Pisigan; Jairus L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pisigan; Jairus L..The latest application filed is for "semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure".

Company Profile

0.11.7

Pisigan; Jairus L. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure Grant 9,721,925 - Bathan , et al. August 1, 2	2017-08-01
Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die Grant 9,472,427 - Bathan , et al. October 18, 2	2016-10-18
Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure App 20150028496 - Bathan; Henry D. ; et al.	2015-01-29
Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers Grant 8,890,328 - Camacho , et al. November 18, 2	2014-11-18
Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure Grant 8,872,320 - Bathan , et al. October 28, 2	2014-10-28
Semiconductor device and method of forming a protective layer on a backside of the wafer Grant 8,802,505 - Bathan , et al. August 12, 2	2014-08-12
Semiconductor Device and Method of Forming Leadframe With Notched Fingers for Stacking Semiconductor Die App 20120241915 - Bathan; Henry D. ; et al.	2012-09-27
Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure App 20120119361 - Bathan; Henry D. ; et al.	2012-05-17
Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Non-Linear Portions of Conductive Layers App 20120074567 - Camacho; Zigmund R. ; et al.	2012-03-29
Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure Grant 8,110,440 - Bathan , et al. February 7, 2	2012-02-07
Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers Grant 8,105,915 - Camacho , et al. January 31, 2	2012-01-31
Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Non-Linear Portions of Conductive Layers App 20100314780 - Camacho; Zigmund R. ; et al.	2010-12-16
Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure App 20100289131 - Bathan; Henry D. ; et al.	2010-11-18
Semiconductor Device and Method of Forming a Protective Layer on a Backside of the Wafer App 20100078834 - Bathan; Henry D. ; et al.	2010-04-01

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