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Patent applications and USPTO patent grants for Pillai; Edward R..The latest application filed is for "chip-based prober for high frequency measurements and methods of measuring".
Patent | Date |
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Chip-based Prober For High Frequency Measurements And Methods Of Measuring App 20110156730 - Pillai; Edward R. ;   et al. | 2011-06-30 |
Chip-based prober for high frequency measurements and methods of measuring Grant 7,956,628 - Pillai , et al. June 7, 2 | 2011-06-07 |
Monitoring system for detecting and characterizing classes of leakage in CMOS devices Grant 7,397,261 - Hsu , et al. July 8, 2 | 2008-07-08 |
Chip-based Prober For High Frequency Measurements And Methods Of Measuring App 20080106277 - Pillai; Edward R. ;   et al. | 2008-05-08 |
Universal Cmos Device Leakage Characterization System App 20070252613 - Hsu; Louis Lu-Chen ;   et al. | 2007-11-01 |
Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards Grant 7,271,681 - Dyckman , et al. September 18, 2 | 2007-09-18 |
On-pad broadband matching network Grant 7,265,433 - Pillai , et al. September 4, 2 | 2007-09-04 |
Clearance Hole Size Adjustment For Impedance Control In Multilayer Electronic Packaging And Printed Circuit Boards App 20070008049 - Dyckman; Warren D. ;   et al. | 2007-01-11 |
In-module current source Grant 7,085,143 - Dyckman , et al. August 1, 2 | 2006-08-01 |
On-pad Broadband Matching Network App 20060151851 - Pillai; Edward R. ;   et al. | 2006-07-13 |
Embedded inductor and method of making Grant 6,975,199 - Long , et al. December 13, 2 | 2005-12-13 |
Method of forming a dielectric substrate having a multiturn inductor Grant 6,931,712 - Long , et al. August 23, 2 | 2005-08-23 |
Embedded Inductor And Method Of Making App 20050150106 - Long, David Clifford ;   et al. | 2005-07-14 |
MLC frequency selective circuit structures Grant 6,806,793 - Bhatia , et al. October 19, 2 | 2004-10-19 |
MLC frequency selective circuit structures App 20040113721 - Bhatia, Harsaran S. ;   et al. | 2004-06-17 |
Multi-step transmission line for multilayer packaging Grant 6,680,530 - Pillai , et al. January 20, 2 | 2004-01-20 |
High density thermal solution for direct attach modules Grant 6,657,864 - Dyckman , et al. December 2, 2 | 2003-12-02 |
Embedded inductor and method of making App 20030112114 - Long, David Clifford ;   et al. | 2003-06-19 |
Interconnect structure for surface mounted devices App 20020130410 - Semkow, Krystyna W. ;   et al. | 2002-09-19 |
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