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Patent applications and USPTO patent grants for Posthill; John.The latest application filed is for "structures with through-substrate vias and methods for forming the same".
Patent | Date |
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Structures With Through-substrate Vias And Methods For Forming The Same App 20220246497 - Fountain, JR.; Gaius Gillman ;   et al. | 2022-08-04 |
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics Grant 7,997,087 - Venkatasubramanian , et al. August 16, 2 | 2011-08-16 |
Thin film thermoelectric devices for power conversion and cooling App 20100257871 - Venkatasubramanian; Rama ;   et al. | 2010-10-14 |
Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics App 20090282852 - Venkatasubramanian; Rama ;   et al. | 2009-11-19 |
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics Grant 7,523,617 - Venkatasubramanian , et al. April 28, 2 | 2009-04-28 |
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics App 20060086118 - Venkatasubramanian; Rama ;   et al. | 2006-04-27 |
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