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Compound parabolic concentrator including protrusion
Grant 11,156,815 - Chiu , et al. October 26, 2 | 2021-10-26 |
Coupling a magnet with a MEMS device
Grant 11,022,792 - Yazzie , et al. June 1, 2 | 2021-06-01 |
Dual Collimating Lens Configuration For Optical Devices
App 20200348498 - Chiu; Chia-Pin ; et al. | 2020-11-05 |
Systems and methods for electromagnetic interference shielding
Grant 10,615,128 - Dias , et al. | 2020-04-07 |
Compound Parabolic Concentrator Including Protrusion
App 20200073099 - Chiu; Chia-Pin ; et al. | 2020-03-05 |
Coupling A Magnet With A Mems Device
App 20190391386 - Yazzie; Kyle ; et al. | 2019-12-26 |
Apparatus and system for storing and transporting magnetic devices
Grant 10,315,200 - Abebaw , et al. | 2019-06-11 |
Apparatus And System For Stroring And Transporting Magnetic Devices
App 20190001342 - Abebaw; Amanuel M. ; et al. | 2019-01-03 |
Coupling Optoelectronic Components Using Templated Pressure Sensitive Adhesive Films
App 20190002735 - Gupta; Mohit ; et al. | 2019-01-03 |
Coated probe tips for plunger pins of an integrated circuit package test system
Grant 10,168,357 - Yin , et al. J | 2019-01-01 |
Flat Non-optical Surface Of An Optical Component
App 20180364438 - Sun; Yang ; et al. | 2018-12-20 |
Conductive Adhesive Layer For Semiconductor Devices And Packages
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Shielding For Semiconductor Optoelectronic Devices And Packages
App 20180235075 - Gaines; Taylor ; et al. | 2018-08-16 |
Package structure to enhance yield of TMI interconnections
Grant 10,049,971 - De Bonis , et al. August 14, 2 | 2018-08-14 |
Systems And Methods For Electromagnetic Interference Shielding
App 20180226358 - Dias; Rajendra C. ; et al. | 2018-08-09 |
Conductive Adhesive Layer For Semiconductor Devices And Packages
App 20180190593 - GAINES; Taylor ; et al. | 2018-07-05 |
Semiconductor package having an EMI shielding layer
Grant 9,991,211 - Prakash , et al. June 5, 2 | 2018-06-05 |
Systems and methods for electromagnetic interference shielding
Grant 9,953,929 - Dias , et al. April 24, 2 | 2018-04-24 |
Semiconductor Package Having An Emi Shielding Layer
App 20170287851 - Prakash; Anna M. ; et al. | 2017-10-05 |
Systems And Methods For Eloectromagnetic Interference Shielding
App 20170271270 - Dias; Rajendra C. ; et al. | 2017-09-21 |
Modular Squeegee Head Apparatus For Printing Materials
App 20170266948 - Heppner; Joshua D. ; et al. | 2017-09-21 |
Perforated Conductive Material For Emi Shielding Of Semiconductor Device And Components
App 20170250145 - Dias; Rajendra C. ; et al. | 2017-08-31 |
Package Structure To Enhance Yield of TMI Interconnections
App 20170207152 - De Bonis; Thomas J. ; et al. | 2017-07-20 |
Perforated conductive material for EMI shielding of semiconductor device and components
Grant 9,704,811 - Dias , et al. July 11, 2 | 2017-07-11 |
Perforated Conductive Material For Emi Shielding Of Semiconductor Device And Components
App 20170179040 - Dias; Rajendra C. ; et al. | 2017-06-22 |
Coated Probe Tips for Plunger Pins of an Integrated Circuit Package Test System
App 20170176495 - Yin; Wen ; et al. | 2017-06-22 |
Semiconductor package having an EMI shielding layer
Grant 9,685,413 - Prakash , et al. June 20, 2 | 2017-06-20 |
Methods of forming wafer level underfill materials and structures formed thereby
Grant 9,631,065 - Prakash , et al. April 25, 2 | 2017-04-25 |
Package structure to enhance yield of TMI interconnections
Grant 9,613,933 - De Bonis , et al. April 4, 2 | 2017-04-04 |
Package Structure To Enhance Yield of TMI Interconnections
App 20150255415 - De Bonis; Thomas J. ; et al. | 2015-09-10 |
Methods Of Forming Wafer Level Underfill Materials And Structures Formed Thereby
App 20140264827 - Prakash; Anna M. ; et al. | 2014-09-18 |
Apparatus and methods of forming an interconnect between a workpiece and substrate
Grant 8,183,697 - Supriya , et al. May 22, 2 | 2012-05-22 |
Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate
App 20110074023 - Supriya; Lakshmi ; et al. | 2011-03-31 |
Apparatus and methods of forming an interconnect between a workpiece and substrate
Grant 7,843,075 - Supriya , et al. November 30, 2 | 2010-11-30 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
Grant 7,776,657 - Dani , et al. August 17, 2 | 2010-08-17 |
Amphiphilic block copolymers for improved flux application
Grant 7,651,020 - Shekhawat , et al. January 26, 2 | 2010-01-26 |
Apparatus and methods of forming an interconnect between a workpiece and substrate
App 20090273914 - Supriya; Lakshmi ; et al. | 2009-11-05 |
Amphiphilic Block Copolymers For Improved Flux Application
App 20090169721 - SHEKHAWAT; Linda A. ; et al. | 2009-07-02 |
Solder Flux Composition And Process Of Using Same
App 20080156852 - Prakash; Anna M. | 2008-07-03 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
Grant 7,332,807 - Dani , et al. February 19, 2 | 2008-02-19 |
Solder flux composition
App 20070284412 - Prakash; Anna M. ; et al. | 2007-12-13 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
App 20070158823 - Dani; Ashay A. ; et al. | 2007-07-12 |
Chip package dielectric sheet for body-biasing
App 20070152325 - Dani; Ashay A. ; et al. | 2007-07-05 |
Chemical sensors featuring dual-sensing motifs
App 20070031292 - Booksh; Karl S. ; et al. | 2007-02-08 |
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