Polster; Tobias

Patent Applications and Registrations

Patent applications and USPTO patent grants for Polster; Tobias.The latest application filed is for "composite wafer, semiconductor device and electronic component".

Company Profile

3.3.5

Polster; Tobias - Villach AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composite Wafer, Semiconductor Device and Electronic Component App 20220181211 - Ganitzer; Paul ; et al.	2022-06-09
Roughening of a metallization layer on a semiconductor wafer Grant 11,322,400 - von Koblinski , et al. May 3, 2	2022-05-03
Composite wafer, semiconductor device and electronic component Grant 11,302,579 - Ganitzer , et al. April 12, 2	2022-04-12
Semiconductor Device Having a Thin Semiconductor Die App 20210143108 - Gruber; Christian ; et al.	2021-05-13
Roughening of a Metallization Layer on a Semiconductor Wafer App 20200402851 - von Koblinski; Carsten ; et al.	2020-12-24
Composite Wafer, Semiconductor Device and Electronic Component App 20200273750 - Ganitzer; Paul ; et al.	2020-08-27
Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device Grant 10,672,664 - Ganitzer , et al.	2020-06-02
Composite Wafer, Semiconductor Device, Electronic Component and Method of Manufacturing a Semiconductor Device App 20190088550 - Ganitzer; Paul ; et al.	2019-03-21

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