| Patent | Date |
|---|
Copper Interconnect Structure With Manganese Barrier Layer
App 20220115269 - Edelstein; Daniel C. ; et al. | 2022-04-14 |
Copper interconnect structure with manganese barrier layer
Grant 11,232,983 - Edelstein , et al. January 25, 2 | 2022-01-25 |
Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same
Grant 11,186,911 - Grill , et al. November 30, 2 | 2021-11-30 |
Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same
Grant 11,066,748 - Grill , et al. July 20, 2 | 2021-07-20 |
Structure and method for equal substrate to channel height between N and P fin-FETs
Grant 11,043,494 - Clevenger , et al. June 22, 2 | 2021-06-22 |
Interconnect Structure
App 20200402848 - Edelstein; Daniel C. ; et al. | 2020-12-24 |
Interconnect structure
Grant 10,770,347 - Edelstein , et al. Sep | 2020-09-08 |
Interconnect structure
Grant 10,593,591 - Edelstein , et al. | 2020-03-17 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 10,580,740 - Briggs , et al. | 2020-03-03 |
Interconnect Structure
App 20200051854 - EDELSTEIN; Daniel C. ; et al. | 2020-02-13 |
Microwave Plasma And Ultraviolet Assisted Deposition Apparatus And Method For Material Deposition Using The Same
App 20190368045 - Grill; Alfred ; et al. | 2019-12-05 |
Microwave Plasma And Ultraviolet Assisted Deposition Apparatus And Method For Material Deposition Using The Same
App 20190368044 - Grill; Alfred ; et al. | 2019-12-05 |
Structure And Method For Equal Substrate To Channel Height Between N And P Fin-fets
App 20190326289 - CLEVENGER; Lawrence A. ; et al. | 2019-10-24 |
Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same
Grant 10,428,428 - Grill , et al. October 1, 2 | 2019-10-01 |
Structure and method for equal substrate to channel height between N and P fin-FETs
Grant 10,381,348 - Clevenger , et al. A | 2019-08-13 |
Air gap and air spacer pinch off
Grant 10,366,940 - Bonilla , et al. July 30, 2 | 2019-07-30 |
Copper interconnect structure with manganese oxide barrier layer
Grant 10,325,806 - Edelstein , et al. | 2019-06-18 |
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
App 20190172704 - Haigh, JR.; Thomas J. ; et al. | 2019-06-06 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20190148303 - Briggs; Benjamin D. ; et al. | 2019-05-16 |
Air gap and air spacer pinch off
Grant 10,256,171 - Bonilla , et al. | 2019-04-09 |
Air gap and air spacer pinch off
Grant 10,242,933 - Bonilla , et al. | 2019-03-26 |
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
Grant 10,242,865 - Haigh, Jr. , et al. | 2019-03-26 |
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
Grant 10,236,176 - Haigh, Jr. , et al. | 2019-03-19 |
Separate N and P fin etching for reduced CMOS device leakage
Grant 10,229,910 - Chu , et al. | 2019-03-12 |
Copper interconnect structure with manganese oxide barrier layer
Grant 10,224,241 - Edelstein , et al. | 2019-03-05 |
Composite manganese nitride / low-k dielectric cap
Grant 10,224,283 - Canaperi , et al. | 2019-03-05 |
Multilayer dielectric structures with graded composition for nano-scale semiconductor devices
Grant 10,211,047 - Nguyen , et al. Feb | 2019-02-19 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 10,192,829 - Briggs , et al. Ja | 2019-01-29 |
Air gap and air spacer pinch off
Grant 10,177,076 - Bonilla , et al. J | 2019-01-08 |
Interconnect Structure
App 20180374748 - EDELSTEIN; Daniel C. ; et al. | 2018-12-27 |
Edge trim processes and resultant structures
Grant 10,134,577 - Indyk , et al. November 20, 2 | 2018-11-20 |
Structure And Method For Equal Substrate To Channel Height Between N And P Fin-fets
App 20180197858 - CLEVENGER; Lawrence A. ; et al. | 2018-07-12 |
Air gap semiconductor structure with selective cap bilayer
Grant 9,960,117 - Gates , et al. May 1, 2 | 2018-05-01 |
Air Gap And Air Spacer Pinch Off
App 20180108596 - Bonilla; Griselda ; et al. | 2018-04-19 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,947,622 - Canaperi , et al. April 17, 2 | 2018-04-17 |
Method of forming a copper based interconnect structure
Grant 9,947,581 - Edelstein , et al. April 17, 2 | 2018-04-17 |
Copper interconnect structure with manganese oxide barrier layer
Grant 9,947,579 - Edelstein , et al. April 17, 2 | 2018-04-17 |
Separate N And P Fin Etching For Reduced Cmos Device Leakage
App 20180097002 - Chu; Isabel C. ; et al. | 2018-04-05 |
Multilayer dielectric structures with graded composition for nano-scale semiconductor devices
Grant 9,934,963 - Nguyen , et al. April 3, 2 | 2018-04-03 |
Air Gap And Air Spacer Pinch Off
App 20180090418 - Bonilla; Griselda ; et al. | 2018-03-29 |
Air Gap And Air Spacer Pinch Off
App 20180090587 - Bonilla; Griselda ; et al. | 2018-03-29 |
Interconnect Structure
App 20180090371 - EDELSTEIN; Daniel C. ; et al. | 2018-03-29 |
Air Gap And Air Spacer Pinch Off
App 20180090588 - Bonilla; Griselda ; et al. | 2018-03-29 |
Interconnect Structure
App 20180082894 - EDELSTEIN; Daniel C. ; et al. | 2018-03-22 |
Multilayer Dielectric Structures With Graded Composition For Nano-scale Semiconductor Devices
App 20180047568 - Nguyen; Son V. ; et al. | 2018-02-15 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20170358533 - Briggs; Benjamin D. ; et al. | 2017-12-14 |
Composite Manganese Nitride / Low-k Dielectric Cap
App 20170317032 - Canaperi; Donald F. ; et al. | 2017-11-02 |
Air gap and air spacer pinch off
Grant 9,793,193 - Bonilla , et al. October 17, 2 | 2017-10-17 |
Air gap and air spacer pinch off
Grant 9,786,760 - Bonilla , et al. October 10, 2 | 2017-10-10 |
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
App 20170263451 - Haigh, JR.; Thomas J. ; et al. | 2017-09-14 |
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH) DIELECTRICS FOR NANO ELECTRONIC DEVICES
App 20170263449 - Haigh, JR.; Thomas J. ; et al. | 2017-09-14 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 9,754,891 - Briggs , et al. September 5, 2 | 2017-09-05 |
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
Grant 9,735,005 - Haigh, Jr. , et al. August 15, 2 | 2017-08-15 |
Separate N and P fin etching for reduced CMOS device leakage
Grant 9,711,507 - Chu , et al. July 18, 2 | 2017-07-18 |
Method of forming an air gap semiconductor structure with selective cap bilayer
Grant 9,711,455 - Gates , et al. July 18, 2 | 2017-07-18 |
Composite manganese nitride/low-K dielectric cap
Grant 9,711,456 - Canaperi , et al. July 18, 2 | 2017-07-18 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,691,705 - Canaperi , et al. June 27, 2 | 2017-06-27 |
Composite Manganese Nitride / Low-k Dielectric Cap
App 20170179034 - Canaperi; Donald F. ; et al. | 2017-06-22 |
Interconnect Structure
App 20170140981 - EDELSTEIN; Daniel C. ; et al. | 2017-05-18 |
Substrate bonding with diffusion barrier structures
Grant 9,620,481 - Edelstein , et al. April 11, 2 | 2017-04-11 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,607,825 - Canaperi , et al. March 28, 2 | 2017-03-28 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20170084540 - Briggs; Benjamin D. ; et al. | 2017-03-23 |
Interconnect structure with barrier layer
Grant 9,601,371 - Edelstein , et al. March 21, 2 | 2017-03-21 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,558,934 - Canaperi , et al. January 31, 2 | 2017-01-31 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,558,935 - Canaperi , et al. January 31, 2 | 2017-01-31 |
Microwave Plasma And Ultraviolet Assisted Deposition Apparatus And Method For Material Deposition Using The Same
App 20170002469 - Grill; Alfred ; et al. | 2017-01-05 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20170005040 - Canaperi; Donald F. ; et al. | 2017-01-05 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,536,733 - Canaperi , et al. January 3, 2 | 2017-01-03 |
Edge Trim Processes And Resultant Structures
App 20160343564 - INDYK; Richard F. ; et al. | 2016-11-24 |
Interconnect Structure
App 20160329279 - EDELSTEIN; Daniel C. ; et al. | 2016-11-10 |
Multilayer Dielectric Structures With Graded Composition For Nano-scale Semiconductor Devices
App 20160314965 - Nguyen; Son V. ; et al. | 2016-10-27 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,472,503 - Canaperi , et al. October 18, 2 | 2016-10-18 |
Interconnect structure with capping layer and barrier layer
Grant 9,455,182 - Edelstein , et al. September 27, 2 | 2016-09-27 |
Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors
Grant 9,449,810 - Canaperi , et al. September 20, 2 | 2016-09-20 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,449,812 - Canaperi , et al. September 20, 2 | 2016-09-20 |
Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same
Grant 9,435,031 - Grill , et al. September 6, 2 | 2016-09-06 |
Multilayer dielectric structures with graded composition for nano-scale semiconductor devices
Grant 9,431,235 - Nguyen , et al. August 30, 2 | 2016-08-30 |
Wafer bonding for 3D device packaging fabrication
Grant 9,412,629 - Nguyen , et al. August 9, 2 | 2016-08-09 |
Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect
Grant 9,349,687 - Gates , et al. May 24, 2 | 2016-05-24 |
Air Gap Structure With Bilayer Selective Cap
App 20160133575 - Gates; Stephen M. ; et al. | 2016-05-12 |
Air Gap Structure With Bilayer Selective Cap
App 20160133508 - Gates; Stephen M. ; et al. | 2016-05-12 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160133576 - Canaperi; Donald F. ; et al. | 2016-05-12 |
Interconnect structure containing a porous low k interconnect dielectric/dielectric cap
Grant 9,312,224 - Canaperi , et al. April 12, 2 | 2016-04-12 |
Air gap semiconductor structure with selective cap bilayer
Grant 9,305,836 - Gates , et al. April 5, 2 | 2016-04-05 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160064509 - Canaperi; Donald Francis ; et al. | 2016-03-03 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160064218 - Canaperi; Donald Francis ; et al. | 2016-03-03 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,275,952 - Canaperi , et al. March 1, 2 | 2016-03-01 |
Interconnect Structure
App 20160056076 - EDELSTEIN; Daniel C. ; et al. | 2016-02-25 |
Interconnect Structure
App 20160056112 - EDELSTEIN; Daniel C. ; et al. | 2016-02-25 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160056111 - Canaperi; Donald Francis ; et al. | 2016-02-25 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160047038 - Canaperi; Donald Francis ; et al. | 2016-02-18 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160035618 - Canaperi; Donald F. ; et al. | 2016-02-04 |
Advanced Ultra Low K Sicoh Dielectrics Prepared By Built-in Engineered Pore Size And Bonding Structured With Cyclic Organosilicon Precursors
App 20160005597 - Canaperi; Donald F. ; et al. | 2016-01-07 |
Composite dielectric materials with improved mechanical and electrical properties
Grant 9,214,332 - Canaperi , et al. December 15, 2 | 2015-12-15 |
Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors
Grant 9,209,017 - Canaperi , et al. December 8, 2 | 2015-12-08 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20150287593 - Canaperi; Donald Francis ; et al. | 2015-10-08 |
Advanced Ultra Low K Sicoh Dielectrics Prepared By Built-in Engineered Pore Size And Bonding Structured With Cyclic Organosilicon Precursors
App 20150279667 - Canaperi; Donald F. ; et al. | 2015-10-01 |
Composite Dielectric Materials With Improved Mechanical And Electrical Properties
App 20150270124 - Canaperi; Donald F. ; et al. | 2015-09-24 |
Substrate Bonding With Diffusion Barrier Structures
App 20150262976 - Edelstein; Daniel C. ; et al. | 2015-09-17 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20150214157 - Canaperi; Donald F. ; et al. | 2015-07-30 |
Microwave Plasma And Ultraviolet Assisted Deposition Apparatus And Method For Material Deposition Using The Same
App 20150191824 - Grill; Alfred ; et al. | 2015-07-09 |
Substrate bonding with diffusion barrier structures
Grant 9,064,937 - Edelstein , et al. June 23, 2 | 2015-06-23 |
Wafer-to-wafer oxide fusion bonding
Grant 9,028,628 - Lin , et al. May 12, 2 | 2015-05-12 |
Through-silicon Via Structure And Method For Improving Beol Dielectric Performance
App 20150097274 - Collins; Christopher ; et al. | 2015-04-09 |
Multilayer dielectric structures for semiconductor nano-devices
Grant 8,980,715 - Grill , et al. March 17, 2 | 2015-03-17 |
Multilayer dielectric structures for semiconductor nano-devices
Grant 8,981,466 - Grill , et al. March 17, 2 | 2015-03-17 |
Through-silicon Via Structure And Method For Improving Beol Dielectric Performance
App 20150069608 - Collins; Christopher ; et al. | 2015-03-12 |
Substrate Bonding With Diffusion Barrier Structures
App 20140353828 - Edelstein; Daniel C. ; et al. | 2014-12-04 |
Wafer-to-wafer Oxide Fusion Bonding
App 20140261960 - Lin; Wei ; et al. | 2014-09-18 |
Multilayer Dielectric Structures For Semiconductor Nano-devices
App 20140252502 - Grill; Alfred ; et al. | 2014-09-11 |
Multilayer Dielectric Structures For Semiconductor Nano-devices
App 20140256153 - Grill; Alfred ; et al. | 2014-09-11 |
Wafer Bonding For 3d Device Packaging Fabrication
App 20140113433 - Nguyen; Son V. ; et al. | 2014-04-24 |
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