Poole; Mark A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Poole; Mark A..The latest application filed is for "electroless methods".

Company Profile

0.7.11

Poole; Mark A. - Shrewsbury MA
Poole, Mark A. - Rugby GB
Poole, Mark A. - Warwickshire GB
Poole; Mark A. - Bilton Rugby GB
Poole; Mark A. - Aurora CO

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of electrolessly depositing metal on the walls of through-holes Grant 7,858,146 - Poole , et al. December 28, 2	2010-12-28
Electroless copper compositions Grant 7,611,569 - Poole , et al. November 3, 2	2009-11-03
Electroless copper and redox couples Grant 7,527,681 - Poole , et al. May 5, 2	2009-05-05
Formaldehyde free electroless copper compositions Grant 7,501,014 - Poole , et al. March 10, 2	2009-03-10
Electroless methods App 20090004382 - Poole; Mark A. ; et al.	2009-01-01
Electroless copper compositions App 20080038452 - Poole; Mark A. ; et al.	2008-02-14
Electroless copper and redox couples App 20080038449 - Poole; Mark A. ; et al.	2008-02-14
Formaldehyde free electroless copper compositions App 20080038451 - Poole; Mark A. ; et al.	2008-02-14
Environmentally friendly electroless copper compositions App 20080038450 - Poole; Mark A. ; et al.	2008-02-14
Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous meterial App 20050214448 - Graves, John E. ; et al.	2005-09-29
Solvent swell for texturing resinous material and desmearing and removing resinous material App 20050214449 - Hirst, Deborah V. ; et al.	2005-09-29
Electroless plating processes Grant 6,861,097 - Goosey , et al. March 1, 2	2005-03-01
Desmear and texturing method App 20040216761 - Cobley, Andrew J. ; et al.	2004-11-04
Combined adhesion promotion and direct metallization process Grant 6,790,334 - Begum , et al. September 14, 2	2004-09-14
Combined adhesion promotion and direct metallization process App 20030047458 - Begum, Zatoon ; et al.	2003-03-13
Compositions containing heterocylcic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material App 20030021887 - Graves, John E. ; et al.	2003-01-30
Solvent swell for texturing resinous material and desmearing and removing resinous material App 20030015498 - Hirst, Deborah V. ; et al.	2003-01-23
Process for decoration by sublimation using heat shrink film Grant 5,962,368 - Poole October 5, 1	1999-10-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.