Prabhu; Ashok Narayan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Prabhu; Ashok Narayan.The latest application filed is for "low temperature co-fired ceramic-metal packaging technology".

Company Profile

0.14.1

Prabhu; Ashok Narayan - East Windsor NJ
Prabhu; Ashok Narayan - East Windson NJ
Prabhu; Ashok Narayan - Mercer NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low temperature co-fired ceramic-metal packaging technology Grant 6,713,862 - Palanisamy , et al. March 30, 2	2004-03-30
Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate Grant 6,709,749 - Kumar , et al. March 23, 2	2004-03-23
Low temperature co-fired ceramic-metal packaging technology App 20030034564 - Palanisamy, Ponnusamy ; et al.	2003-02-20
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology Grant 6,455,930 - Palanisamy , et al. September 24, 2	2002-09-24
Method for fabricating double sided ceramic circuit boards using a titanium support substrate Grant 6,286,204 - Sreeram , et al. September 11, 2	2001-09-11
Back panel for a plasma display device Grant 6,168,490 - Hozer , et al. January 2, 2	2001-01-02
Low dielectric loss glasses Grant 6,017,642 - Kumar , et al. January 25, 2	2000-01-25
Miniature power supply Grant 6,011,330 - Goodman , et al. January 4, 2	2000-01-04
Low dielectric loss glass ceramic compositions Grant 5,958,807 - Kumar , et al. September 28, 1	1999-09-28
Multilayer ceramic circuit boards including embedded capacitors Grant 5,953,203 - Tormey , et al. September 14, 1	1999-09-14
Mounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electronic display Grant 5,880,705 - Onyskevych , et al. March 9, 1	1999-03-09
Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate Grant 5,876,536 - Kumar , et al. March 2, 1	1999-03-02
Method to control cavity dimensions of fired multilayer circuit boards on a support Grant 5,858,145 - Sreeram , et al. January 12, 1	1999-01-12
Electronic circuit chip package Grant 5,847,935 - Thaler , et al. December 8, 1	1998-12-08
Tessellated electroluminescent display having a multilayer ceramic substrate Grant 5,644,327 - Onyskevych , et al. July 1, 1	1997-07-01

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