Priewasser; Karl Heinz
Patent Applications and Registrations
Patent applications and USPTO patent grants for Priewasser; Karl Heinz.The latest application filed is for "back grinding adhesive sheet, and method for manufacturing semiconductor wafer".
Company Profile
21.32.49
- Priewasser; Karl Heinz - Munich N/A DE
- Priewasser; Karl Heinz - Kirchheim b. Muenchen JP
- Priewasser; Karl Heinz - Muenchen DE
- Priewasser; Karl Heinz - Kirchheim DE
Patent Activity
| Patent | Date |
|---|---|
| Method of processing wafer and protective sheeting for use in this method Grant 11,437,275 - Priewasser September 6, 2 | 2022-09-06 |
| Substrate processing method Grant 11,424,161 - Priewasser , et al. August 23, 2 | 2022-08-23 |
| Back Grinding Adhesive Sheet, And Method For Manufacturing Semiconductor Wafer App 20220148905 - Priewasser; Karl Heinz ; et al. | 2022-05-12 |
| Adhesive Sheet For Backgrinding And Production Method For Semiconductor Wafer App 20220135848 - Priewasser; Karl Heinz ; et al. | 2022-05-05 |
| Method Of Processing Wafer App 20220028742 - PRIEWASSER; Karl Heinz ; et al. | 2022-01-27 |
| Method of producing a substrate and system for producing a substrate Grant 11,201,126 - Priewasser , et al. December 14, 2 | 2021-12-14 |
| Method Of Producing A Substrate And System For Producing A Substrate App 20210358736 - PRIEWASSER; Karl Heinz | 2021-11-18 |
| Method of processing a wafer Grant 11,133,219 - Priewasser , et al. September 28, 2 | 2021-09-28 |
| Alignment Device And Alignment Method App 20210249294 - PRIEWASSER; Karl Heinz ; et al. | 2021-08-12 |
| Device And Method For Attaching Protective Tape To Semiconductor Wafer App 20210249286 - PRIEWASSER; Karl Heinz ; et al. | 2021-08-12 |
| Device And Method For Attaching Protective Tape On Semiconductor Wafer App 20210249285 - PRIEWASSER; Karl Heinz ; et al. | 2021-08-12 |
| Method Of Processing A Wafer App 20210183704 - PRIEWASSER; Karl Heinz ; et al. | 2021-06-17 |
| Method Of Processing Wafer App 20210151390 - Priewasser; Karl Heinz | 2021-05-20 |
| Method of processing a substrate Grant 11,011,406 - Priewasser , et al. May 18, 2 | 2021-05-18 |
| Method of processing wafer having protrusions on the back side Grant 10,991,612 - Priewasser April 27, 2 | 2021-04-27 |
| Wafer processing method Grant 10,991,623 - Wakahara , et al. April 27, 2 | 2021-04-27 |
| Method Of Processing A Substrate App 20210035846 - PRIEWASSER; Karl Heinz | 2021-02-04 |
| Method Of Processing A Workpiece And System For Processing A Workpiece App 20200381303 - HOSHINO; Hitoshi ; et al. | 2020-12-03 |
| Protective Sheet For Use In Processing Wafer, Handling System For Wafer, And Combination Of Wafer And Protective Sheeting App 20200373176 - PRIEWASSER; Karl Heinz | 2020-11-26 |
| Substrate Processing Method App 20200312717 - PRIEWASSER; Karl Heinz ; et al. | 2020-10-01 |
| Method of dividing wafer Grant 10,784,164 - Priewasser Sept | 2020-09-22 |
| Method Of Processing Wafer Having Protrusions On The Back Side App 20200273739 - Priewasser; Karl Heinz | 2020-08-27 |
| Method Of Producing A Substrate And System For Producing A Substrate App 20200251431 - Kind Code | 2020-08-06 |
| Method of processing a substrate Grant 10,727,127 - Morikazu , et al. | 2020-07-28 |
| Method of processing a wafer Grant 10,727,128 - Priewasser , et al. | 2020-07-28 |
| Substrate processing method Grant 10,702,946 - Morikazu , et al. | 2020-07-07 |
| Method of processing a substrate Grant 10,682,728 - Priewasser , et al. | 2020-06-16 |
| Wafer Processing Method App 20200185227 - WAKAHARA; Masatoshi ; et al. | 2020-06-11 |
| Method Of Processing A Substrate App 20200066569 - PRIEWASSER; Karl Heinz ; et al. | 2020-02-27 |
| Workpiece processing method Grant 10,475,676 - Priewasser , et al. Nov | 2019-11-12 |
| Method Of Processing A Wafer App 20190252254 - PRIEWASSER; Karl Heinz ; et al. | 2019-08-15 |
| Method Of Processing A Wafer App 20190221480 - PRIEWASSER; Karl Heinz ; et al. | 2019-07-18 |
| Wafer processing method Grant 10,312,099 - Sekiya , et al. | 2019-06-04 |
| Method of processing wafer Grant 10,256,148 - Priewasser | 2019-04-09 |
| Microfluidic System Or Device And Method Of Manufacturing A Microfluidic System Or Device App 20190091649 - Priewasser; Karl Heinz ; et al. | 2019-03-28 |
| Method of processing a wafer and wafer processing system Grant 10,242,913 - Priewasser , et al. | 2019-03-26 |
| Method Of Processing A Substrate App 20190030648 - Priewasser; Karl Heinz ; et al. | 2019-01-31 |
| Workpiece Processing Method App 20180342408 - Priewasser; Karl Heinz ; et al. | 2018-11-29 |
| Method Of Processing Wafer App 20180337141 - Priewasser; Karl Heinz | 2018-11-22 |
| Wafer Processing Method App 20180315610 - Sekiya; Kazuma ; et al. | 2018-11-01 |
| Method Of Processing Wafer And Protective Sheeting For Use In This Method App 20180247870 - Priewasser; Karl Heinz | 2018-08-30 |
| Method Of Processing A Wafer And Wafer Processing System App 20180211877 - Priewasser; Karl Heinz ; et al. | 2018-07-26 |
| Wafer dividing method Grant 10,032,669 - Priewasser July 24, 2 | 2018-07-24 |
| Method Of Processing A Substrate App 20180204771 - Morikazu; Hiroshi ; et al. | 2018-07-19 |
| Substrate Processing Method App 20180161921 - Morikazu; Hiroshi ; et al. | 2018-06-14 |
| Protective sheeting for use in processing a semiconductor-sized wafer and semiconductor-sized wafer processing method Grant 9,905,453 - Priewasser February 27, 2 | 2018-02-27 |
| Protective Sheeting For Use In Processing A Semiconductor-sized Wafer And Semiconductor-sized Wafer Processing Method App 20180005862 - PRIEWASSER; Karl Heinz | 2018-01-04 |
| Method of processing a substrate Grant 9,831,128 - Morikazu , et al. November 28, 2 | 2017-11-28 |
| Support plate and method for forming support plate Grant 9,768,049 - Priewasser September 19, 2 | 2017-09-19 |
| Method of dividing wafer into dies Grant 9,704,749 - Priewasser July 11, 2 | 2017-07-11 |
| Method Of Processing A Substrate App 20170076983 - Morikazu; Hiroshi ; et al. | 2017-03-16 |
| Wafer processing method Grant 9,595,463 - Priewasser March 14, 2 | 2017-03-14 |
| Method Of Processing Wafer App 20170062278 - Priewasser; Karl Heinz | 2017-03-02 |
| Support Plate And Method For Forming Support Plate App 20170047241 - Priewasser; Karl Heinz | 2017-02-16 |
| Wafer processing method Grant 9,472,442 - Priewasser October 18, 2 | 2016-10-18 |
| Method Of Dividing Wafer App 20160276223 - Priewasser; Karl Heinz | 2016-09-22 |
| Wafer Dividing Method App 20160254188 - Priewasser; Karl Heinz | 2016-09-01 |
| Wafer processing method Grant 9,397,000 - Priewasser July 19, 2 | 2016-07-19 |
| Wafer Processing Method App 20160204016 - Priewasser; Karl Heinz | 2016-07-14 |
| Method Of Dividing Wafer Into Dies App 20160190010 - Priewasser; Karl Heinz | 2016-06-30 |
| Support Plate And Method For Forming Support Plate App 20150332952 - Priewasser; Karl Heinz | 2015-11-19 |
| Method Of Processing Wafer App 20150332911 - Priewasser; Karl Heinz | 2015-11-19 |
| Wafer Processing Method App 20150332928 - Priewasser; Karl Heinz | 2015-11-19 |
| Wafer Processing Method App 20150325480 - Priewasser; Karl Heinz | 2015-11-12 |
| Adhesive and protective member used in a wafer processing method Grant 9,006,085 - Priewasser April 14, 2 | 2015-04-14 |
| Protective Member And Wafer Processing Method App 20140084423 - Priewasser; Karl Heinz | 2014-03-27 |
| Method for processing a semiconductor wafer Grant 7,708,855 - Priewasser May 4, 2 | 2010-05-04 |
| Method for adhering protecting tape of wafer and adhering apparatus Grant 7,520,309 - Priewasser April 21, 2 | 2009-04-21 |
| Method for concave grinding of wafer and unevenness-absorbing pad Grant 7,413,501 - Priewasser August 19, 2 | 2008-08-19 |
| Method for concave grinding of wafer and unevenness-absorbing pad App 20070212986 - Priewasser; Karl Heinz | 2007-09-13 |
| Method for adhering protecting tape of wafer and adhering apparatus App 20070026640 - Priewasser; Karl Heinz | 2007-02-01 |
| Method for processing a semiconductor wafer App 20070023136 - Priewasser; Karl Heinz | 2007-02-01 |
| Method for processing wafer Grant 7,115,485 - Priewasser October 3, 2 | 2006-10-03 |
| Method for generating chip stacks Grant 7,087,502 - Priewasser , et al. August 8, 2 | 2006-08-08 |
| Method for generating chip stacks App 20050095733 - Priewasser, Karl Heinz ; et al. | 2005-05-05 |
| Method for dicing semiconductor wafer App 20050070074 - Priewasser, Karl Heinz | 2005-03-31 |
| Method for processing wafer App 20050070072 - Priewasser, Karl Heinz | 2005-03-31 |
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