Pruitt; David A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pruitt; David A..The latest application filed is for "mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits".
- Pruitt; David A. - San Jose CA
| Patent | Date |
|---|---|
| Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits Grant 11,272,618 - Brazzle , et al. March 8, 2 | 2022-03-08 |
| Mechanically-compliant And Electrically And Thermally Conductive Leadframes For Component-on-package Circuits App 20190141834 - Brazzle; John David ; et al. | 2019-05-09 |
| Mechanically-compliant And Electrically And Thermally Conductive Leadframes For Component-on-package Circuits App 20170311447 - BRAZZLE; John David ; et al. | 2017-10-26 |
| Exposed, Solderable Heat Spreader For Flipchip Packages App 20160035645 - Olsen; Edward William ; et al. | 2016-02-04 |
| Enhanced pad design for solder attach devices Grant 8,163,643 - Othieno , et al. April 24, 2 | 2012-04-24 |
| Lead plating technique for singulated IC packages Grant 8,076,181 - Pruitt , et al. December 13, 2 | 2011-12-13 |
| Leadframe with support members Grant 6,703,692 - Pruitt March 9, 2 | 2004-03-09 |
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