Patent applications and USPTO patent grants for PINK GMBH THERMOSYSTEME.The latest application filed is for "heat transfer device for producing a soldered connection of electrical components".
Patent | Date |
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Heat transfer device for producing a soldered connection of electrical components Grant 11,351,623 - Oetzel , et al. June 7, 2 | 2022-06-07 |
Heat Transfer Device For Producing A Soldered Connection Of Electrical Components App 20200180058 - OETZEL; Christoph ;   et al. | 2020-06-11 |
Soldering Device And A Method For Producing A Solder Connection Of Components Using Adhesive Material For Temporary Connection O App 20200101549 - Hutzler; Aaron ;   et al. | 2020-04-02 |
Heat transfer device for producing a soldered connection of electrical components Grant 10,596,649 - Oetzel , et al. | 2020-03-24 |
Heat Transfer Device For Producing A Soldered Connection Of Electrical Components App 20170326665 - OETZEL; Christoph ;   et al. | 2017-11-16 |
Method and device for heat treatment, especially connection by soldering Grant 7,878,386 - Weber February 1, 2 | 2011-02-01 |
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