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Patent applications and USPTO patent grants for Pincus; Derek Bowman.The latest application filed is for "molded fiber cushioning".
Patent | Date |
---|---|
Opening configuration for shrink-wrapped package Grant 11,014,706 - McGee , et al. May 25, 2 | 2021-05-25 |
Molded fiber cushioning Grant 10,906,719 - Pincus February 2, 2 | 2021-02-02 |
Molded Fiber Cushioning App 20200095046 - PINCUS; Derek Bowman | 2020-03-26 |
Opening Configuration For Shrink-wrapped Package App 20190337672 - MCGEE; Kelly B. ;   et al. | 2019-11-07 |
Earphone packaging Grant 9,975,692 - Pincus , et al. May 22, 2 | 2018-05-22 |
Earphone Packaging App 20180044102 - PINCUS; Derek Bowman ;   et al. | 2018-02-15 |
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