Preda; Francesco

Patent Applications and Registrations

Patent applications and USPTO patent grants for Preda; Francesco.The latest application filed is for "thin film capacitors for core and adjacent build up layers".

Company Profile

8.12.12

Preda; Francesco - New Braunfels TX
Preda; Francesco - Mozzo IT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thin film capacitors for core and adjacent build up layers Grant 11,388,821 - Arvin , et al. July 12, 2	2022-07-12
Semiconductor package metal shadowing checks Grant 10,956,649 - Call , et al. March 23, 2	2021-03-23
Thin Film Capacitors For Core And Adjacent Build Up Layers App 20200245466 - Kind Code	2020-07-30
Thin film capacitors for core and adjacent build up layers Grant 10,660,209 - Arvin , et al.	2020-05-19
Dedicated Integrated Circuit Chip Carrier Plane Connected to Decoupling Capacitor(s) App 20200075468 - Arvin; Charles L. ; et al.	2020-03-05
Semiconductor Package Metal Shadowing Checks App 20190377850 - Call; Anson J. ; et al.	2019-12-12
Semiconductor package metal shadowing checks Grant 10,423,752 - Call , et al. Sept	2019-09-24
Thin Film Capacitors For Core And Adjacent Build Up Layers App 20190150287 - Arvin; Charles L. ; et al.	2019-05-16
Semiconductor Package Metal Shadowing Checks App 20190102506 - Call; Anson J. ; et al.	2019-04-04
Fabrication method for circuit substrate having post-fed die side power supply connections Grant 8,722,536 - Douriet , et al. May 13, 2	2014-05-13
Continuously referencing signals over multiple layers in laminate packages Grant 8,716,851 - Preda , et al. May 6, 2	2014-05-06
Fabrication Method For Circuit Substrate Having Post-fed Die Side Power Supply Connections App 20130316534 - Douriet; Daniel ; et al.	2013-11-28
Fabrication method for circuit substrate having post-fed die side power supply connections Grant 8,586,476 - Douriet , et al. November 19, 2	2013-11-19
Continuously Referencing Signals Over Multiple Layers in Laminate Packages App 20120174047 - Preda; Francesco ; et al.	2012-07-05
Continuously referencing signals over multiple layers in laminate packages Grant 8,158,461 - Preda , et al. April 17, 2	2012-04-17
Circuit substrate having post-fed die side power supply connections Grant 7,863,724 - Douriet , et al. January 4, 2	2011-01-04
Fabrication Method For Circuit Substrate Having Post-fed Die Side Power Supply Connections App 20100330797 - Douriet; Daniel ; et al.	2010-12-30
Continuously Referencing Signals Over Multiple Layers in Laminate Packages App 20090256253 - Preda; Francesco ; et al.	2009-10-15
Circuit Substrate Having Post-Fed Die Side Power Supply Connections App 20090200074 - Douriet; Daniel ; et al.	2009-08-13
Continuously Referencing Signals over Multiple Layers in Laminate Packages App 20080093726 - Preda; Francesco ; et al.	2008-04-24
Electronic device carrier adapted for transmitting high frequency signals Grant 7,015,574 - Alcoe , et al. March 21, 2	2006-03-21
Electronic device carrier adapted for transmitting high frequency signals App 20050006137 - Alcoe, Dave ; et al.	2005-01-13

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