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Method of forming a substrate core with embedded capacitor and structures formed thereby
Grant 9,572,258 - Srinivasan , et al. February 14, 2 | 2017-02-14 |
Using Power Dividing Matching Nodes To Optimize Interconnects
App 20130007327 - Prokofiev; Victor | 2013-01-03 |
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
Grant 7,636,231 - Guzek , et al. December 22, 2 | 2009-12-22 |
Spring biased socket system
Grant 7,470,147 - Prokofiev December 30, 2 | 2008-12-30 |
Organic Substrates With Embedded Thin-film Capacitors, Methods Of Making Same, And Systems Containing Same
App 20080174938 - Guzek; John S. ; et al. | 2008-07-24 |
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
Grant 7,372,126 - Guzek , et al. May 13, 2 | 2008-05-13 |
Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same
Grant 7,288,459 - Guzek , et al. October 30, 2 | 2007-10-30 |
IC package with power and signal lines on opposing sides
Grant 7,235,880 - Prokofiev June 26, 2 | 2007-06-26 |
Forming a substrate core with embedded capacitor and structures formed thereby
Grant 7,224,571 - Srinivasan , et al. May 29, 2 | 2007-05-29 |
Delivery regions for power, ground and I/O signal paths in an IC package
Grant 7,209,366 - Prokofiev , et al. April 24, 2 | 2007-04-24 |
Input/output routing on an electronic device
Grant 7,176,575 - Mosley , et al. February 13, 2 | 2007-02-13 |
Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same
App 20060223226 - Guzek; John S. ; et al. | 2006-10-05 |
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
App 20060220175 - Guzek; John S. ; et al. | 2006-10-05 |
Forming a substrate core with embedded capacitor and structures formed thereby
App 20060146476 - Srinivasan; Sriram ; et al. | 2006-07-06 |
Forming a substrate core with embedded capacitor and structures formed thereby
App 20060143886 - Srinivasan; Sriram ; et al. | 2006-07-06 |
Forming a substrate core with embedded capacitor and structures formed thereby
App 20060143887 - Srinivasan; Sriram ; et al. | 2006-07-06 |
Input/output routing on an electronic device
App 20060065975 - Mosley; Larry E. ; et al. | 2006-03-30 |
IC package with power and singal lines on opposing sides
App 20060043581 - Prokofiev; Victor | 2006-03-02 |
Packaged substrate having variable width conductors and a variably spaced reference plane
App 20060001149 - Prokofiev; Victor | 2006-01-05 |
Delivery regions for power, ground and I/O signal paths in an IC package
App 20050207131 - Prokofiev, Victor ; et al. | 2005-09-22 |
Via grid array sockets for electronics applications
App 20050186808 - Prokofiev, Victor | 2005-08-25 |
High-speed signaling interface and method for communicating across across an interface
App 20050082687 - Prokofiev, Victor ; et al. | 2005-04-21 |
Apparatus and method for an integrated high-performance electrical interconnect
Grant 6,809,260 - Prokofiev October 26, 2 | 2004-10-26 |
Capacitor device and method
Grant 6,795,296 - Palanduz , et al. September 21, 2 | 2004-09-21 |
High-speed signaling interface with broadside dynamic wave coupling
App 20040113239 - Prokofiev, Victor ; et al. | 2004-06-17 |
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