| Patent | Date |
|---|
Methods For Forming Conductive Vias, And Associated Devices And Systems
App 20220208606 - Gawai; Trupti D. ; et al. | 2022-06-30 |
Wafer Overlay Marks, Overlay Measurement Systems, And Related Methods
App 20210193493 - Frost; Denzil S. ; et al. | 2021-06-24 |
Pass-through interconnect structure for microelectronic dies and associated systems and methods
Grant 10,020,287 - Pratt , et al. July 10, 2 | 2018-07-10 |
Stacked semiconductor devices
Grant 9,842,806 - Pratt December 12, 2 | 2017-12-12 |
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices
App 20170317028 - Pratt; David S. | 2017-11-02 |
Semiconductor devices with recessed interconnects
Grant 9,711,457 - Pratt July 18, 2 | 2017-07-18 |
Pass-through Interconnect Structure For Microelectronic Dies And Associated Systems And Methods
App 20160086926 - Pratt; David S. ; et al. | 2016-03-24 |
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices
App 20160013134 - Pratt; David S. | 2016-01-14 |
Pass-through 3D interconnect for microelectronic dies and associated systems and methods
Grant 9,209,158 - Pratt , et al. December 8, 2 | 2015-12-08 |
Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
Grant 9,209,166 - Pratt December 8, 2 | 2015-12-08 |
Semiconductor Assemblies, Stacked Semiconductor Devices, And Methods Of Manufacturing Semiconductor Assemblies And Stacked Semiconductor Devices
App 20150194415 - Pratt; David S. | 2015-07-09 |
Semiconductor devices including a through-substrate conductive member with an exposed end
Grant 9,054,165 - Pratt June 9, 2 | 2015-06-09 |
Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
Grant 8,994,163 - Pratt March 31, 2 | 2015-03-31 |
Semiconductor structures including sub-resolution alignment marks
Grant 8,853,868 - Pratt , et al. October 7, 2 | 2014-10-07 |
Surface depressions for die-to-die interconnects and associated systems and methods
Grant 8,766,458 - Pratt July 1, 2 | 2014-07-01 |
Semiconductor Structures Including Sub-resolution Alignment Marks
App 20140048953 - Pratt; David S. ; et al. | 2014-02-20 |
Methods for fabricating sub-resolution alignment marks on semiconductor structures
Grant 8,585,915 - Pratt , et al. November 19, 2 | 2013-11-19 |
Semiconductor Assemblies, Stacked Semiconductor Devices, And Methods Of Manufacturing Semiconductor Assemblies And Stacked Semiconductor Devices
App 20130134605 - Pratt; David S. | 2013-05-30 |
Surface Depressions For Die-to-die Interconnects And Associated Systems And Methods
App 20130075898 - Pratt; David S. | 2013-03-28 |
Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
Grant 8,367,471 - Pratt February 5, 2 | 2013-02-05 |
Surface depressions for die-to-die interconnects and associated systems
Grant 8,314,497 - Pratt November 20, 2 | 2012-11-20 |
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices
App 20120217652 - Pratt; David S. | 2012-08-30 |
Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices
Grant 8,193,092 - Pratt June 5, 2 | 2012-06-05 |
Pass-through 3d Interconnect For Microelectronic Dies And Associated Systems And Methods
App 20120094443 - Pratt; David S. ; et al. | 2012-04-19 |
Pass-through 3D interconnect for microelectronic dies and associated systems and methods
Grant 8,084,854 - Pratt , et al. December 27, 2 | 2011-12-27 |
System including semiconductor components having through interconnects and back side redistribution conductors
Grant 7,952,170 - Pratt May 31, 2 | 2011-05-31 |
Surface Depressions For Die-to-die Interconnects And Associated Systems And Methods
App 20100320600 - Pratt; David S. | 2010-12-23 |
System Including Semiconductor Components Having Through Interconnects And Back Side Redistribution Conductors
App 20100284139 - Pratt; David S. | 2010-11-11 |
Surface depressions for die-to-die interconnects and associated systems and methods
Grant 7,800,238 - Pratt September 21, 2 | 2010-09-21 |
Semiconductor components having through interconnects and backside redistribution conductors
Grant 7,781,868 - Pratt August 24, 2 | 2010-08-24 |
Channel For A Semiconductor Die And Methods Of Formation
App 20100052157 - Pratt; David S. | 2010-03-04 |
Surface Depressions For Die-to-die Interconnects And Associated Systems And Methods
App 20090321947 - Pratt; David S. | 2009-12-31 |
Pass-through 3d Interconnect For Microelectronic Dies And Associated Systems And Methods
App 20090166846 - Pratt; David S. ; et al. | 2009-07-02 |
Semiconductor Components Having Through Interconnects And Backside Redistribution Conductors
App 20090152703 - Pratt; David S. | 2009-06-18 |
Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors
Grant 7,531,443 - Pratt May 12, 2 | 2009-05-12 |
Methods For Fabricating Sub-resolution Alignment Marks On Semiconductor Structures And Semiconductor Structures Including Same
App 20090110878 - Pratt; David S. ; et al. | 2009-04-30 |
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices
App 20090032960 - Pratt; David S. | 2009-02-05 |
Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors
App 20080138975 - Pratt; David S. | 2008-06-12 |
Mount for supporting a microphone on a helmet
Grant 5,590,209 - Pratt , et al. December 31, 1 | 1996-12-31 |
Biopsy device
Grant 4,249,541 - Pratt February 10, 1 | 1981-02-10 |
Status System
Grant 3,675,204 - Miehle , et al. July 4, 1 | 1972-07-04 |
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