Poo; Chia Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Poo; Chia Yong.The latest application filed is for "microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods".

Company Profile

0.39.52

Poo; Chia Yong - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged microelectronic components with terminals exposed through encapsulant Grant 8,637,973 - Koon , et al. January 28, 2	2014-01-28
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 8,629,054 - Jeung , et al. January 14, 2	2014-01-14
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20120241957 - Koon; Eng Meow ; et al.	2012-09-27
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20120241982 - Jeung; Boon Suan ; et al.	2012-09-27
Interconnects For Packaged Semiconductor Devices And Methods For Manufacturing Such Devices App 20120211896 - Jeung; Boon Suan ; et al.	2012-08-23
Stacked semiconductor package having discrete components Grant 8,174,105 - Kwang , et al. May 8, 2	2012-05-08
Apparatus and method for packaging circuits Grant 8,138,617 - Poo , et al. March 20, 2	2012-03-20
Apparatus and method for packaging circuits Grant 8,115,306 - Poo , et al. February 14, 2	2012-02-14
Stacked Semiconductor Package Having Discrete Components App 20110215438 - Kwang; Chua Swee ; et al.	2011-09-08
Castellation wafer level packaging of integrated circuit chips Grant 8,008,126 - Jeung , et al. August 30, 2	2011-08-30
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20110175206 - Kwang; Chua Swee ; et al.	2011-07-21
Semiconductor package having discrete components and system containing the package Grant 7,964,946 - Kwang , et al. June 21, 2	2011-06-21
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Grant 7,947,529 - Koon , et al. May 24, 2	2011-05-24
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20110084402 - Jeung; Boon Suan ; et al.	2011-04-14
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20110068454 - Koon; Eng Meow ; et al.	2011-03-24
Semiconductor Package Having Discrete Components And System Containing The Package App 20110012253 - Kwang; Chua Swee ; et al.	2011-01-20
Packaged Integrated Circuit Devices With Through-body Conductive Vias, And Methods Of Making Same App 20100320585 - Jiang; Tongbi ; et al.	2010-12-23
Method for fabricating semiconductor packages with discrete components Grant 7,807,502 - Kwang , et al. October 5, 2	2010-10-05
Packaged integrated circuit devices with through-body conductive vias, and methods of making same Grant 7,781,877 - Jiang , et al. August 24, 2	2010-08-24
Method For Fabricating Semiconductor Packages With Discrete Components App 20100203677 - Kwang; Chua Swee ; et al.	2010-08-12
Apparatus And Method For Packaging Circuits App 20100140794 - Poo; Chia Yong ; et al.	2010-06-10
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20100133662 - Kwang; Chua Swee ; et al.	2010-06-03
Semiconductor package having die with recess and discrete component embedded within the recess Grant 7,723,831 - Kwang , et al. May 25, 2	2010-05-25
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20100068851 - Jeung; Boon Suan ; et al.	2010-03-18
Castellation wafer level packaging of integrated circuit chips Grant 7,679,179 - Jeung , et al. March 16, 2	2010-03-16
Apparatus and method for packaging circuits Grant 7,675,169 - Poo , et al. March 9, 2	2010-03-09
Castellation wafer level packaging of integrated circuit chips Grant 7,528,477 - Jeung , et al. May 5, 2	2009-05-05
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20090057843 - Kwang; Chua Swee ; et al.	2009-03-05
Microelectronic Die Packages With Leadframes, Including Leadframe-based Interposer For Stacked Die Packages, And Associated Systems And Methods App 20090045489 - Koon; Eng Meow ; et al.	2009-02-19
Packaged Integrated Circuit Devices With Through-body Conductive Vias, And Methods Of Making Same App 20090039523 - Jiang; Tongbi ; et al.	2009-02-12
Semiconductor Dies With Recesses, Associated Leadframes, And Associated Systems And Methods App 20090026592 - Kwang; Chua Swee ; et al.	2009-01-29
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20090026600 - Koon; Eng Meow ; et al.	2009-01-29
Interconnects For Packaged Semiconductor Devices And Methods For Manufacturing Such Devices App 20090014859 - Jeung; Boon Suan ; et al.	2009-01-15
Microelectronic Imagers And Methods For Manufacturing Such Microelectronic Imagers App 20090014822 - Poo; Chia Yong ; et al.	2009-01-15
Semiconductor Packages And Method For Fabricating Semiconductor Packages With Discrete Components App 20080284003 - Kwang; Chua Swee ; et al.	2008-11-20
Method for fabricating packaged die Grant 7,358,154 - Poo , et al. April 15, 2	2008-04-15
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20080067675 - Jeung; Boon Suan ; et al.	2008-03-20
Packaged Microelectronic Components App 20080067642 - Koon; Eng Meow ; et al.	2008-03-20
Support elements for semiconductor devices with peripherally located bond pads Grant 7,285,850 - Poo , et al. October 23, 2	2007-10-23
Castellation wafer level packaging of integrated circuit chips Grant 7,276,387 - Jeung , et al. October 2, 2	2007-10-02
Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions App 20070222053 - Wei; Zhou ; et al.	2007-09-27
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods Grant 7,226,809 - Poo , et al. June 5, 2	2007-06-05
Semiconductor packages having leadframe-based connection arrays App 20070120247 - Yu; Chan Min ; et al.	2007-05-31
Packaged microelectronic components Grant 7,195,957 - Koon , et al. March 27, 2	2007-03-27
In-process semiconductor packages with leadframe grid arrays Grant 7,170,161 - Yu , et al. January 30, 2	2007-01-30
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices Grant 7,115,984 - Poo , et al. October 3, 2	2006-10-03
Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices App 20060208351 - Poo; Chia Yong ; et al.	2006-09-21
Support elements for semiconductor devices with peripherally located bond pads App 20060208350 - Poo; Chia Yong ; et al.	2006-09-21
Apparatus and method for packaging circuits App 20060084240 - Poo; Chia Yong ; et al.	2006-04-20
Castellation wafer level packaging of integrated circuit chips App 20060014319 - Jeung; Boon Suan ; et al.	2006-01-19
Castellation wafer level packaging of integrated circuit chips App 20060006519 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060008946 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060001142 - Jeung; Boon Suan ; et al.	2006-01-05
Methods for making semiconductor packages with leadframe grid arrays Grant 6,967,127 - Yu , et al. November 22, 2	2005-11-22
Methods for making semiconductor packages with leadframe grid arrays App 20050230808 - Yu, Chan Min ; et al.	2005-10-20
Castellation wafer level packaging of integrated circuit chips Grant 6,949,407 - Jeung , et al. September 27, 2	2005-09-27
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20050130345 - Jeung, Boon Suan ; et al.	2005-06-16
Apparatus and method for packaging circuits Grant 6,894,386 - Poo , et al. May 17, 2	2005-05-17
Castellation wafer level packaging of integrated circuit chips Grant 6,855,572 - Jeung , et al. February 15, 2	2005-02-15
Apparatus and method for packaging circuits App 20050029668 - Poo, Chia Yong ; et al.	2005-02-10
Packaged microelectronic components App 20050026325 - Koon, Eng Meow ; et al.	2005-02-03
Multi-substrate microelectronic packages and methods for manufacture Grant 6,841,418 - Jeung , et al. January 11, 2	2005-01-11
Packaged microelectronic components Grant 6,836,009 - Koon , et al. December 28, 2	2004-12-28
Semiconductor packages with leadframe grid arrays and components Grant 6,836,008 - Yu , et al. December 28, 2	2004-12-28
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages Grant 6,818,977 - Poo , et al. November 16, 2	2004-11-16
Multi-substrate microelectronic packages and methods for manufacture App 20040183207 - Jeung, Boon Suan ; et al.	2004-09-23
Apparatus and method for leadless packaging of semiconductor devices Grant 6,790,706 - Jeung , et al. September 14, 2	2004-09-14
Apparatus and method for leadless packaging of semiconductor devices Grant 6,787,894 - Jeung , et al. September 7, 2	2004-09-07
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices App 20040124523 - Poo, Chia Yong ; et al.	2004-07-01
Multi-substrate microelectronic packages and methods for manufacture Grant 6,750,547 - Jeung , et al. June 15, 2	2004-06-15
Apparatus and method for leadless packaging of semiconductor devices Grant 6,747,348 - Jeung , et al. June 8, 2	2004-06-08
Apparatus and method for leadless packaging of semiconductor devices Grant 6,743,696 - Jeung , et al. June 1, 2	2004-06-01
Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods Grant 6,727,116 - Poo , et al. April 27, 2	2004-04-27
Castellation wafer level packaging of integrated circuit chips App 20040043535 - Jeung, Boon Suan ; et al.	2004-03-04
Packaged microelectronic components App 20040026773 - Koon, Eng Meow ; et al.	2004-02-12
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods App 20030232462 - Poo, Chia Yong ; et al.	2003-12-18
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods App 20030230802 - Poo, Chia Yong ; et al.	2003-12-18
Semiconductor Devices Including Peripherally Located Bond Pads, Assemblies, Packages, And Methods App 20030232460 - Poo, Chia Yong ; et al.	2003-12-18
Semiconductor packages with leadframe grid arrays and components and methods for making the same App 20030193091 - Yu, Chan Min ; et al.	2003-10-16
Methods for making semiconductor packages with leadframe grid arrays App 20030194837 - Yu, Chan Min ; et al.	2003-10-16
Wafer level stackable semiconductor package Grant 6,611,052 - Poo , et al. August 26, 2	2003-08-26
Multi-substrate microelectronic packages and methods for manufacture App 20030116861 - Jeung, Boon Suan ; et al.	2003-06-26
Stackable semiconductor package and wafer level fabrication method Grant 6,582,992 - Poo , et al. June 24, 2	2003-06-24
Stackable semiconductor package and wafer level fabrication method App 20030094683 - Poo, Chia Yong ; et al.	2003-05-22
Stackable Semiconductor Package And Wafer Level Fabrication Method App 20030096454 - Poo, Chia Yong ; et al.	2003-05-22
Apparatus and method for leadless packaging of semiconductor devices App 20030080403 - Jeung, Boon Suan ; et al.	2003-05-01
Apparatus and method for leadless packaging of semiconductor devices App 20030071341 - Jeung, Boon Suan ; et al.	2003-04-17
Apparatus and method for leadless packaging of semiconductor devices App 20030071338 - Jeung, Boon Suan ; et al.	2003-04-17
Apparatus And Method For Leadless Packaging Of Semiconductor Devices App 20030071335 - Jeung, Boon Suan ; et al.	2003-04-17