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Patent applications and USPTO patent grants for Prindiville; Casey.The latest application filed is for "apparatus and methods for coverlay removal and adhesive application".
Patent | Date |
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Semiconductor packages and methods for making the same Grant 6,891,108 - Prindiville , et al. May 10, 2 | 2005-05-10 |
Semiconductor packages and methods for making the same Grant 6,858,927 - Prindiville , et al. February 22, 2 | 2005-02-22 |
Apparatus and methods for coverlay removal and adhesive application App 20050034818 - Prindiville, Casey | 2005-02-17 |
Semiconductor packages and methods for making the same Grant 6,833,510 - Prindiville , et al. December 21, 2 | 2004-12-21 |
Semiconductor packages and methods for making the same Grant 6,779,258 - Prindiville , et al. August 24, 2 | 2004-08-24 |
Apparatus and methods for coverlay removal and adhesive application Grant 6,749,711 - Prindiville June 15, 2 | 2004-06-15 |
Apparatus and methods for coverlay removal and adhesive application App 20030127182 - Prindiville, Casey | 2003-07-10 |
Semiconductor packages and methods for making the same App 20020043401 - Prindiville, Casey ;   et al. | 2002-04-18 |
Semiconductor packages and methods for making the same App 20020030575 - Prindiville, Casey ;   et al. | 2002-03-14 |
Semiconductor packages and methods for making the same App 20020020902 - Prindiville, Casey ;   et al. | 2002-02-21 |
Semiconductor packages and methods for making the same App 20020020908 - Prindiville, Casey ;   et al. | 2002-02-21 |
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