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Patent applications and USPTO patent grants for Protsch; Walter.The latest application filed is for "method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder".
Patent | Date |
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Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder Grant 7,331,498 - Protsch , et al. February 19, 2 | 2008-02-19 |
Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder App 20060208042 - Protsch; Walter ;   et al. | 2006-09-21 |
Device for producing soft solder App 20020109273 - Schulze, Jurgen ;   et al. | 2002-08-15 |
Method for encapsulating solder metal powders and solder metal powders produced according to this method Grant 6,416,863 - Schulze , et al. July 9, 2 | 2002-07-09 |
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