Powell; Kirk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Powell; Kirk.The latest application filed is for "leadless integrated circuit package having standoff contacts and die attach pad".

Company Profile

0.7.5

Powell; Kirk - Greeley CO

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Leadless integrated circuit package having standoff contacts and die attach pad Grant 9,305,889 - Powell , et al. April 5, 2	2016-04-05
Leadless Integrated Circuit Package Having Standoff Contacts And Die Attach Pad App 20140367865 - POWELL; Kirk ; et al.	2014-12-18
Leadless array plastic package with various IC packaging configurations Grant 8,828,801 - McMillan , et al. September 9, 2	2014-09-09
Leadless integrated circuit package having standoff contacts and die attach pad Grant 8,736,037 - Powell , et al. May 27, 2	2014-05-27
Leadless Array Plastic Package With Various Ic Packaging Configurations App 20130273692 - MCMILLAN; John ; et al.	2013-10-17
Leadless array plastic package with various IC packaging configurations Grant 8,486,762 - McMillan , et al. July 16, 2	2013-07-16
Leadless Array Plastic Package With Various Ic Packaging Configurations App 20120052631 - Mcmillan; John ; et al.	2012-03-01
Leadless integrated circuit package having standoff contacts and die attach pad Grant 7,858,443 - Powell , et al. December 28, 2	2010-12-28
Leadless Integrated Circuit Package Having Standoff Contacts And Die Attach Pad App 20100224970 - POWELL; Kirk ; et al.	2010-09-09
Leadless Integrated Circuit Package Having Standoff Contacts And Die Attach Pad App 20100224972 - POWELL; Kirk ; et al.	2010-09-09

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