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Patent applications and USPTO patent grants for Prabhu; Ashok N..The latest application filed is for "method of adhering green tape to a metal support substrate with a bonding glass".
Patent | Date |
---|---|
Method of adhering green tape to a metal support substrate with a bonding glass Grant 5,581,876 - Prabhu , et al. December 10, 1 | 1996-12-10 |
Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board Grant 5,277,724 - Prabhu January 11, 1 | 1994-01-11 |
Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging Grant 5,256,469 - Cherukuri , et al. October 26, 1 | 1993-10-26 |
Manufacture of printed circuit boards Grant 5,035,939 - Conlon , et al. July 30, 1 | 1991-07-30 |
Thick film copper conductor inks Grant 4,880,567 - Prabhu , et al. November 14, 1 | 1989-11-14 |
Via fill ink composition for integrated circuits Grant 4,863,517 - Hang , et al. September 5, 1 | 1989-09-05 |
Thick film copper conductor inks Grant 4,816,615 - Prabhu , et al. March 28, 1 | 1989-03-28 |
Dielectric inks for multilayer copper circuits Grant 4,808,673 - Hang , et al. February 28, 1 | 1989-02-28 |
Ceramic filled glass dielectrics Grant 4,772,574 - Hang , et al. September 20, 1 | 1988-09-20 |
Thick film copper conductor inks Grant 4,733,018 - Prabhu , et al. March 22, 1 | 1988-03-22 |
Method of fabricating thick film electrical components Grant 4,619,836 - Prabhu , et al. October 28, 1 | 1986-10-28 |
Air-fireable thick film inks Grant 4,415,624 - Prabhu , et al. November 15, 1 | 1983-11-15 |
Low value resistor inks Grant 4,379,195 - Prabhu , et al. April 5, 1 | 1983-04-05 |
Overglaze inks Grant 4,377,642 - Prabhu , et al. March 22, 1 | 1983-03-22 |
Conductor inks Grant 4,376,725 - Prabhu , et al. March 15, 1 | 1983-03-15 |
Crossover dielectric inks Grant 4,369,254 - Prabhu , et al. January 18, 1 | 1983-01-18 |
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