Poliks; Mark David

Patent Applications and Registrations

Patent applications and USPTO patent grants for Poliks; Mark David.The latest application filed is for "method for filling high aspect ratio via holes in electronic substrates and the resulting holes".

Company Profile

0.7.3

Poliks; Mark David - Vestal NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for filling high aspect ratio via holes in electronic substrates Grant 6,581,280 - Curcio , et al. June 24, 2	2003-06-24
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes App 20020179335 - Curcio, Brian Eugene ; et al.	2002-12-05
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes Grant 6,452,117 - Curcio , et al. September 17, 2	2002-09-17
Electronic package utilizing protective coating Grant 6,351,030 - Havens , et al. February 26, 2	2002-02-26
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes App 20010027842 - Curcio, Brian E. ; et al.	2001-10-11
Electronic Package Utilizing Protective Coating App 20010011773 - HAVENS, ROSS DOWNEY ; et al.	2001-08-09
Dustfree prepreg and method for making an article based thereon Grant 5,928,970 - Appelt , et al. July 27, 1	1999-07-27
Method for providing a protective coating and electronic package utilizing same Grant 5,888,850 - Havens , et al. March 30, 1	1999-03-30
Technique for forming resin-impregnated fiberglass sheets Grant 5,773,371 - Appelt , et al. June 30, 1	1998-06-30
Technique for forming resin-impregnated fiberglass sheets Grant 5,756,405 - Appelt , et al. May 26, 1	1998-05-26

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