, 2 | 2005-09-20 |
Methods and systems for forming slots in a substrate Grant 6,911,155 - Miller , et al. June 28, 2 | 2005-06-28 |
Droplet plate architecture Grant 6,837,572 - Ramaswami , et al. January 4, 2 | 2005-01-04 |
Droplet plate architecture Grant 6,682,874 - Ramaswami , et al. January 27, 2 | 2004-01-27 |
Thin film coating of a slotted substrate and techniques for forming slotted substrates Grant 6,648,732 - Pugliese, Jr. , et al. November 18, 2 | 2003-11-18 |
Droplet plate architecture in ink-jet printheads Grant 6,482,574 - Ramaswami , et al. November 19, 2 | 2002-11-19 |
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