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Thin film barrier seed metallization in magnetic-plugged through hole inductor
Grant 11,443,885 - Darmawikarta , et al. September 13, 2 | 2022-09-13 |
Coreless Electronic Substrates Having Embedded Inductors
App 20220285079 - Pietambaram; Srinivas ; et al. | 2022-09-08 |
Hybrid Fan-out Architecture With Emib And Glass Core For Heterogeneous Die Integration Applications
App 20220254721 - PIETAMBARAM; Srinivas ; et al. | 2022-08-11 |
Chiplet First Architecture For Die Tiling Applications
App 20220238458 - PIETAMBARAM; Srinivas ; et al. | 2022-07-28 |
Techniques For Die Tiling
App 20220238506 - Pietambaram; Srinivas ; et al. | 2022-07-28 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications
Grant 11,355,438 - Pietambaram , et al. June 7, 2 | 2022-06-07 |
Substrate embedded magnetic core inductors and method of making
Grant 11,348,718 - Pietambaram , et al. May 31, 2 | 2022-05-31 |
Techniques for an inductor at a first level interface
Grant 11,322,290 - Xu , et al. May 3, 2 | 2022-05-03 |
Electromigration resistant and profile consistent contact arrays
Grant 11,309,239 - Pietambaram , et al. April 19, 2 | 2022-04-19 |
Techniques For Die Tiling
App 20220115367 - PIETAMBARAM; Srinivas ; et al. | 2022-04-14 |
Chiplet First Architecture For Die Tiling Applications
App 20220115334 - PIETAMBARAM; Srinivas ; et al. | 2022-04-14 |
Electronic Substrates Having Embedded Inductors
App 20220093534 - Duong; Benjamin ; et al. | 2022-03-24 |
Radio Frequency Antennas And Waveguides For Communication Between Integrated Circuit Devices
App 20220084962 - Aleksov; Aleksandar ; et al. | 2022-03-17 |
Enabling magnetic films in inductors integrated into semiconductor packages
Grant 11,270,959 - Darmawikarta , et al. March 8, 2 | 2022-03-08 |
Dual-damascene zero-misalignment-via process for semiconductor packaging
Grant 11,264,307 - Aleksov , et al. March 1, 2 | 2022-03-01 |
Conductive Route Patterning For Electronic Substrates
App 20210280463 - Ecton; Jeremy ; et al. | 2021-09-09 |
In-plane Inductors In Ic Packages
App 20210273036 - Marin; Brandon C. ; et al. | 2021-09-02 |
Techniques for an inductor at a second level interface
Grant 11,031,360 - Xu , et al. June 8, 2 | 2021-06-08 |
Glass Dielectric Layer With Patterning
App 20210078296 - KONG; Jieying ; et al. | 2021-03-18 |
Copperless Regions To Control Plating Growth
App 20210082852 - MARIN; Bradon C. ; et al. | 2021-03-18 |
Capacitors With Nanoislands On Conductive Plates
App 20210066447 - PIETAMBARAM; Srinivas ; et al. | 2021-03-04 |
Hybrid Glass Core For Wafer Level And Panel Level Packaging Applications
App 20210050289 - KONG; Jieying ; et al. | 2021-02-18 |
Glass Core Patch With In Situ Fabricated Fan-out Layer To Enable Die Tiling Applications
App 20210028080 - PIETAMBARAM; Srinivas ; et al. | 2021-01-28 |
Embedded Patch For Local Material Property Modulation
App 20210028101 - NIE; Bai ; et al. | 2021-01-28 |
Sandwich-molded Cores For High-inductance Architectures
App 20210014972 - MARIN; Brandon C. ; et al. | 2021-01-14 |
Nested Interposer Package For Ic Chips
App 20210005542 - MALLIK; Debendra ; et al. | 2021-01-07 |
Heterogeneous Nested Interposer Package For Ic Chips
App 20200395313 - MALLIK; Debendra ; et al. | 2020-12-17 |
Electromigration resistant and profile consistent contact arrays
Grant 10,854,541 - Pietambaram , et al. December 1, 2 | 2020-12-01 |
Electronic assembly that includes void free holes
Grant 10,856,424 - Boyapati , et al. December 1, 2 | 2020-12-01 |
Method To Form High Capacitance Thin Film Capacitors (tfcs) As Embedded Passives In Organic Substrate Packages
App 20200343049 - PAITAL; Sameer ; et al. | 2020-10-29 |
Controlled Organic Layers To Enhance Adhesion To Organic Dielectrics And Process For Forming Such
App 20200312768 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Patternable Die Attach Materials And Processes For Patterning
App 20200312771 - NIE; Bai ; et al. | 2020-10-01 |
Techniques for an inductor at a second level interface
Grant 10,777,514 - Xu , et al. Sept | 2020-09-15 |
Patch Accomodating Embedded Dies Having Different Thicknesses
App 20200266184 - PIETAMBARAM; Srinivas ; et al. | 2020-08-20 |
Chiplet First Architecture For Die Tiling Applications
App 20200258847 - A1 | 2020-08-13 |
Package Architecture With Tunable Magnetic Properties For Embedded Devices
App 20200258975 - A1 | 2020-08-13 |
Substrate integrated waveguide
Grant 10,705,293 - May , et al. | 2020-07-07 |
Integrated Circuit Substrate And Method Of Making
App 20200211952 - Manepalli; Rahul N. ; et al. | 2020-07-02 |
Multi-layer molded substrate with graded CTE
Grant 10,672,695 - Pietambaram , et al. | 2020-06-02 |
Integrated circuit substrate and method of making
Grant 10,658,281 - Manepalli , et al. | 2020-05-19 |
Surface Finishes With Low Rbtv For Fine And Mixed Bump Pitch Architectures
App 20200135679 - DARMAWAIKARTA; Kristof ; et al. | 2020-04-30 |
Selective Deposition Of Embedded Thin-film Resistors For Semiconductor Packaging
App 20200083164 - MARIN; Brandon C. ; et al. | 2020-03-12 |
Hybrid Fan-out Architecture With Emib And Glass Core For Heterogeneous Die Integration Applications
App 20200006232 - PIETAMBARAM; Srinivas ; et al. | 2020-01-02 |
Substrate Embedded Magnetic Core Inductors And Method Of Making
App 20200005987 - Pietambaram; Srinivas ; et al. | 2020-01-02 |
Structures Within A Substrate Layer To Cure Magnetic Paste
App 20200005990 - PAITAL; Sameer ; et al. | 2020-01-02 |
Techniques For An Inductor At A Second Level Interface
App 20190385959 - Xu; Cheng ; et al. | 2019-12-19 |
Techniques For An Inductor At A First Level Interface
App 20190385780 - Xu; Cheng ; et al. | 2019-12-19 |
Dual-damascene Zero-misalignment-via Process For Semiconductor Packaging
App 20190355647 - ALEKSOV; Aleksandar ; et al. | 2019-11-21 |
Techniques For Die Tiling
App 20190312019 - Pietambaram; Srinivas ; et al. | 2019-10-10 |
Electromigration resistant and profile consistent contact arrays
Grant 10,431,537 - Pietambaram , et al. O | 2019-10-01 |
Enabling Magnetic Films In Inductors Integrated Into Semiconductor Packages
App 20190295967 - DARMAWIKARTA; Kirstof ; et al. | 2019-09-26 |
Thin Film Barrier Seed Matallization In Magnetic-plugged Through Hole Inductor
App 20190279806 - DARMAWIKARTA; Kristof ; et al. | 2019-09-12 |
Dual-damascene zero-misalignment-via process for semiconductor packaging
Grant 10,403,564 - Aleksov , et al. Sep | 2019-09-03 |
Substrate Integrated Waveguide
App 20190250326 - May; Robert Alan ; et al. | 2019-08-15 |
Dual-damascene Zero-misalignment-via Process For Semiconductor Packaging
App 20190206767 - ALEKSOV; Aleksandar ; et al. | 2019-07-04 |
Stretchable electronic assembly
Grant 10,327,330 - Aleksov , et al. | 2019-06-18 |
Integrated Circuit Substrate And Method Of Making
App 20190103348 - Manepalli; Rahul N. ; et al. | 2019-04-04 |
Bendable and stretchable electronic devices and methods
Grant 10,204,855 - Levander , et al. Feb | 2019-02-12 |
Multi-layer Flexible/stretchable Electronic Package For Advanced Wearable Electronics
App 20180376585 - Aleksov; Aleksandar ; et al. | 2018-12-27 |
Multi-layer Molded Substrate With Graded Cte
App 20180366399 - Pietambaram; Srinivas ; et al. | 2018-12-20 |
Stretchable Electronic Assembly
App 20180295720 - Aleksov; Aleksandar ; et al. | 2018-10-11 |
Electronic Assembly That Includes Void Free Holes
App 20180288885 - Boyapati; Sri Ranga Sai ; et al. | 2018-10-04 |
Stretchable embedded electronic package
Grant 10,080,290 - Aleksov , et al. September 18, 2 | 2018-09-18 |
Stretchable Embedded Electronic Package
App 20170142839 - Aleksov; Aleksandar ; et al. | 2017-05-18 |
Magnetic field sensor
Grant 9,640,753 - Sun , et al. May 2, 2 | 2017-05-02 |
Bendable And Stretchable Electronic Devices And Methods
App 20160284630 - Levander; Alejandro ; et al. | 2016-09-29 |
Two-axis Magnetic Field Sensor Having Reduced Compensation Angle For Zero Offset
App 20140159179 - Sun; Jijun ; et al. | 2014-06-12 |
Two-axis magnetic field sensor having reduced compensation angle for zero offset
Grant 8,647,891 - Sun , et al. February 11, 2 | 2014-02-11 |
Two-axis Magnetic Field Sensor Having Reduced Compensation Angle For Zero Offset
App 20130264666 - Sun; Jijun ; et al. | 2013-10-10 |
Two-axis magnetic field sensor having reduced compensation angle for zero offset
Grant 8,508,221 - Sun , et al. August 13, 2 | 2013-08-13 |
Two-axis Magnetic Field Sensor Having Reduced Compensation Angle For Zero Offset
App 20120049843 - SUN; Jijun ; et al. | 2012-03-01 |
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