Potdar; Vishwavasu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Potdar; Vishwavasu.The latest application filed is for "bulk acoustic wave device with wafer level packaging".
- Potdar; Vishwavasu - Plano TX
| Patent | Date |
|---|---|
| Copper pillar bump pad structure for BAW devices Grant 10,601,396 - Stokes , et al. | 2020-03-24 |
| Bulk Acoustic Wave Device With Wafer Level Packaging App 20170244380 - Stokes; Paul ; et al. | 2017-08-24 |
| Cap Structure For Wafer Level Package App 20170207766 - Stokes; Paul ; et al. | 2017-07-20 |
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