| Patent | Date |
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Semiconductor structure including a layer of a first metal between a diffusion barrier layer and a second metal and method for the formation thereof
Grant 9,620,453 - Preusse , et al. April 11, 2 | 2017-04-11 |
Semiconductor Structure Including A Layer Of A First Metal Between A Diffusion Barrier Layer And A Second Metal And Method For The Formation Thereof
App 20160104638 - Preusse; Axel ; et al. | 2016-04-14 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects
Grant 9,305,878 - Huisinga , et al. April 5, 2 | 2016-04-05 |
Integrated Circuits And Methods For Fabricating Integrated Circuits With Capping Layers Between Metal Contacts And Interconnects
App 20150097291 - Huisinga; Torsten ; et al. | 2015-04-09 |
Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces
Grant 8,951,900 - Preusse , et al. February 10, 2 | 2015-02-10 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects
Grant 8,932,911 - Huisinga , et al. January 13, 2 | 2015-01-13 |
Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines
Grant 8,883,610 - Seidel , et al. November 11, 2 | 2014-11-11 |
Integrated Circuits And Methods For Fabricating Integrated Circuits With Capping Layers Between Metal Contacts And Interconnects
App 20140239503 - Huisinga; Torsten ; et al. | 2014-08-28 |
Contact Elements Of A Semiconductor Device Formed By Electroless Plating And Excess Material Removal With Reduced Sheer Forces
App 20130237057 - Preusse; Axel ; et al. | 2013-09-12 |
Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces
Grant 8,450,197 - Preusse , et al. May 28, 2 | 2013-05-28 |
Contact elements of semiconductor devices formed on the basis of a partially applied activation layer
Grant 8,389,401 - Seidel , et al. March 5, 2 | 2013-03-05 |
Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices
Grant 8,314,494 - Nopper , et al. November 20, 2 | 2012-11-20 |
Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices
Grant 8,153,524 - Aubel , et al. April 10, 2 | 2012-04-10 |
Contact Elements of a Semiconductor Device Formed by Electroless Plating and Excess Material Removal with Reduced Sheer Forces
App 20110244679 - Preusse; Axel ; et al. | 2011-10-06 |
Technique for electrochemically depositing an alloy having a chemical order
Grant 7,985,329 - Preusse , et al. July 26, 2 | 2011-07-26 |
Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient
Grant 7,981,793 - Preusse , et al. July 19, 2 | 2011-07-19 |
Contact Elements Of Semiconductor Devices Formed On The Basis Of A Partially Applied Activation Layer
App 20110156270 - Seidel; Robert ; et al. | 2011-06-30 |
Apparatus and method for removing bubbles from a process liquid
Grant 7,947,158 - Hartz , et al. May 24, 2 | 2011-05-24 |
Enhanced Electromigration Performance Of Copper Lines In Metallization Systems Of Semiconductor Devices By Surface Alloying
App 20100289125 - Feustel; Frank ; et al. | 2010-11-18 |
Providing Superior Electromigration Performance And Reducing Deterioration Of Sensitive Low-k Dielectrics In Metallization Systems Of Semiconductor Devices
App 20100221911 - Aubel; Oliver ; et al. | 2010-09-02 |
Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices
Grant 7,781,329 - Preusse , et al. August 24, 2 | 2010-08-24 |
Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime
Grant 7,745,327 - Preusse , et al. June 29, 2 | 2010-06-29 |
Microstructure Device Including A Metallization Structure With Self-aligned Air Gaps Between Closely Spaced Metal Lines
App 20100133648 - Seidel; Robert ; et al. | 2010-06-03 |
Apparatus And Method For Removing Bubbles From A Process Liquid
App 20100024724 - Hartz; Helge ; et al. | 2010-02-04 |
Reducing Leakage In Dielectric Materials Including Metal Regions Including A Metal Cap Layer In Semiconductor Devices
App 20090325375 - Preusse; Axel ; et al. | 2009-12-31 |
Apparatus and method for removing bubbles from a process liquid
Grant 7,615,103 - Hartz , et al. November 10, 2 | 2009-11-10 |
Metal Cap Layer Of Increased Electrode Potential For Copper-based Metal Regions In Semiconductor Devices
App 20090243109 - Nopper; Markus ; et al. | 2009-10-01 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process
Grant 7,560,381 - Nopper , et al. July 14, 2 | 2009-07-14 |
Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase
Grant 7,517,782 - Preusse , et al. April 14, 2 | 2009-04-14 |
Method Of Forming A Metal Directly On A Conductive Barrier Layer By Electrochemical Deposition Using An Oxygen-depleted Ambient
App 20090061621 - Preusse; Axel ; et al. | 2009-03-05 |
Method Of Forming A Metal Directly On A Conductive Barrier Layer By Electrochemical Deposition Using An Oxygen-depleted Ambient
App 20090061629 - Preusse; Axel ; et al. | 2009-03-05 |
Method of reworking a semiconductor structure
Grant 7,476,552 - Preusse , et al. January 13, 2 | 2009-01-13 |
Method Of Forming A Copper-based Metallization Layer Including A Conductive Cap Layer By An Advanced Integration Regime
App 20080206986 - Preusse; Axel ; et al. | 2008-08-28 |
Method Of Forming A Copper-based Metallization Layer Including A Conductive Cap Layer By An Advanced Integration Regime
App 20080182406 - Preusse; Axel ; et al. | 2008-07-31 |
Method Of Forming A Metal Layer Over A Patterned Dielectric By Electroless Deposition Using A Selectively Provided Activation Layer
App 20080182409 - Seidel; Robert ; et al. | 2008-07-31 |
Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity
Grant 7,375,031 - Preusse , et al. May 20, 2 | 2008-05-20 |
Semiconductor Device Comprising A Metallization Layer Stack With A Porous Low-k Material Having An Enhanced Integrity
App 20070178690 - Nopper; Markus ; et al. | 2007-08-02 |
Method Of Forming A Metal Layer Over A Patterned Dielectric By Wet Chemical Deposition Including An Electroless And A Powered Phase
App 20070166982 - Preusse; Axel ; et al. | 2007-07-19 |
Method of reducing wafer contamination by removing under-metal layers at the wafer edge
Grant 7,169,664 - Preusse , et al. January 30, 2 | 2007-01-30 |
Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity
App 20060246721 - Preusse; Axel ; et al. | 2006-11-02 |
Technique for electrochemically depositing an alloy having a chemical order
App 20060219565 - Preusse; Axel ; et al. | 2006-10-05 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process
App 20060194431 - Nopper; Markus ; et al. | 2006-08-31 |
Method of reworking a semiconductor structure
App 20060194349 - Preusse; Axel ; et al. | 2006-08-31 |
Method and system for controlling a substrate position in an electrochemical process
App 20060193992 - Bonkass; Matthias ; et al. | 2006-08-31 |
Apparatus and method for removing bubbles from a process liquid
App 20060169579 - Hartz; Helge ; et al. | 2006-08-03 |
Method and system for controlling ion distribution during plating of a metal on a workpiece surface
Grant 6,974,530 - Bonkass , et al. December 13, 2 | 2005-12-13 |
System and method for an increased bath lifetime in a single-use plating regime
App 20050241947 - Nopper, Markus ; et al. | 2005-11-03 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process
Grant 6,958,247 - Marxsen , et al. October 25, 2 | 2005-10-25 |
Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst
Grant 6,951,816 - Nopper , et al. October 4, 2 | 2005-10-04 |
Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
App 20050067290 - Bonkass, Matthias ; et al. | 2005-03-31 |
Storage tank for process liquids with a reduced amount of bubbles
App 20050067288 - Hartz, Helge ; et al. | 2005-03-31 |
Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
Grant 6,841,056 - Preusse January 11, 2 | 2005-01-11 |
Method of reducing wafer contamination by removing under-metal layers at the wafer edge
App 20040251518 - Preusse, Axel ; et al. | 2004-12-16 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process
App 20040214423 - Marxsen, Gerd ; et al. | 2004-10-28 |
Method of plating a semiconductor structure
App 20040188260 - Bonkabeta, Matthias ; et al. | 2004-09-30 |
Method and system for improving the manufacturing of metal damascene structures
Grant 6,774,030 - Marxsen , et al. August 10, 2 | 2004-08-10 |
Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst
App 20040145062 - Nopper, Markus ; et al. | 2004-07-29 |
Apparatus and method for electrochemical metal deposition
Grant 6,761,812 - Preusse , et al. July 13, 2 | 2004-07-13 |
Apparatus and method for reducing oxidation of polished metal surfaces in a chemical mechanical polishing process
App 20040009670 - Preusse, Axel ; et al. | 2004-01-15 |
Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
App 20040000486 - Preusse, Axel | 2004-01-01 |
Apparatus and method for electrochemical metal deposition
App 20040000485 - Preusse, Axel ; et al. | 2004-01-01 |
System and method for reducing the chemical reactivity of water and other chemicals used in the fabrication of integrated circuits
App 20040000234 - Preusse, Axel ; et al. | 2004-01-01 |
Method and system for controlling ion distribution during plating of a metal on a workpiece surface
App 20040000487 - Bonkass, Matthias ; et al. | 2004-01-01 |
Method and system for improving the manufacturing of metal damascene structures
App 20030224596 - Marxsen, Gerd ; et al. | 2003-12-04 |
Method of electroplating copper over a patterned dielectric layer
App 20030221966 - Bonkass, Matthias ; et al. | 2003-12-04 |
Method of forming metal lines having improved uniformity on a substrate
Grant 6,620,726 - Preusse , et al. September 16, 2 | 2003-09-16 |
Method Of Forming Metal Lines Having Improved Uniformity On A Substrate
App 20030162385 - Preusse, Axel ; et al. | 2003-08-28 |
Apparatus for forming a copper interconnect
Grant 6,106,680 - Nogami , et al. August 22, 2 | 2000-08-22 |
Method of forming reliable copper interconnects with improved hole filling
Grant 6,103,086 - Woo , et al. August 15, 2 | 2000-08-15 |
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