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Patent applications and USPTO patent grants for Poole; Joseph D..The latest application filed is for "thermoplastic adhesive preform for heat sink attachment".
Patent | Date |
---|---|
Thermoplastic adhesive preform for heat sink attachment Grant 7,645,410 - Davis , et al. January 12, 2 | 2010-01-12 |
Thermoplastic adhesive preform for heat sink attachment Grant 6,893,591 - Davis , et al. May 17, 2 | 2005-05-17 |
Thermoplastic adhesive preform for heat sink attachment App 20050051927 - Davis, John G. ;   et al. | 2005-03-10 |
Method and composition for mounting an electronic component and device formed therewith App 20040003882 - Davis, John G. ;   et al. | 2004-01-08 |
Rework and underfill nozzle for electronic components Grant 6,499,644 - Cox , et al. December 31, 2 | 2002-12-31 |
Thermoplastic adhesive preform for heat sink attachment App 20020174947 - Davis, John G. ;   et al. | 2002-11-28 |
Rework and underfill nozzle for electronic components App 20020117535 - Cox, Wilton L. ;   et al. | 2002-08-29 |
Thermoplastic adhesive preform for heat sink attachment Grant 6,432,511 - Davis , et al. August 13, 2 | 2002-08-13 |
Rework and underfill nozzle for electronic components App 20010006185 - Cox, Wilton L. ;   et al. | 2001-07-05 |
Rework and underfill nozzle for electronic components App 20010004990 - Cox, Wilton L. ;   et al. | 2001-06-28 |
Wire mesh insert for thermal adhesives Grant 6,043,110 - Davis , et al. March 28, 2 | 2000-03-28 |
Wire mesh insert for thermal adhesives Grant 5,940,687 - Davis , et al. August 17, 1 | 1999-08-17 |
Fluorescent water soluble solder flux Grant 5,932,031 - Hamilton , et al. August 3, 1 | 1999-08-03 |
Fluorescent water soluble solder flux Grant 5,820,697 - Hamilton , et al. October 13, 1 | 1998-10-13 |
Method and apparatus for manufacture of printed circuit cards Grant 5,394,609 - Ferguson , et al. March 7, 1 | 1995-03-07 |
Ozone safe stripping solution for thermal grease Grant 5,190,595 - Ameen , et al. March 2, 1 | 1993-03-02 |
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