| Patent | Date |
|---|
Method for fabricating a semiconductor flip-chip package
Grant 11,393,742 - Meyer , et al. July 19, 2 | 2022-07-19 |
Method for Fabricating a Semiconductor Flip-Chip Package
App 20200388561 - Meyer; Thorsten ; et al. | 2020-12-10 |
Connector block with two sorts of through connections, and electronic device comprising a connector block
Grant 10,217,695 - Meyer , et al. Feb | 2019-02-26 |
Connector block with two sorts of through connections, and electronic device comprising a connector block
App 20170162476 - MEYER; Thorsten ; et al. | 2017-06-08 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 9,601,475 - Brunnbauer , et al. March 21, 2 | 2017-03-21 |
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips
App 20160163682 - Brunnbauer; Markus ; et al. | 2016-06-09 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 9,293,423 - Brunnbauer , et al. March 22, 2 | 2016-03-22 |
Semiconductor packages with integrated antenna and method of forming thereof
Grant 8,952,521 - Wojnowski , et al. February 10, 2 | 2015-02-10 |
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips
App 20140332937 - Brunnbauer; Markus ; et al. | 2014-11-13 |
Semiconductor device and manufacturing method
Grant 8,779,583 - Pressel , et al. July 15, 2 | 2014-07-15 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 8,779,563 - Brunnbauer , et al. July 15, 2 | 2014-07-15 |
Semiconductor Packages with Integrated Antenna and Method of Forming Thereof
App 20140110840 - Wojnowski; Maciej ; et al. | 2014-04-24 |
Method and system for routing electrical connections of semiconductor chips
Grant 8,598,709 - Meyer , et al. December 3, 2 | 2013-12-03 |
Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
App 20130228904 - Brunnbauer; Markus ; et al. | 2013-09-05 |
Semiconductor device and manufacturing method
Grant 8,338,936 - Pressel , et al. December 25, 2 | 2012-12-25 |
Semiconductor Device And Manufacturing Method
App 20120319304 - Pressel; Klaus ; et al. | 2012-12-20 |
Embedded Chip Package
App 20120287583 - Pressel; Klaus ; et al. | 2012-11-15 |
Structure for electrostatic discharge in embedded wafer level packages
Grant 8,309,454 - Brunnbauer , et al. November 13, 2 | 2012-11-13 |
Embedded chip package
Grant 8,237,259 - Pressel , et al. August 7, 2 | 2012-08-07 |
Method And System For Routing Electrical Connections Of Semiconductor Chips
App 20120049375 - MEYER; Thorsten ; et al. | 2012-03-01 |
Method of manufacturing a stacked die module
Grant 7,910,404 - Pressel , et al. March 22, 2 | 2011-03-22 |
Semiconductor module including components in plastic casing
Grant 7,863,728 - Beer , et al. January 4, 2 | 2011-01-04 |
Stacked semiconductor chips
Grant 7,858,440 - Pressel , et al. December 28, 2 | 2010-12-28 |
Singulating semiconductor wafers to form semiconductor chips
Grant 7,799,659 - Pressel , et al. September 21, 2 | 2010-09-21 |
Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof
Grant 7,692,588 - Beer , et al. April 6, 2 | 2010-04-06 |
Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
Grant 7,687,895 - Brunnbauer , et al. March 30, 2 | 2010-03-30 |
Method Of Manufacturing A Stacked Die Module
App 20100062563 - Pressel; Klaus ; et al. | 2010-03-11 |
Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
Grant 7,659,618 - Dangelmaier , et al. February 9, 2 | 2010-02-09 |
Semiconductor Device And Manufacturing Method
App 20100019370 - Pressel; Klaus ; et al. | 2010-01-28 |
Stacked Semiconductor Chips
App 20090079090 - Pressel; Klaus ; et al. | 2009-03-26 |
Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
Grant 7,504,711 - Beer , et al. March 17, 2 | 2009-03-17 |
Embedded Chip Package
App 20080308917 - Pressel; Klaus ; et al. | 2008-12-18 |
Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
App 20080265383 - Brunnbauer; Markus ; et al. | 2008-10-30 |
Semiconductor Module Including Components in Plastic Casing
App 20080105966 - Beer; Gottfried ; et al. | 2008-05-08 |
Singulating Semiconductor Wafers To Form Semiconductor Chips
App 20070293020 - Pressel; Klaus ; et al. | 2007-12-20 |
Substrate with Strip Conductors and Production of Strip Conductors on Substrates for Semiconductor Components
App 20070210883 - Beer; Gottfried ; et al. | 2007-09-13 |
Flexible rewiring plate for semiconductor components, and process for producing it
Grant 7,268,423 - Beer , et al. September 11, 2 | 2007-09-11 |
Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
App 20070023896 - Dangelmaier; Jochen ; et al. | 2007-02-01 |
Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof
App 20070026567 - Beer; Gottfried ; et al. | 2007-02-01 |
Flexible rewiring plate for semiconductor components, and process for producing it
App 20050142933 - Beer, Gottfried ; et al. | 2005-06-30 |
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