Ponnuswamy; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ponnuswamy; Thomas.The latest application filed is for "copper electrodeposition sequence for the filling of cobalt lined features".

Company Profile

3.10.12

Ponnuswamy; Thomas - Sherwood OR
Ponnuswamy; Thomas - Tualatin OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper electrodeposition sequence for the filling of cobalt lined features Grant 10,930,511 - Velmurugan , et al. February 23, 2	2021-02-23
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating Grant 10,662,545 - Mayer , et al.	2020-05-26
Copper Electrodeposition On Cobalt Lined Features App 20190301040 - Velmurugan; Jeyavel ; et al.	2019-10-03
Copper Electrodeposition Sequence For The Filling Of Cobalt Lined Features App 20190304789 - Velmurugan; Jeyavel ; et al.	2019-10-03
Methods and apparatuses for cleaning electroplating substrate holders Grant 10,092,933 - Kumar , et al. October 9, 2	2018-10-09
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating App 20180105949 - Mayer; Steven T. ; et al.	2018-04-19
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating Grant 9,834,852 - Mayer , et al. December 5, 2	2017-12-05
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating App 20170029973 - Mayer; Steven T. ; et al.	2017-02-02
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating Grant 9,523,155 - Mayer , et al. December 20, 2	2016-12-20
Treatment method of electrodeposited copper for wafer-level-packaging process flow Grant 9,412,713 - Buckalew , et al. August 9, 2	2016-08-09
Treatment Method Of Electrodeposited Copper For Wafer-level-packaging Process Flow App 20140197037 - Buckalew; Bryan L. ; et al.	2014-07-17
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating App 20140183049 - Mayer; Steven T. ; et al.	2014-07-03
Methods And Apparatuses For Cleaning Electroplating Substrate Holders App 20130292254 - Kumar; Santosh ; et al.	2013-11-07
Method and apparatus for electroplating Grant 8,308,931 - Reid , et al. November 13, 2	2012-11-13
Methods for multi-step copper plating on a continuous ruthenium film in recessed features Grant 8,076,241 - Cerio, Jr. , et al. December 13, 2	2011-12-13
Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers Grant 7,964,506 - Ponnuswamy , et al. June 21, 2	2011-06-21
Methods For Multi-step Copper Plating On A Continuous Ruthenium Film In Recessed Features App 20110076390 - Cerio, JR.; Frank M. ; et al.	2011-03-31
Method and apparatus for electroplating App 20100032310 - Reid; Jonathan ; et al.	2010-02-11
Method of making integrated circuits using ruthenium and its oxides as a Cu diffusion barrier Grant 7,247,554 - Chyan , et al. July 24, 2	2007-07-24
Method of using materials based on Ruthenium and Iridium and their oxides, as a Cu diffusion barrier, and integrated circuits incorporating same App 20040051117 - Chyan, Oliver ; et al.	2004-03-18

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