PIETSCH; Georg

Patent Applications and Registrations

Patent applications and USPTO patent grants for PIETSCH; Georg.The latest application filed is for "method for separating a plurality of slices from workpieces during a number of separating processes by means of a wire saw, and semiconductor wafer made of monocrystalline silicon".

Company Profile

0.31.25

PIETSCH; Georg - Burghausen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Separating A Plurality Of Slices From Workpieces During A Number Of Separating Processes By Means Of A Wire Saw, And Semiconductor Wafer Made Of Monocrystalline Silicon App 20220234250 - PIETSCH; Georg ; et al.	2022-07-28
Wire Saw, Wire Guide Roll And Method For Simultaneously Cutting A Multiplicity Of Wafers From An Ingot App 20200016671 - PIETSCH; Georg	2020-01-16
Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece Grant 9,573,296 - Pietsch February 21, 2	2017-02-21
Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers Grant 9,539,695 - Pietsch , et al. January 10, 2	2017-01-10
Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece Grant 9,346,188 - Pietsch May 24, 2	2016-05-24
Method for simultaneously cutting a multiplicity of wafers from a workpiece Grant 9,333,673 - Pietsch May 10, 2	2016-05-10
Device and method for buffer-storing a multiplicity of wafer-type workpieces Grant 9,199,791 - Pietsch December 1, 2	2015-12-01
Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece App 20150314484 - Pietsch; Georg	2015-11-05
Method and apparatus for trimming the working layers of a double-side grinding apparatus Grant 9,011,209 - Pietsch , et al. April 21, 2	2015-04-21
Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece App 20150083104 - Pietsch; Georg	2015-03-26
Method for trimming the working layers of a double-side grinding apparatus Grant 8,986,070 - Pietsch , et al. March 24, 2	2015-03-24
Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers Grant 8,974,267 - Pietsch , et al. March 10, 2	2015-03-10
Method for trimming the working layers of a double-side grinding apparatus Grant 8,911,281 - Pietsch , et al. December 16, 2	2014-12-16
Method for the simultaneous double-side material-removing processing of at least three workpieces Grant 8,851,958 - Pietsch October 7, 2	2014-10-07
Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers Grant 8,801,500 - Pietsch August 12, 2	2014-08-12
Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus Grant 8,795,776 - Pietsch August 5, 2	2014-08-05
Method And Apparatus For Trimming The Working Layers Of A Double-side Grinding Apparatus App 20140170942 - Pietsch; Georg ; et al.	2014-06-19
Method And Apparatus For Trimming The Working Layers Of A Double-side Grinding Apparatus App 20140170939 - Pietsch; Georg ; et al.	2014-06-19
Method for producing a semiconductor wafer Grant 8,685,270 - Schwandner , et al. April 1, 2	2014-04-01
Method for polishing a substrate composed of semiconductor material Grant 8,647,985 - Schwandner , et al. February 11, 2	2014-02-11
Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers Grant 8,512,099 - Kerstan , et al. August 20, 2	2013-08-20
Apparatus And Method For Simultaneously Slicing A Multiplicity Of Slices From A Workpiece App 20130206126 - Pietsch; Georg	2013-08-15
Method For The Simultaneous Double-side Material-removing Processing Of At Least Three Workpieces App 20130072093 - Pietsch; Georg	2013-03-21
Methods for producing and processing semiconductor wafers Grant 8,398,878 - Pietsch March 19, 2	2013-03-19
Device and Method For Buffer-Storing A Multiplicity of Wafer-Type Workpieces App 20130011227 - Pietsch; Georg	2013-01-10
Insert Carrier And Method For The Simultaneous Double-side Material-removing Processing Of Semiconductor Wafers App 20120190277 - Pietsch; Georg ; et al.	2012-07-26
Method For Providing A Respective Flat Working Layer On Each Of The Two Working Disks Of A Double-side Processing Apparatus App 20120189777 - Pietsch; Georg	2012-07-26
Method For The Simultaneous Material-removing Processing Of Both Sides Of At Least Three Semiconductor Wafers App 20120156970 - Pietsch; Georg	2012-06-21
Method for the simultaneous grinding of a plurality of semiconductor wafers Grant 8,113,913 - Pietsch , et al. February 14, 2	2012-02-14
Method And Apparatus For Trimming The Working Layers Of A Double-side Grinding Apparatus App 20120028546 - Pietsch; Georg ; et al.	2012-02-02
Method For Producing A Semiconductor Wafer App 20110133314 - Pietsch; Georg ; et al.	2011-06-09
Method For Producing A Semiconductor Wafer App 20110097975 - SCHWANDNER; Juergen ; et al.	2011-04-28
Semiconductor wafer, apparatus and process for producing the semiconductor wafer Grant 7,867,059 - Pietsch , et al. January 11, 2	2011-01-11
Methods For Producing And Processing Semiconductor Wafers App 20100323586 - Pietsch; Georg	2010-12-23
Method for the simultaneous double-side grinding of a plurality of semiconductor wafers Grant 7,815,489 - Pietsch , et al. October 19, 2	2010-10-19
Device For The Double-Sided Processing Of Flat Workpieces and Method For The Simultaneous Double-Sided Material Removal Processing Of A Plurality Of Semiconductor Wafers App 20100099337 - Kerstan; Michael ; et al.	2010-04-22
Semiconductor Wafer, Apparatus and Process For Producing The Semiconductor Wafer App 20090203297 - Pietsch; Georg ; et al.	2009-08-13
Carrier, Method For Coating A Carrier, and Method For The Simultaneous Double-Side Material-Removing Machining Of Semiconductor Wafers App 20090104852 - Pietsch; Georg ; et al.	2009-04-23
Method For Polishing A Substrate Composed Of Semiconductor Material App 20090029552 - Schwandner; Juergen ; et al.	2009-01-29
Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx Layer App 20080265375 - Pietsch; Georg ; et al.	2008-10-30
Method For The Simultaneous Grinding Of A Plurality Of Semiconductor Wafers App 20080233840 - Pietsch; Georg ; et al.	2008-09-25
Method For The Simultaneous Double-Side Grinding Of A Plurality Of Semiconductor Wafers, And Semiconductor Wafer Having Outstanding Flatness App 20080014839 - Pietsch; Georg ; et al.	2008-01-17
Semiconductor wafer, apparatus and process for producing the semiconductor wafer App 20050173377 - Pietsch, Georg ; et al.	2005-08-11
Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish Grant 6,051,498 - Pietsch , et al. April 18, 2	2000-04-18

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