loadpatents
name:-0.0099978446960449
name:-0.0092790126800537
name:-0.00066208839416504
Power Gold LLC Patent Filings

Power Gold LLC

Patent Applications and Registrations

Patent applications and USPTO patent grants for Power Gold LLC.The latest application filed is for "flexible electronic assembly and method of manufacturing the same".

Company Profile
0.10.8
  • Power Gold LLC - Phoenix AZ
  • Power Gold LLC; - US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Inductor, transformer, and method
Grant 9,799,448 - Wang October 24, 2
2017-10-24
Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly
Grant 9,668,352 - Wang , et al. May 30, 2
2017-05-30
Intelligent lighting system
Grant 9,282,596 - Wang March 8, 2
2016-03-08
Flexible electronic assembly and method of manufacturing the same
Grant 8,998,454 - Wang , et al. April 7, 2
2015-04-07
Integrated nano-farad capacitors and method of formation
Grant 8,890,287 - Wang November 18, 2
2014-11-18
Flexible circuit assembly and method thereof
Grant 8,879,276 - Wang November 4, 2
2014-11-04
Method Of Embedding A Pre-assembled Unit Including A Device Into A Flexible Printed Circuit And Corresponding Assembly
App 20140268594 - WANG; James Jen-Ho ;   et al.
2014-09-18
Flexible Electronic Assembly And Method Of Manufacturing The Same
App 20140268780 - WANG; James Jen-Ho ;   et al.
2014-09-18
Intelligent lighting system
App 20140167618 - Wang; James Jen-Ho
2014-06-19
Flexible circuit assembly and method thereof
App 20120320532 - Wang; James Jen-Ho
2012-12-20
Semiconductor bond pad patterns and method of formation
Grant 8,153,510 - Wang April 10, 2
2012-04-10
Programmable anti-fuse wire bond pads
App 20120061796 - Wang; James Jen-Ho
2012-03-15
Integrated nano-farad capacitors and method of formation
App 20100301452 - Wang; James Jen-Ho
2010-12-02
Semiconductor bond pad patterns and method of formation
App 20100279489 - Wang; James Jen-Ho
2010-11-04
Company Registrations

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