| Patent | Date |
|---|
Integrated fan-out packaging
Grant 11,437,327 - Pu , et al. September 6, 2 | 2022-09-06 |
Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same
Grant 11,424,197 - Wang , et al. August 23, 2 | 2022-08-23 |
Package structure and manufacturing method thereof
Grant 11,417,616 - Wu , et al. August 16, 2 | 2022-08-16 |
Package Structure And Manufacturing Method Thereof
App 20220254722 - Yu; Chen-Hua ; et al. | 2022-08-11 |
Memory Device And Manufacturing Method Thereof
App 20220246578 - Huang; Ching-Yu ; et al. | 2022-08-04 |
Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof
Grant 11,342,269 - Yu , et al. May 24, 2 | 2022-05-24 |
Memory device and manufacturing method thereof
Grant 11,335,666 - Huang , et al. May 17, 2 | 2022-05-17 |
Integrated fan-out package and manufacturing method thereof
Grant 11,282,810 - Wan , et al. March 22, 2 | 2022-03-22 |
Semiconductor device package including embedded conductive elements
Grant 11,282,817 - Chen , et al. March 22, 2 | 2022-03-22 |
Package structure and manufacturing method thereof
Grant 11,244,896 - Hsiao , et al. February 8, 2 | 2022-02-08 |
Memory Device And Manufacturing Method Thereof
App 20220013494 - Huang; Ching-Yu ; et al. | 2022-01-13 |
Semiconductor packages and methods of forming same
Grant 11,189,603 - Yu , et al. November 30, 2 | 2021-11-30 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20210351126 - Huang; Ching-Yu ; et al. | 2021-11-11 |
Integrated fan-out package with antenna components and manufacturing method thereof
Grant 11,145,595 - Lu , et al. October 12, 2 | 2021-10-12 |
Package structure and method of manufacturing the same
Grant 11,127,708 - Liu , et al. September 21, 2 | 2021-09-21 |
Integrated fan-out packages and methods of forming the same
Grant 11,075,159 - Huang , et al. July 27, 2 | 2021-07-27 |
Memory Device And Manufacturing Method Thereof
App 20210202354 - Chuang; Lipu Kris ; et al. | 2021-07-01 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20210183760 - Shih; Chao-Wen ; et al. | 2021-06-17 |
Semiconductor Package And Manufacturing Method Thereof
App 20210184335 - Wang; Yen-Ping ; et al. | 2021-06-17 |
Semiconductor package structure
Grant 11,004,810 - Wu , et al. May 11, 2 | 2021-05-11 |
Integrated Fan-out Packaging
App 20210098385 - Pu; Han-Ping ; et al. | 2021-04-01 |
Conductive traces in semiconductor devices and methods of forming same
Grant 10,937,734 - Shih , et al. March 2, 2 | 2021-03-02 |
Package Structure And Manufacturing Method Thereof
App 20210013151 - Yu; Chen-Hua ; et al. | 2021-01-14 |
Package structure and method of fabricating package structure
Grant 10,879,197 - Wan , et al. December 29, 2 | 2020-12-29 |
Semiconductor package and manufacturing method thereof
Grant 10,879,170 - Chiang , et al. December 29, 2 | 2020-12-29 |
Semiconductor device and manufacturing method thereof
Grant 10,872,842 - Wan , et al. December 22, 2 | 2020-12-22 |
Integrated fan-out packaging
Grant 10,867,930 - Pu , et al. December 15, 2 | 2020-12-15 |
Semiconductor package, semiconductor device and method for packaging semiconductor device
Grant 10,867,882 - Wan , et al. December 15, 2 | 2020-12-15 |
Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same
Grant 10,825,773 - Yu , et al. November 3, 2 | 2020-11-03 |
Package Structure And Manufacturing Method Thereof
App 20200343203 - Wu; Kai-Chiang ; et al. | 2020-10-29 |
Semiconductor Package And Manufacturing Method Thereof
App 20200335439 - Chiang; Yung-Ping ; et al. | 2020-10-22 |
Semiconductor Device Having Antenna And Manufacturing Method Thereof
App 20200335459 - Wan; Albert ; et al. | 2020-10-22 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20200335477 - Wan; Albert ; et al. | 2020-10-22 |
Semiconductor Device And Manufacturing Method Thereof
App 20200273773 - Wan; Albert ; et al. | 2020-08-27 |
Method of manufacturing integrated fan-out package
Grant 10,756,052 - Wan , et al. A | 2020-08-25 |
Package structure and manufacturing method thereof
Grant 10,748,861 - Wu , et al. A | 2020-08-18 |
Semiconductor device having antenna and manufacturing method thereof
Grant 10,741,508 - Wan , et al. A | 2020-08-11 |
Package Structure And Manufacturing Method Thereof
App 20200243441 - Hsiao; Min-Chien ; et al. | 2020-07-30 |
Semiconductor Device Package Including Embedded Conductive Elements
App 20200168583 - CHEN; Yu-Feng ; et al. | 2020-05-28 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20200152570 - Lu; Chun-Lin ; et al. | 2020-05-14 |
Semiconductor device and method
Grant 10,629,540 - Yu , et al. | 2020-04-21 |
Semiconductor Package Structure
App 20200118952 - Wu; Kai-Chiang ; et al. | 2020-04-16 |
Package Structure And Manufacturing Method Thereof
App 20200105675 - Yu; Chen-Hua ; et al. | 2020-04-02 |
Semiconductor Package, Semiconductor Device And Method For Packaging Semiconductor Device
App 20200091031 - Wan; Albert ; et al. | 2020-03-19 |
Package Structure And Method Of Manufacturing The Same
App 20200075526 - Liu; Ming-Kai ; et al. | 2020-03-05 |
Integrated fan-out package and manufacturing method thereof
Grant 10,553,533 - Lu , et al. Fe | 2020-02-04 |
Mechanisms of forming connectors for package on package
Grant 10,553,561 - Chen , et al. Fe | 2020-02-04 |
Package, Package Structure And Method Of Manufacturing The Same
App 20200035625 - Wang; Chuei-Tang ; et al. | 2020-01-30 |
Semiconductor Device and Method
App 20200027838 - Yu; Chen-Hua ; et al. | 2020-01-23 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20200020628 - Huang; Ching-Yu ; et al. | 2020-01-16 |
Semiconductor packages and methods of forming same
Grant 10,529,698 - Yu , et al. J | 2020-01-07 |
Semiconductor package structure
Grant 10,510,693 - Wu , et al. Dec | 2019-12-17 |
Package structure and method of manufacturing the same
Grant 10,504,865 - Liu , et al. Dec | 2019-12-10 |
Packaging of semiconductor device with antenna and heat spreader
Grant 10,490,479 - Wan , et al. Nov | 2019-11-26 |
Package Structure And Manufacturing Method Thereof
App 20190355679 - Wu; Kai-Chiang ; et al. | 2019-11-21 |
Method Of Manufacturing Integrated Fan-out Package
App 20190355694 - Wan; Albert ; et al. | 2019-11-21 |
Semiconductor Device And Manufacturing Method Thereof
App 20190333877 - Wan; Albert ; et al. | 2019-10-31 |
Package structure having connecting module
Grant 10,381,309 - Wang , et al. A | 2019-08-13 |
Integrated Fan-out Packaging
App 20190237405 - PU; Han-Ping ; et al. | 2019-08-01 |
Method of manufacturing integrated fan-out package
Grant 10,366,966 - Wan , et al. July 30, 2 | 2019-07-30 |
Pre-applying supporting materials between bonded package components
Grant 10,366,971 - Hsu , et al. July 30, 2 | 2019-07-30 |
Package Structures
App 20190157206 - Wang; Chuei-Tang ; et al. | 2019-05-23 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20190139890 - Lu; Chun-Lin ; et al. | 2019-05-09 |
Integrated fan-out packaging
Grant 10,269,720 - Pu , et al. | 2019-04-23 |
Semiconductor device and semiconductor package
Grant 10,256,203 - Chuang , et al. | 2019-04-09 |
Semiconductor Device and Method
App 20190096817 - Yu; Chen-Hua ; et al. | 2019-03-28 |
Semiconductor Package Structure
App 20190096828 - Wu; Kai-Chiang ; et al. | 2019-03-28 |
Package Structure And Method Of Manufacturing The Same
App 20190096841 - Liu; Ming-Kai ; et al. | 2019-03-28 |
Semiconductor Packages and Methods of Forming Same
App 20190096862 - Yu; Chen-Hua ; et al. | 2019-03-28 |
Package Structure And Method Of Fabricating Package Structure
App 20190067220 - Wan; Albert ; et al. | 2019-02-28 |
Semicondcutor Device And Semicondcutor Package
App 20190035752 - Chuang; Lipu Kris ; et al. | 2019-01-31 |
Semiconductor device structure
Grant 10,157,859 - Chang , et al. Dec | 2018-12-18 |
Semiconductor Packages And Methods Of Forming Same
App 20180269188 - Yu; Chen-Hua ; et al. | 2018-09-20 |
Integrated Fan-out Packaging
App 20180145032 - PU; Han-Ping ; et al. | 2018-05-24 |
Mechanisms for forming fine-pitch copper bump structures
Grant 9,978,656 - Lin , et al. May 22, 2 | 2018-05-22 |
Semiconductor Device Structure
App 20180130756 - CHANG; Shou-Zen ; et al. | 2018-05-10 |
On-chip electromagnetic bandgap (EBG) structure for noise suppression
Grant 9,899,982 - Tsai , et al. February 20, 2 | 2018-02-20 |
Semiconductor device structure and method for forming the same
Grant 9,875,972 - Chang , et al. January 23, 2 | 2018-01-23 |
Semiconductor Device Structure And Method For Forming The Same
App 20180019209 - CHANG; Shou-Zen ; et al. | 2018-01-18 |
Method of forming 3D integrated circuit package with panel type lid
Grant 9,859,266 - Wang , et al. January 2, 2 | 2018-01-02 |
Seal rings structures in semiconductor device interconnect layers and methods of forming the same
Grant 9,780,046 - Pan , et al. October 3, 2 | 2017-10-03 |
Conductive Traces In Semiconductor Devices And Methods Of Forming Same
App 20170250130 - Shih; Chao-Wen ; et al. | 2017-08-31 |
Packages with molding material forming steps
Grant 9,673,184 - Hsu , et al. June 6, 2 | 2017-06-06 |
Semiconductor device
Grant 9,666,530 - Chen , et al. May 30, 2 | 2017-05-30 |
On-chip Electromagnetic Bandgap (ebg) Structure For Noise Suppression
App 20170149404 - Tsai; Ming Hsien ; et al. | 2017-05-25 |
Seal Rings Structures In Semiconductor Device Interconnect Layers And Methods Of Forming The Same
App 20170141052 - Pan; Hsin-Yu ; et al. | 2017-05-18 |
Conductive traces in semiconductor devices and methods of forming same
Grant 9,653,406 - Shih , et al. May 16, 2 | 2017-05-16 |
Protecting flip-chip package using pre-applied fillet
Grant 9,620,414 - Tsai , et al. April 11, 2 | 2017-04-11 |
Method Of Forming 3D Integrated Circuit Package With Panel Type Lid
App 20170077078 - Wang; Tsung-Ding ; et al. | 2017-03-16 |
Bumps for chip scale packaging including under bump metal structures with different diameters
Grant 9,553,065 - Lin , et al. January 24, 2 | 2017-01-24 |
Mechanisms Of Forming Connectors For Package On Package
App 20160343691 - CHEN; Yu-Feng ; et al. | 2016-11-24 |
Stress compensation layer for 3D packaging
Grant 9,502,360 - Lin , et al. November 22, 2 | 2016-11-22 |
3D integrated circuit package processing with panel type lid
Grant 9,502,383 - Wang , et al. November 22, 2 | 2016-11-22 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20160307852 - Shih; Chao-Wen ; et al. | 2016-10-20 |
Copper-containing layer on under-bump metallization layer
Grant 9,472,524 - Chen , et al. October 18, 2 | 2016-10-18 |
Mechanisms for forming connectors with a molding compound for package on package
Grant 9,418,947 - Chen , et al. August 16, 2 | 2016-08-16 |
Zero stand-off bonding system and method
Grant 9,418,956 - Lin , et al. August 16, 2 | 2016-08-16 |
Package structure and method of forming the same
Grant 9,406,634 - Shieh , et al. August 2, 2 | 2016-08-02 |
Pre-Applying Supporting Materials Between Bonded Package Components
App 20160172348 - Hsu; Yu-Chen ; et al. | 2016-06-16 |
Package-on-package structure
Grant 9,355,928 - Chen , et al. May 31, 2 | 2016-05-31 |
Pre-applying supporting materials between bonded package components
Grant 9,293,404 - Hsu , et al. March 22, 2 | 2016-03-22 |
Copper-containing Layer On Under-bump Metallization Layer
App 20160020186 - CHEN; Yu-Feng ; et al. | 2016-01-21 |
Zero Stand-Off Bonding System and Method
App 20150303161 - Lin; Chun-Hung ; et al. | 2015-10-22 |
Crack stopper on under-bump metallization layer
Grant 9,159,686 - Chen , et al. October 13, 2 | 2015-10-13 |
Protecting Flip-Chip Package using Pre-Applied Fillet
App 20150287640 - Tsai; Tsung-Fu ; et al. | 2015-10-08 |
3d Integrated Circuit Package Processing With Panel Type Lid
App 20150262973 - Wang; Tsung-Ding ; et al. | 2015-09-17 |
Package Structure And Method Of Forming The Same
App 20150243622 - SHIEH; Yuh Chern ; et al. | 2015-08-27 |
Zero stand-off bonding system and method
Grant 9,064,880 - Lin , et al. June 23, 2 | 2015-06-23 |
Protecting flip-chip package using pre-applied fillet
Grant 9,064,881 - Tsai , et al. June 23, 2 | 2015-06-23 |
Packages with Molding Material Forming Steps
App 20150147847 - Hsu; Yu-Chen ; et al. | 2015-05-28 |
Bump-on-trace (BOT) structures
Grant 9,041,223 - Shieh , et al. May 26, 2 | 2015-05-26 |
Extending metal traces in bump-on-trace structures
Grant 8,970,033 - Chen , et al. March 3, 2 | 2015-03-03 |
Packages with molding material forming steps
Grant 8,970,024 - Hsu , et al. March 3, 2 | 2015-03-03 |
Die carrier for package on package assembly
Grant 8,927,333 - Lin , et al. January 6, 2 | 2015-01-06 |
Package-on-Package Structure
App 20140264849 - Chen; Yu-Feng ; et al. | 2014-09-18 |
Packages with Molding Material Forming Steps
App 20140264810 - Hsu; Yu-Chen ; et al. | 2014-09-18 |
Pre-Applying Supporting Materials between Bonded Package Components
App 20140203456 - Hsu; Yu-Chen ; et al. | 2014-07-24 |
Bumps for Chip Scale Packaging
App 20140191394 - Lin; Chun-Hung ; et al. | 2014-07-10 |
Zero Stand-Off Bonding System and Method
App 20140183746 - Lin; Chun-Hung ; et al. | 2014-07-03 |
Wafer level package structure and fabrication methods
Grant 8,759,964 - Pu , et al. June 24, 2 | 2014-06-24 |
Methods and apparatus for package on package devices with reduced strain
Grant 8,680,663 - Chen , et al. March 25, 2 | 2014-03-25 |
Methods and Apparatus for bump-on-trace Chip Packaging
App 20130277828 - Huang; Chang-Chia ; et al. | 2013-10-24 |
Mechanisms Of Forming Connectors For Package On Package
App 20130221522 - CHEN; Yu-Feng ; et al. | 2013-08-29 |
Crack Stopper On Under-bump Metallization Layer
App 20130187277 - Chen; Yu-Feng ; et al. | 2013-07-25 |
Stress Compensation Layer for 3D Packaging
App 20130175705 - Lin; Chun-Hung ; et al. | 2013-07-11 |
Methods and Apparatus for Package On Package Devices with Reduced Strain
App 20130168855 - Chen; Yu-Feng ; et al. | 2013-07-04 |
Mechanisms For Forming Fine-pitch Copper Bump Structures
App 20130127045 - LIN; Tsung-Shu ; et al. | 2013-05-23 |
Die Carrier For Package On Package Assembly
App 20130127040 - Lin; Tsung-Shu ; et al. | 2013-05-23 |
Bumps for Chip Scale Packaging
App 20130119532 - Lin; Chun-Hung ; et al. | 2013-05-16 |
Fabrication method of leadframe-based semiconductor package
Grant 8,420,452 - Pu , et al. April 16, 2 | 2013-04-16 |
Method for fabricating stack structure of semiconductor packages
Grant 8,420,521 - Tsai , et al. April 16, 2 | 2013-04-16 |
Method and system of testing a semiconductor device
Grant 8,400,178 - Pu , et al. March 19, 2 | 2013-03-19 |
Wafer level chip scale package with reduced stress on solder balls
Grant 8,373,282 - Chen , et al. February 12, 2 | 2013-02-12 |
Bump-on-trace (bot) Structures
App 20130001778 - SHIEH; Yuh Chern ; et al. | 2013-01-03 |
Wafer Level Chip Scale Package with Reduced Stress on Solder Balls
App 20120319270 - Chen; Yu-Feng ; et al. | 2012-12-20 |
Thermally Enhanced Integrated Circuit Package
App 20120306067 - Tsao; Pei-Haw ; et al. | 2012-12-06 |
Reduced-stress Bump-on-trace (bot) Structures
App 20120273934 - SHIEH; Yuh Chern ; et al. | 2012-11-01 |
Reduced-stress bump-on-trace (BOT) structures
Grant 8,288,871 - Shieh , et al. October 16, 2 | 2012-10-16 |
Extending Metal Traces in Bump-on-Trace Structures
App 20120217632 - Chen; Yu-Feng ; et al. | 2012-08-30 |
Method of fabricating stacked semiconductor structure
Grant 8,183,092 - Huang , et al. May 22, 2 | 2012-05-22 |
Protecting Flip-Chip Package using Pre-Applied Fillet
App 20120119354 - Tsai; Tsung-Fu ; et al. | 2012-05-17 |
Leadframe-based Semiconductor Package And Fabrication Method Thereof
App 20110300671 - PU; Han-Ping ; et al. | 2011-12-08 |
Method for fabricating chip scale package structure with metal pads exposed from an encapsulant
Grant 8,058,100 - Pu , et al. November 15, 2 | 2011-11-15 |
Semiconductor package fabrication method
Grant 7,993,967 - Jiang , et al. August 9, 2 | 2011-08-09 |
Enhanced copper posts for wafer level chip scale packaging
Grant 7,932,601 - Chang , et al. April 26, 2 | 2011-04-26 |
Method For Fabricating Stack Structure Of Semiconductor Packages
App 20110070697 - Tsai; Fang-Lin ; et al. | 2011-03-24 |
Enhanced Copper Posts for Wafer Level Chip Scale Packaging
App 20110057313 - Chang; Kuo-Chin ; et al. | 2011-03-10 |
Semiconductor device and fabrication methods thereof
Grant 7,888,236 - Pu , et al. February 15, 2 | 2011-02-15 |
Method of semiconductor packaging
Grant 7,871,860 - Pu , et al. January 18, 2 | 2011-01-18 |
Stack structure of semiconductor packages and method for fabricating the stack structure
Grant 7,855,443 - Tsai , et al. December 21, 2 | 2010-12-21 |
Method And System Of Testing A Semiconductor Device
App 20100278211 - Pu; Han-Ping ; et al. | 2010-11-04 |
Enhanced copper posts for wafer level chip scale packaging
Grant 7,820,543 - Chang , et al. October 26, 2 | 2010-10-26 |
Method Of Fabricating Stacked Semiconductor Structure
App 20100267202 - Huang; Chien-Ping ; et al. | 2010-10-21 |
Method For Fabricating Chip Scale Package Structure With Metal Pads Exposed From An Encapsulant
App 20100233855 - Pu; Han-Ping ; et al. | 2010-09-16 |
Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
Grant 7,781,264 - Wu , et al. August 24, 2 | 2010-08-24 |
Stacked semiconductor structure and fabrication method thereof
Grant 7,772,685 - Huang , et al. August 10, 2 | 2010-08-10 |
Fabrication method of semiconductor package having heat dissipation device
Grant 7,759,170 - Pu , et al. July 20, 2 | 2010-07-20 |
Chip scale package structure with metal pads exposed from an encapsulant
Grant 7,750,467 - Pu , et al. July 6, 2 | 2010-07-06 |
Fabrication Method Of Semiconductor Package Having Heat Dissipation Device
App 20100151631 - Pu; Han-Ping ; et al. | 2010-06-17 |
Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof
Grant 7,679,178 - Pu , et al. March 16, 2 | 2010-03-16 |
Semiconductor Package And Fabrication Method Thereof
App 20100052146 - Jiang; Yih-Jenn ; et al. | 2010-03-04 |
Semiconductor package having heat dissipating device with cooling fluid
Grant 7,671,466 - Pu , et al. March 2, 2 | 2010-03-02 |
Fabrication method of semiconductor package
Grant 7,666,716 - Pu , et al. February 23, 2 | 2010-02-23 |
Semiconductor package and fabrication method thereof
Grant 7,638,879 - Jiang , et al. December 29, 2 | 2009-12-29 |
Fabrication Method Of Semiconductor Package
App 20090146285 - Pu; Han-Ping ; et al. | 2009-06-11 |
Semiconductor package and method for fabricating the same
App 20090096115 - Huang; Chien-Ping ; et al. | 2009-04-16 |
Semiconductor package and fabrication method thereof
Grant 7,489,044 - Pu , et al. February 10, 2 | 2009-02-10 |
Semiconductor device package with a heat sink and method for fabricating the same
Grant 7,485,496 - Chien , et al. February 3, 2 | 2009-02-03 |
Wafer Level package Structure and Fabrication Methods
App 20090020864 - Pu; Han-Ping ; et al. | 2009-01-22 |
Enhanced copper posts for wafer level chip scale packaging
App 20080296764 - Chang; Kuo-Chin ; et al. | 2008-12-04 |
Semiconductor device and fabrication methods thereof
App 20080286938 - Pu; Han-Ping ; et al. | 2008-11-20 |
Leadframe-based semiconductor package and fabrication method thereof
App 20080224283 - Pu; Han-Ping ; et al. | 2008-09-18 |
Chip scale package structure and method for fabricating the same
App 20080138935 - Pu; Han-Ping ; et al. | 2008-06-12 |
Semiconductor package and fabrication method thereof
App 20080116580 - Jiang; Yih-Jenn ; et al. | 2008-05-22 |
Semiconductor package and fabrication method thereof
App 20080012111 - Pu; Han-Ping ; et al. | 2008-01-17 |
Heat dissipating structure and method for fabricating the same
App 20070296079 - Huang; Chien-Ping ; et al. | 2007-12-27 |
Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
App 20070284710 - Wu; Chi-Chuan ; et al. | 2007-12-13 |
Method for fabricating multi-chip semiconductor package
App 20070249094 - Pu; Han-Ping | 2007-10-25 |
Stack structure of semiconductor packages and method for fabricating the stack structure
App 20070246811 - Tsai; Fang-Lin ; et al. | 2007-10-25 |
Semiconductor device package with a heat sink and method for fabricating the same
App 20070235861 - Chien; Kun-Sheng ; et al. | 2007-10-11 |
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof
Grant 7,274,088 - Wu , et al. September 25, 2 | 2007-09-25 |
Semiconductor package having heat dissipating device and fabrication method of the semiconductor package
App 20070200228 - Pu; Han-Ping ; et al. | 2007-08-30 |
Stacked semiconductor structure and fabrication method thereof
App 20070181990 - Huang; Chien-Ping ; et al. | 2007-08-09 |
Flip-chip semiconductor device and method for fabricating the same
App 20070178627 - Jiang; Yih Jenn ; et al. | 2007-08-02 |
Multi-chip semiconductor package
Grant 7,247,934 - Pu July 24, 2 | 2007-07-24 |
Stacked semiconductor packages
Grant 7,208,825 - Pu , et al. April 24, 2 | 2007-04-24 |
Semiconductor package without bonding wires and fabrication method thereof
Grant 7,199,459 - Pu , et al. April 3, 2 | 2007-04-03 |
Semiconductor package with heat sink
Grant 7,196,414 - Lin , et al. March 27, 2 | 2007-03-27 |
Semiconductor package with heat sink
Grant 7,177,155 - Lin , et al. February 13, 2 | 2007-02-13 |
Flip-chip semiconductor package and method for fabricating the same
App 20060214308 - Yu; Kuo-Hua ; et al. | 2006-09-28 |
Chip carrier for semiconductor chip
Grant 7,102,239 - Pu , et al. September 5, 2 | 2006-09-05 |
Semiconductor element with under bump metallurgy structure and fabrication method thereof
App 20060160348 - Pu; Han-Ping ; et al. | 2006-07-20 |
Wafer test method utilizing conductive interposer
Grant 7,057,405 - Pu June 6, 2 | 2006-06-06 |
Semiconductor package with heat sink
Grant 7,057,276 - Lin , et al. June 6, 2 | 2006-06-06 |
Multi-chip semiconductor package and fabrication method thereof
App 20060102994 - Pu; Han-Ping | 2006-05-18 |
Semiconductor device having flip-chip package and method for fabricating the same
App 20060097402 - Pu; Han-Ping ; et al. | 2006-05-11 |
Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
Grant 7,023,085 - Pu April 4, 2 | 2006-04-04 |
Semiconductor package with heat sink
App 20060017145 - Lin; Chang-Fu ; et al. | 2006-01-26 |
Semiconductor package with heat dissipating structure
Grant 6,980,438 - Huang , et al. December 27, 2 | 2005-12-27 |
Semiconductor package with heat sink
App 20050280132 - Lin, Chang-Fu ; et al. | 2005-12-22 |
Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
App 20050212134 - Pu, Han-Ping | 2005-09-29 |
Semiconductor package and fabrication method thereof
App 20050205978 - Pu, Han-Ping ; et al. | 2005-09-22 |
Semiconductor package and fabrication method thereof
App 20050200006 - Pu, Han-Ping ; et al. | 2005-09-15 |
Substrate and fabrication method of the same
Grant 6,943,439 - Huang , et al. September 13, 2 | 2005-09-13 |
Semiconductor package
App 20050168952 - Chen, Chin-Te ; et al. | 2005-08-04 |
Semiconductor package and fabrication method thereof
Grant 6,891,273 - Pu , et al. May 10, 2 | 2005-05-10 |
Chip carrier for semiconductor chip
App 20050040524 - Pu, Han-Ping ; et al. | 2005-02-24 |
Semiconductor package with heat dissipating structure
App 20050036291 - Huang, Chien-Ping ; et al. | 2005-02-17 |
Semiconductor package with heat sink attached to substrate
Grant 6,849,942 - Lin , et al. February 1, 2 | 2005-02-01 |
Wafer test method
App 20050007129 - Pu, Han-Ping | 2005-01-13 |
Semiconductor package with heat sink
App 20040251538 - Lin, Chang-Fu ; et al. | 2004-12-16 |
Method of fabricating BGA packages
Grant 6,830,957 - Pu , et al. December 14, 2 | 2004-12-14 |
Module device of stacked semiconductor packages and method for fabricating the same
Grant 6,828,665 - Pu , et al. December 7, 2 | 2004-12-07 |
Semiconductor package with heat sink
App 20040178494 - Lin, Chang-Fu ; et al. | 2004-09-16 |
Semiconductor package with heat sink
App 20040174682 - Lin, Chang-Fu ; et al. | 2004-09-09 |
Substrate structure of flip chip package
Grant 6,787,918 - Tsai , et al. September 7, 2 | 2004-09-07 |
Semiconductor package and fabrication method thereof
App 20040140573 - Pu, Han-Ping ; et al. | 2004-07-22 |
Module device of stacked semiconductor packages and method for fabricating the same
App 20040075164 - Pu, Han-Ping ; et al. | 2004-04-22 |
Fabrication method for ball grid array semiconductor package
App 20040058471 - Pu, Han-Ping ; et al. | 2004-03-25 |
Connection between semiconductor unit and device carrier
App 20040038452 - Pu, Han-Ping | 2004-02-26 |
Semiconductor device and fabrication method of the same
Grant 6,689,636 - Liao , et al. February 10, 2 | 2004-02-10 |
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof
App 20030230792 - Wu, Chi-Chuan ; et al. | 2003-12-18 |
Ball grid array semiconductor package
Grant 6,646,349 - Pu , et al. November 11, 2 | 2003-11-11 |
Multi-chip module and fabricating method thereof
App 20030198034 - Pu, Han-Ping | 2003-10-23 |
Semiconductor device and fabrication method of the same
App 20030173680 - Liao, Chih-Chin ; et al. | 2003-09-18 |
Lead frame adaptable to the trend of IC packaging
Grant 6,621,150 - Lee , et al. September 16, 2 | 2003-09-16 |
Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same
Grant 6,610,560 - Pu , et al. August 26, 2 | 2003-08-26 |
Substrate and fabrication method of the same
App 20030137035 - Huang, Chien-Ping ; et al. | 2003-07-24 |
Stacked-die package structure
Grant 6,593,662 - Pu , et al. July 15, 2 | 2003-07-15 |
Semiconductor package
Grant 6,570,249 - Liao , et al. May 27, 2 | 2003-05-27 |
Semiconductor Package With Flash Preventing Mechanism And Fabrication Method Thereof
App 20030034568 - Chai, Ting Ke ; et al. | 2003-02-20 |
Method for connecting semiconductor unit to object via bump
App 20020182843 - Pu, Han-Ping | 2002-12-05 |
Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same
App 20020167079 - Pu, Han-Ping ; et al. | 2002-11-14 |
Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same
Grant 6,469,897 - Ho , et al. October 22, 2 | 2002-10-22 |
Multi-chip module and fabricating method thereof
App 20020149919 - Pu, Han-Ping | 2002-10-17 |
Flip chip semiconductor package
Grant 6,459,144 - Pu , et al. October 1, 2 | 2002-10-01 |
Flip Chip Semiconductor Package
App 20020121705 - Pu, Han-Ping ; et al. | 2002-09-05 |
Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same
App 20020114133 - Ho, Tzong-Da ; et al. | 2002-08-22 |
Method Of Fabricating A Flip-chip Ball-grid-array Package With Molded Underfill
App 20020095192 - Pu, Han-Ping ; et al. | 2002-07-18 |
Flip-chip package structure and method of fabricating the same
Grant 6,400,036 - Tang , et al. June 4, 2 | 2002-06-04 |
Flip-chip package structure and method of fabricating the same
App 20020028533 - Tang, Wei-Sen ; et al. | 2002-03-07 |
Method of bonding ball grid array package to circuit board without causing package collapse
Grant 6,350,669 - Pu , et al. February 26, 2 | 2002-02-26 |
Method of wire bonding for small clearance
App 20010042776 - Lo, Randy H. Y. ; et al. | 2001-11-22 |
Flip-chip package structure and method of fabricating the same
Grant 6,291,264 - Tang , et al. September 18, 2 | 2001-09-18 |
Chip packaging
Grant 6,184,573 - Pu February 6, 2 | 2001-02-06 |
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