Pipitone; John

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pipitone; John.The latest application filed is for "physical vapor deposition with isotropic neutral and non-isotropic ion velocity distribution at the wafer surface".

Company Profile

1.26.22

Pipitone; John - Livermore CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Physical vapor deposition with isotropic neutral and non-isotropic ion velocity distribution at the wafer surface Grant 10,648,074 - Hoffman , et al.	2020-05-12
Physical Vapor Deposition With Isotropic Neutral And Non-isotropic Ion Velocity Distribution At The Wafer Surface App 20190338411 - Hoffman; Daniel J. ; et al.	2019-11-07
Physical vapor deposition system with a source of isotropic ion velocity distribution at the wafer surface Grant 10,400,328 - Hoffman , et al. Sep	2019-09-03
Physical Vapor Deposition System with a Source of Isotropic Ion Velocity Distribution at the Wafer Surface App 20180119272 - Hoffman; Daniel J. ; et al.	2018-05-03
Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface Grant 9,856,558 - Hoffman , et al. January 2, 2	2018-01-02
Physical vapor deposition chamber with capacitive tuning at wafer support Grant 9,593,411 - Hoffman , et al. March 14, 2	2017-03-14
Methods for depositing metal in high aspect ratio features Grant 8,846,451 - Ritchie , et al. September 30, 2	2014-09-30
Methods for depositing metal in high aspect ratio features Grant 8,563,428 - Brown , et al. October 22, 2	2013-10-22
Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron Grant 8,562,798 - Brown , et al. October 22, 2	2013-10-22
Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron Grant 8,512,526 - Brown , et al. August 20, 2	2013-08-20
Physical Vapor Deposition Chamber With Capacitive Tuning At Wafer Support App 20130008778 - HOFFMAN; DANIEL J. ; et al.	2013-01-10
Methods For Depositing Metal In High Aspect Ratio Features App 20120149192 - BROWN; KARL ; et al.	2012-06-14
Methods For Depositing Metal In High Aspect Ratio Features App 20120028461 - Ritchie; Alan ; et al.	2012-02-02
Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target Grant 8,070,925 - Hoffman , et al. December 6, 2	2011-12-06
Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target Grant 8,062,484 - Brown , et al. November 22, 2	2011-11-22
Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas Grant 7,820,020 - Brown , et al. October 26, 2	2010-10-26
Method of multi-location ARC sensing with adaptive threshold comparison Grant 7,768,269 - Pipitone , et al. August 3, 2	2010-08-03
Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation Grant 7,750,645 - Pipitone , et al. July 6, 2	2010-07-06
System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating Grant 7,750,644 - Pipitone , et al. July 6, 2	2010-07-06
Apparatus for wafer level arc detection at an electrostatic chuck electrode Grant 7,737,702 - Pipitone June 15, 2	2010-06-15
Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode Grant 7,733,095 - Pipitone , et al. June 8, 2	2010-06-08
Physical Vapor Deposition Reactor With Circularly Symmetric Rf Feed And Dc Feed To The Sputter Target App 20100096261 - HOFFMAN; DANIEL J. ; et al.	2010-04-22
Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface App 20090229969 - Hoffman; Daniel J. ; et al.	2009-09-17
Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode App 20090159439 - Pipitone; John ; et al.	2009-06-25
Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation App 20090053836 - Pipitone; John ; et al.	2009-02-26
Method of multi-location ARC sensing with adaptive threshold comparison App 20090045046 - Pipitone; John ; et al.	2009-02-19
System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating App 20090044748 - Pipitone; John ; et al.	2009-02-19
Apparatus for wafer level arc detection at an electrostatic chuck electrode App 20090044750 - Pipitone; John	2009-02-19
Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece Grant 7,399,943 - Brown , et al. July 15, 2	2008-07-15
Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece Grant 7,268,076 - Brown , et al. September 11, 2	2007-09-11
Physical vapor deposition plasma reactor with VHF source power applied through the workpiece Grant 7,244,344 - Brown , et al. July 17, 2	2007-07-17
Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece Grant 7,214,619 - Brown , et al. May 8, 2	2007-05-08
Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron App 20060191876 - Brown; Karl M. ; et al.	2006-08-31
Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas App 20060169578 - Brown; Karl M. ; et al.	2006-08-03
Physical vapor deposition plasma reactor with RF source power applied to the target App 20060169584 - Brown; Karl M. ; et al.	2006-08-03
Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron App 20060169582 - Brown; Karl M. ; et al.	2006-08-03
Physical vapor deposition plasma reactor with VHF source power applied through the workpiece App 20060169576 - Brown; Karl M. ; et al.	2006-08-03
Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece App 20060172536 - Brown; Karl M. ; et al.	2006-08-03
Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target App 20060172517 - Brown; Karl M. ; et al.	2006-08-03
Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece App 20060073690 - Brown; Karl M. ; et al.	2006-04-06
Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece App 20060073283 - Brown; Karl M. ; et al.	2006-04-06
Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece App 20060073700 - Brown; Karl M. ; et al.	2006-04-06

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