Polka Wood; Lesley A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Polka Wood; Lesley A..The latest application filed is for "microelectronic package with reduced through-substrate routing".
- Polka Wood; Lesley A. - Chandler AZ
| Patent | Date |
|---|---|
| Microelectronic Package With Reduced Through-substrate Routing App 20210296241 - Sain; Arghya ; et al. | 2021-09-23 |
| In-package microelectronic apparatus, and methods of using same Grant 8,354,748 - Dattaguru , et al. January 15, 2 | 2013-01-15 |
| In-package microelectronic apparatus, and methods of using same Grant 8,110,920 - Dattaguru , et al. February 7, 2 | 2012-02-07 |
| In-pakage microelectronic apparatus, and methods of using same App 20100309704 - Dattaguru; Sriram ; et al. | 2010-12-09 |
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