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Patent applications and USPTO patent grants for Piper; Amanda L..The latest application filed is for "full removal of dual damascene metal level".
Patent | Date |
---|---|
Via contact structure having dual silicide layers Grant 8,288,828 - Iwatake , et al. October 16, 2 | 2012-10-16 |
Full Removal Of Dual Damascene Metal Level App 20070275565 - Cooney; Edward C. III ;   et al. | 2007-11-29 |
Fabrication of via contacts having dual silicide layers App 20070077753 - Iwatake; Michael M. ;   et al. | 2007-04-05 |
Dual Silicide Via Contact Structure And Process App 20060051959 - Iwatake; Michael M. ;   et al. | 2006-03-09 |
Single and multilevel rework Grant 6,982,227 - Cooney, III , et al. January 3, 2 | 2006-01-03 |
Full Removal Of Dual Damascene Metal Level App 20040245636 - Cooney, Edward C III ;   et al. | 2004-12-09 |
Single and multilevel rework App 20040142565 - Cooney, Edward C. III ;   et al. | 2004-07-22 |
Single and multilevel rework Grant 6,674,168 - Cooney, III , et al. January 6, 2 | 2004-01-06 |
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