| Patent | Date |
|---|
Barrier Structure With Passage For Waveguide In Photonic Integrated Circuit
App 20220308297 - Polomoff; Nicholas A. ; et al. | 2022-09-29 |
Photonics Chips With An Edge Coupler And A Continuous Crackstop
App 20220291464 - Polomoff; Nicholas A. ; et al. | 2022-09-15 |
Cascaded Sensing Circuits For Detecting And Monitoring Cracks In An Integrated Circuit
App 20220057445 - Polomoff; Nicholas A. ; et al. | 2022-02-24 |
Cascaded sensing circuits for detecting and monitoring cracks in an integrated circuit
Grant 11,215,661 - Polomoff , et al. January 4, 2 | 2022-01-04 |
Corner Structures For An Optical Fiber Groove
App 20210375788 - Polomoff; Nicholas A. ; et al. | 2021-12-02 |
Cascaded Sensing Circuits For Detecting And Monitoring Cracks In An Integrated Circuit
App 20210356514 - Polomoff; Nicholas A. ; et al. | 2021-11-18 |
Corner structures for an optical fiber groove
Grant 11,145,606 - Polomoff , et al. October 12, 2 | 2021-10-12 |
Corner Structures For An Optical Fiber Groove
App 20210305172 - Polomoff; Nicholas A. ; et al. | 2021-09-30 |
Crack detecting and monitoring system for an integrated circuit
Grant 11,105,846 - Polomoff , et al. August 31, 2 | 2021-08-31 |
Hermetic barrier for semiconductor device
Grant 11,037,873 - Polomoff , et al. June 15, 2 | 2021-06-15 |
Hermetic Barrier For Semiconductor Device
App 20200381355 - Polomoff; Nicholas A. ; et al. | 2020-12-03 |
IC structure with interdigitated conductive elements between metal guard structures
Grant 10,770,407 - Wu , et al. Sep | 2020-09-08 |
Guard ring for photonic integrated circuit die
Grant 10,770,412 - Polomoff , et al. Sep | 2020-09-08 |
Interconnected integrated circuit (IC) chip structure and packaging and method of forming same
Grant 10,714,411 - Sauter , et al. | 2020-07-14 |
Ic Structure With Interdigitated Conductive Elements Between Metal Guard Structures
App 20200219826 - Wu; Zhuojie ; et al. | 2020-07-09 |
Guard Ring For Photonic Integrated Circuit Die
App 20200066656 - Polomoff; Nicholas A. ; et al. | 2020-02-27 |
Seal ring structure of integrated circuit and method of forming same
Grant 10,546,822 - Polomoff , et al. Ja | 2020-01-28 |
Arc-resistant crackstop
Grant 10,438,902 - McGahay , et al. O | 2019-10-08 |
Interconnected Integrated Circuit (ic) Chip Structure And Packaging And Method Of Forming Same
App 20190287879 - Sauter; Wolfgang ; et al. | 2019-09-19 |
Arc-resistant Crackstop
App 20190074253 - MCGAHAY; Vincent J. ; et al. | 2019-03-07 |
Seal Ring Structure Of Integrated Circuit And Method Of Forming Same
App 20190067210 - Polomoff; Nicholas A. ; et al. | 2019-02-28 |
Crack stop with overlapping vias
Grant 10,153,232 - Fox, III , et al. Dec | 2018-12-11 |
Crack Stop With Overlapping Vias
App 20180315707 - Fox, III; Robert J. ; et al. | 2018-11-01 |
Crackstop structures
Grant 10,109,600 - McGahay , et al. October 23, 2 | 2018-10-23 |
Crack-stop structure for an IC product and methods of making such a crack-stop structure
Grant 10,090,258 - Boyd , et al. October 2, 2 | 2018-10-02 |
Crack trapping in semiconductor device structures
Grant 10,068,859 - Polomoff , et al. September 4, 2 | 2018-09-04 |
Maskless Selective Retention Of A Cap Upon A Conductor From A Nonconductive Capping Layer
App 20180082965 - Erwin; Brian M. ; et al. | 2018-03-22 |
Maskless Selective Retention Of A Cap Upon A Conductor From A Nonconductive Capping Layer
App 20180076160 - Erwin; Brian M. ; et al. | 2018-03-15 |
Flip chip alignment mark exposing method enabling wafer level underfill
Grant 9,824,925 - Farooq , et al. November 21, 2 | 2017-11-21 |
Substrate including selectively formed barrier layer
Grant 9,754,823 - Brovman , et al. September 5, 2 | 2017-09-05 |
Substrate including selectively formed barrier layer
Grant 9,748,135 - Brovman , et al. August 29, 2 | 2017-08-29 |
Maskless Selective Retention Of A Cap Upon A Conductor From A Nonconductive Capping Layer
App 20170117241 - Erwin; Brian M. ; et al. | 2017-04-27 |
Flip Chip Alignment Mark Exposing Method Enabling Wafer Level Underfill
App 20160365281 - Farooq; Mukta G. ; et al. | 2016-12-15 |
Substrate Including Selectively Formed Barrier Layer
App 20160204028 - Brovman; Yuri M. ; et al. | 2016-07-14 |
Laser Ablation System Including Variable Energy Beam To Minimize Etch-stop Material Damage
App 20160184926 - Sheets; Courtney T. ; et al. | 2016-06-30 |
Universal solder joints for 3D packaging
Grant 9,343,420 - Erwin , et al. May 17, 2 | 2016-05-17 |
Laser Etching System Including Mask Reticle For Multi-depth Etching
App 20160074968 - Souter; Matthew E. ; et al. | 2016-03-17 |
Substrate Including Selectively Formed Barrier Layer
App 20150357235 - Brovman; Yuri M. ; et al. | 2015-12-10 |
Substrate Including Selectively Formed Barrier Layer
App 20150348831 - Brovman; Yuri M. ; et al. | 2015-12-03 |
Selective Plating Without Photoresist
App 20150348910 - Arvin; Charles L. ; et al. | 2015-12-03 |
Selective Plating Without Photoresist
App 20150311161 - Arvin; Charles L. ; et al. | 2015-10-29 |
Universal Solder Joints For 3d Packaging
App 20150235979 - Erwin; Brian M. ; et al. | 2015-08-20 |
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