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Patent applications and USPTO patent grants for Pu; Bo.The latest application filed is for "method of modeling high speed channel in semiconductor package, method of designing semiconductor package using the same and method of manufacturing semiconductor package using the same".
Patent | Date |
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Semiconductor package Grant 11,257,741 - Pu , et al. February 22, 2 | 2022-02-22 |
Stack packages Grant 11,205,614 - Pak , et al. December 21, 2 | 2021-12-21 |
Method of modeling high speed channel in semiconductor package, method of designing semiconductor package using the same and method of manufacturing semiconductor package using the same Grant 11,080,460 - Pu , et al. August 3, 2 | 2021-08-03 |
Method Of Modeling High Speed Channel In Semiconductor Package, Method Of Designing Semiconductor Package Using The Same And Method Of Manufacturing Semiconductor Package Using The Same App 20210110096 - Pu; Bo ;   et al. | 2021-04-15 |
Stack Packages App 20210028100 - PAK; Junso ;   et al. | 2021-01-28 |
Semiconductor Package App 20200381347 - PU; Bo ;   et al. | 2020-12-03 |
Media diversion apparatus Grant 10,625,968 - Huang , et al. | 2020-04-21 |
Media Diversion Apparatus App 20190135568 - Huang; Xiaoxi ;   et al. | 2019-05-09 |
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