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Patent applications and USPTO patent grants for Polisetti; Revathi Uma.The latest application filed is for "method of making multi-chip package with high-speed serial communications between semiconductor dice".
Patent | Date |
---|---|
Method of making multi-chip package with high-speed serial communications between semiconductor dice Grant 7,537,960 - Kelly , et al. May 26, 2 | 2009-05-26 |
Method of Making Multi-Chip Package with High-Speed Serial Communications between Semiconductor Dice App 20080113471 - Kelly; Michael G. ;   et al. | 2008-05-15 |
Multi-chip package with high-speed serial communications between semiconductor die Grant 7,342,310 - Kelly , et al. March 11, 2 | 2008-03-11 |
Multi-chip package with high-speed serial communications between semiconductor die App 20050248036 - Kelly, Michael G. ;   et al. | 2005-11-10 |
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