Pisigan; Jairus Legaspi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pisigan; Jairus Legaspi.The latest application filed is for "integrated circuit packaging system with interconnects and method of manufacture thereof".

Company Profile

0.42.31

Pisigan; Jairus Legaspi - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with a flip chip and method of manufacture thereof Grant 9,034,692 - Bathan , et al. May 19, 2	2015-05-19
Etched recess package on package system Grant 8,941,219 - Camacho , et al. January 27, 2	2015-01-27
Integrated circuit packaging system with interconnects and method of manufacture thereof Grant 8,802,555 - Bathan , et al. August 12, 2	2014-08-12
Integrated circuit packaging system with flip chip and method of manufacture thereof Grant 8,766,428 - Camacho , et al. July 1, 2	2014-07-01
Integrated circuit package system with anti-peel contact pads Grant 8,652,881 - Camacho , et al. February 18, 2	2014-02-18
Integrated circuit package system having perimeter paddle Grant 8,643,157 - Tay , et al. February 4, 2	2014-02-04
Integrated circuit package system with flex bump Grant 8,637,394 - Pisigan , et al. January 28, 2	2014-01-28
Integrated circuit packaging system with interconnects and method of manufacture thereof Grant 8,558,369 - Camacho , et al. October 15, 2	2013-10-15
Integrated circuit package system Grant 8,513,801 - Tay , et al. August 20, 2	2013-08-20
Integrated circuit package system with extended corner leads Grant 8,502,371 - Camacho , et al. August 6, 2	2013-08-06
Method and apparatus for a package having multiple stacked die Grant 8,354,742 - Camacho , et al. January 15, 2	2013-01-15
Method of manufacture of integrated circuit packaging system with stacked integrated circuit Grant 8,338,233 - Camacho , et al. December 25, 2	2012-12-25
Integrated circuit packaging system with bond wire pads and method of manufacture thereof Grant 8,304,337 - Bathan , et al. November 6, 2	2012-11-06
Fan-in interposer on lead frame for an integrated circuit package on package system Grant 8,304,869 - Camacho , et al. November 6, 2	2012-11-06
Integrated circuit package system with leads separated from a die paddle Grant 8,278,148 - Punzalan , et al. October 2, 2	2012-10-02
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20120241931 - Bathan; Henry Descalzo ; et al.	2012-09-27
Integrated Circuit Packaging System With A Flip Chip And Method Of Manufacture Thereof App 20120241983 - Bathan; Henry Descalzo ; et al.	2012-09-27
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20120241968 - Camacho; Zigmund Ramirez ; et al.	2012-09-27
Integrated circuit package system with package integration Grant 8,258,614 - Camacho , et al. September 4, 2	2012-09-04
Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof Grant 8,236,607 - Bathan , et al. August 7, 2	2012-08-07
Integrated circuit package system with leaded package and method for manufacturing thereof Grant 8,148,208 - Camacho , et al. April 3, 2	2012-04-03
Integrated circuit package system with leadfinger Grant 8,148,825 - Camacho , et al. April 3, 2	2012-04-03
Method Of Manufacture Of Integrated Circuit Packaging System With Stacked Integrated Circuit App 20120064668 - Camacho; Zigmund Ramirez ; et al.	2012-03-15
Integrated circuit package system with package encapsulation having recess Grant 8,129,827 - Camacho , et al. March 6, 2	2012-03-06
Integrated circuit packaging system with a dual substrate package and method of manufacture thereof Grant 8,106,499 - Camacho , et al. January 31, 2	2012-01-31
Integrated circuit packaging system with plated pad and method of manufacture thereof Grant 8,106,502 - Bathan , et al. January 31, 2	2012-01-31
Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof Grant 8,080,867 - Camacho , et al. December 20, 2	2011-12-20
Integrated circuit package system with multiple die Grant 8,067,825 - Advincula , et al. November 29, 2	2011-11-29
Etched Recess Package On Package System App 20110180928 - Camacho; Zigmund Ramirez ; et al.	2011-07-28
Integrated circuit package system with dual connectivity Grant 7,977,782 - Camacho , et al. July 12, 2	2011-07-12
Multi-layer package-on-package system Grant 7,977,780 - Tay , et al. July 12, 2	2011-07-12
Integrated Circuit Packaging System With Bond Wire Pads And Method Of Manufacture Thereof App 20110140287 - Bathan; Henry Descalzo ; et al.	2011-06-16
Integrated Circuit Packaging System With Flip Chip And Method Of Manufacture Thereof App 20110127661 - Camacho; Zigmund Ramirez ; et al.	2011-06-02
Integrated Circuit Packaging System With Stacked Integrated Circuit And Method Of Manufacture Thereof App 20110101542 - Camacho; Zigmund Ramirez ; et al.	2011-05-05
Method for forming an etched recess package on package system Grant 7,932,130 - Camacho , et al. April 26, 2	2011-04-26
Integrated circuit package system with leadframe array Grant 7,915,716 - Pisigan , et al. March 29, 2	2011-03-29
Integrated circuit packaging system with base structure device Grant 7,915,724 - Ha , et al. March 29, 2	2011-03-29
Integrated Circuit Packaging System With A Dual Substrate Package And Method Of Manufacture Thereof App 20100320583 - Camacho; Zigmund Ramirez ; et al.	2010-12-23
Integrated Circuit Packaging System With Stacked Integrated Circuit And Method Of Manufacture Thereof App 20100320586 - Bathan; Henry Descalzo ; et al.	2010-12-23
Integrated Circuit Package System With Leaded Package And Method For Manufacturing Thereof App 20100264525 - Camacho; Zigmund Ramirez ; et al.	2010-10-21
Integrated circuit package system with leaded package Grant 7,777,354 - Camacho , et al. August 17, 2	2010-08-17
Integrated Circuit Packaging System With Plated Pad And Method Of Manufacture Thereof App 20100123229 - Bathan; Henry Descalzo ; et al.	2010-05-20
Integrated circuit packaging system with stacked device and method of manufacturing thereof Grant 7,691,674 - Bathan , et al. April 6, 2	2010-04-06
Integrated Circuit Package System With Singulation Process App 20100078831 - Pisigan; Jairus Legaspi ; et al.	2010-04-01
Integrated Circuit Package System With Anti-peel Pad App 20100072591 - Camacho; Zigmund Ramirez ; et al.	2010-03-25
Integrated Circuit Package System App 20100038761 - Tay; Lionel Chien Hui ; et al.	2010-02-18
Fan-in Interposer On Lead Frame For An Integrated Circuit Package On Package System App 20100025834 - Camacho; Zigmund Ramirez ; et al.	2010-02-04
Multi-layer Package-on-package System App 20100025836 - Tay; Lionel Chien Hui ; et al.	2010-02-04
A Method For Forming An Etched Recess Package On Package System App 20100025830 - Camacho; Zigmund Ramirez ; et al.	2010-02-04
Method and Apparatus For a Package Having Multiple Stacked Die App 20090243064 - Camacho; Zigmund R. ; et al.	2009-10-01
Integrated Circuit Package System With Extended Corner Leads App 20090166845 - Camacho; Zigmund Ramirez ; et al.	2009-07-02
Integrated Circuit Package System With Package Integration App 20090121335 - Camacho; Zigmund Ramirez ; et al.	2009-05-14
Integrated Circuit Package System With Dual Connectivity App 20090115032 - Camacho; Zigmund Ramirez ; et al.	2009-05-07
Integrated Circuit Package System With Leadframe Array App 20090085177 - Pisigan; Jairus Legaspi ; et al.	2009-04-02
Integrated Circuit Packaging System With Base Structure Device App 20090085178 - Ha; Jong-Woo ; et al.	2009-04-02
Integrated Circuit Package System With Multiple Die App 20090085181 - Advincula, JR.; Abelardo Hadap ; et al.	2009-04-02
Integrated Circuit Package System With Leads Separated From A Die Paddle App 20090072364 - Punzalan; Jeffrey D. ; et al.	2009-03-19
Integrated Circuit Package System With Package Encapsulation Having Recess App 20090072412 - Camacho; Zigmund Ramirez ; et al.	2009-03-19
Integrated Circuit Package System With Flex Bump App 20090008761 - Pisigan; Jairus Legaspi ; et al.	2009-01-08
Integrated Circuit Package System Having Perimeter Paddle App 20080315380 - Tay; Lionel Chien Hui ; et al.	2008-12-25
Integrated Circuit Package System With Leadfinger App 20080303123 - Camacho; Zigmund Ramirez ; et al.	2008-12-11
Integrated Circuit Package System With Leaded Package App 20080303122 - Camacho; Zigmund Ramirez ; et al.	2008-12-11