Poh; Zi-Song
Patent Applications and Registrations
Patent applications and USPTO patent grants for Poh; Zi-Song.The latest application filed is for "shielded semiconductor device and lead frame therefor".
- Poh; Zi-Song - Melaka MY
- Poh; Zi Song - Petaling Jaya MY
- Poh; Zi-Song - Malacca N/A MY
| Patent | Date |
|---|---|
| Shielded semiconductor device and lead frame therefor Grant 10,654,709 - Ngion , et al. | 2020-05-19 |
| Shielded Semiconductor Device And Lead Frame Therefor App 20200131030 - Ngion; Lee Fee ; et al. | 2020-04-30 |
| Universal BGA substrate Grant 9,698,093 - Foong , et al. July 4, 2 | 2017-07-04 |
| Universal Bga Substrate App 20170062320 - FOONG; CHEE SENG ; et al. | 2017-03-02 |
| Substrate with electrically isolated bond pads Grant 9,209,144 - Ngion , et al. December 8, 2 | 2015-12-08 |
| Method of forming pillar bump Grant 9,209,147 - Foong , et al. December 8, 2 | 2015-12-08 |
| Lead Frames Having Metal Traces With Metal Stubs App 20150311143 - Foong; Chee Seng ; et al. | 2015-10-29 |
| Insulated wire bonding with EFO before second bond Grant 9,165,904 - Siong , et al. October 20, 2 | 2015-10-20 |
| Bonded wire semiconductor device Grant 8,450,841 - Ong , et al. May 28, 2 | 2013-05-28 |
| Bonded Wire Semiconductor Device App 20130032932 - ONG; Li Ting Celina ; et al. | 2013-02-07 |
| Lead Frame And Semiconductor Package Manufactured Therewith App 20110204498 - Au; Yin Kheng ; et al. | 2011-08-25 |
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