Portuondo; Maria M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Portuondo; Maria M..The latest application filed is for "backplane system having high-density electrical connectors".
- Portuondo; Maria M. - Boca Raton FL
- Portuondo; Maria M. - Delray Beach FL
| Patent | Date |
|---|---|
| Backplane System Having High-density Electrical Connectors App 20100323536 - Crane, JR.; Stanford W. ; et al. | 2010-12-23 |
| Backplane system having high-density electrical connectors Grant 7,803,020 - Crane, Jr. , et al. September 28, 2 | 2010-09-28 |
| Backplane system having high-density electrical connectors App 20080005442 - Crane; Stanford W. JR. ; et al. | 2008-01-03 |
| Semiconductor chip carrier affording a high-density external interface Grant 7,183,646 - Crane, Jr. , et al. February 27, 2 | 2007-02-27 |
| Backplane system having high-density electrical connectors App 20060282593 - Crane; Stanford W. JR. ; et al. | 2006-12-14 |
| Prefabricated semiconductor chip carrier App 20050280158 - Crane, Stanford W. JR. ; et al. | 2005-12-22 |
| Prefabricated semiconductor chip carrier Grant 6,977,432 - Crane, Jr. , et al. December 20, 2 | 2005-12-20 |
| Prefabricated semiconductor chip carrier Grant 6,828,511 - Crane, Jr. , et al. December 7, 2 | 2004-12-07 |
| Prefabricated semiconductor chip carrier App 20040140542 - Crane, Stanford W. JR. ; et al. | 2004-07-22 |
| Semiconductor chip carrier affording a high-density external interface App 20040007774 - Crane, Stanford W. JR. ; et al. | 2004-01-15 |
| Semiconductor chip carrier affording a high-density external interface Grant 6,577,003 - Crane, Jr. , et al. June 10, 2 | 2003-06-10 |
| Modular architecture for high bandwidth computers App 20020166040 - Crane, Stanford W. JR. ; et al. | 2002-11-07 |
| Prefabricated semiconductor chip carrier App 20020053455 - Crane, Stanford W. JR. ; et al. | 2002-05-09 |
| Semiconductor chip carrier affording a high-density external interface Grant 5,892,280 - Crane, Jr. , et al. April 6, 1 | 1999-04-06 |
| Low profile semiconductor die carrier Grant 5,824,950 - Mosley , et al. October 20, 1 | 1998-10-20 |
| Semiconductor die carrier having a dielectric epoxy between adjacent leads Grant 5,821,457 - Mosley , et al. October 13, 1 | 1998-10-13 |
| Contact beam for electrical interconnect component Grant 5,791,947 - Crane, Jr. , et al. August 11, 1 | 1998-08-11 |
| Computer system having a motorized door mechanism Grant 5,781,408 - Crane, Jr. , et al. July 14, 1 | 1998-07-14 |
| Method of manufacturing a semiconductor chip carrier affording a high-density external interface Grant 5,696,027 - Crane, Jr. , et al. December 9, 1 | 1997-12-09 |
| Method of manufacturing an apparatus having inner layers supporting surface-mount components Grant 5,659,953 - Crane, Jr. , et al. August 26, 1 | 1997-08-26 |
| Electrical interconnect system having insulative shrouds for preventing mismating Grant 5,637,019 - Crane, Jr. , et al. June 10, 1 | 1997-06-10 |
| Computer with two fans and two air circulation areas Grant 5,576,931 - Crane, Jr. , et al. November 19, 1 | 1996-11-19 |
| Apparatus having inner layers supporting surface-mount components Grant 5,543,586 - Crane, Jr. , et al. August 6, 1 | 1996-08-06 |
| Semiconductor chip carrier affording a high-density external interface Grant 5,541,449 - Crane, Jr. , et al. July 30, 1 | 1996-07-30 |
| Computer cabinet Grant D369,923 - Crane, Jr. , et al. May 21, 1 | 1996-05-21 |
| Computer cabinet Grant D363,707 - Crane, Jr. , et al. October 31, 1 | 1995-10-31 |
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