| Patent | Date |
|---|
Temperature adjusting apparatus and method for a focus ring
Grant 10,593,520 - Wu , et al. | 2020-03-17 |
Temperature Adjusting Apparatus And Method For A Focus Ring
App 20170186590 - Wu; Lei ; et al. | 2017-06-29 |
Pulsed bias plasma process to control microloading
Grant 8,609,546 - Lee , et al. December 17, 2 | 2013-12-17 |
Method of controlling etch microloading for a tungsten-containing layer
Grant 8,518,282 - Lee , et al. August 27, 2 | 2013-08-27 |
Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone
Grant 8,231,799 - Bera , et al. July 31, 2 | 2012-07-31 |
Pulsed Bias Plasma Process To Control Microloading
App 20110281438 - Lee; Wonchul ; et al. | 2011-11-17 |
Method Of Controlling Etch Microloading For A Tungsten-containing Layer
App 20110151670 - Lee; Wonchul ; et al. | 2011-06-23 |
Method for reducing microloading in etching high aspect ratio structures
Grant 7,629,255 - Fu , et al. December 8, 2 | 2009-12-08 |
Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones
Grant 7,541,292 - Bera , et al. June 2, 2 | 2009-06-02 |
Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content
Grant 7,540,971 - Bera , et al. June 2, 2 | 2009-06-02 |
Method For Reducing Microloading In Etching High Aspect Ratio Structures
App 20080296736 - Fu; Qian ; et al. | 2008-12-04 |
Process to open carbon based hardmask overlying a dielectric layer
App 20080286977 - Wang; Judy ; et al. | 2008-11-20 |
Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation
Grant 7,431,859 - Bera , et al. October 7, 2 | 2008-10-07 |
Process to open carbon based hardmask
Grant 7,432,210 - Wang , et al. October 7, 2 | 2008-10-07 |
Apparatus for uniformly etching a dielectric layer
Grant 7,316,761 - Doan , et al. January 8, 2 | 2008-01-08 |
Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation
App 20070251918 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content
App 20070251917 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma etch process using polymerizing etch gases and an inert diluent gas in independent gas injection zones to improve etch profile or etch rate uniformity
App 20070254483 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone
App 20070251642 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones
App 20070254486 - Bera; Kallol ; et al. | 2007-11-01 |
Process to open carbon based hardmask
App 20070077780 - Wang; Judy ; et al. | 2007-04-05 |
Temperature controlled window with a fluid supply system
Grant 6,916,399 - Rozenzon , et al. July 12, 2 | 2005-07-12 |
Flash step preparatory to dielectric etch
Grant 6,787,475 - Wang , et al. September 7, 2 | 2004-09-07 |
Flash step preparatory to dielectric etch
App 20030045116 - Wang, Zhuxu ; et al. | 2003-03-06 |
Support assembly with thermal expansion compensation
Grant 6,364,957 - Schneider , et al. April 2, 2 | 2002-04-02 |
Magnetically-enhanced plasma chamber with non-uniform magnetic field
Grant 6,113,731 - Shan , et al. September 5, 2 | 2000-09-05 |
Shallow magnetic fields for generating circulating electrons to enhance plasma processing
Grant 6,022,446 - Shan , et al. February 8, 2 | 2000-02-08 |
Adjusting DC bias voltage in plasma chambers
Grant 5,891,350 - Shan , et al. April 6, 1 | 1999-04-06 |
Method for etching dielectric layers with high selectivity and low microloading
Grant 5,843,847 - Pu , et al. December 1, 1 | 1998-12-01 |
Apparatus for improving wafer and chuck edge protection
Grant 5,740,009 - Pu , et al. April 14, 1 | 1998-04-14 |
Method and apparatus for producing plasma uniformity in a magnetic field-enhanced plasma reactor
Grant 5,674,321 - Pu , et al. October 7, 1 | 1997-10-07 |
| 