Pierson; Mark V.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pierson; Mark V..The latest application filed is for "recyclable and dispensable cutlery utensil".
Company Profile
2.48.23
- Pierson; Mark V. - Binghamton NY
- Pierson; Mark V. - Binghampton NY
- PIERSON, MARK V. - BROOME NY
- Pierson; Mark V. - Vestal NY
- Pierson; Mark V. - Lynn MA
Patent Activity
| Patent | Date |
|---|---|
| Recyclable And Dispensable Cutlery Utensil App 20210315399 - Pierson; Mark V. ; et al. | 2021-10-14 |
| Recyclable and dispensable cutlery utensil Grant 11,083,316 - Pierson , et al. August 10, 2 | 2021-08-10 |
| No touch utensil dispenser Grant 10,820,722 - Pierson , et al. November 3, 2 | 2020-11-03 |
| No Touch Utensil Dispenser App 20190075940 - Pierson; Mark V. ; et al. | 2019-03-14 |
| Toothpaste dispenser Grant 9,211,558 - Pierson , et al. December 15, 2 | 2015-12-15 |
| No touch utensil dispenser Grant 8,272,533 - D'Amelia , et al. September 25, 2 | 2012-09-25 |
| Optical assemblies for transmitting and manipulating optical beams Grant 8,089,133 - Gupta , et al. January 3, 2 | 2012-01-03 |
| Z interconnect structure and method Grant 7,718,902 - Jimarez , et al. May 18, 2 | 2010-05-18 |
| System and method for capturing contaminants within a disk drive Grant 6,980,392 - Pierson December 27, 2 | 2005-12-27 |
| Flip chip C4 extension structure and process Grant 6,955,982 - Jimarez , et al. October 18, 2 | 2005-10-18 |
| Optical communication assembly Grant 6,922,294 - Pierson , et al. July 26, 2 | 2005-07-26 |
| Fiber optic attachment method, structure, and system Grant 6,917,728 - Lemmon , et al. July 12, 2 | 2005-07-12 |
| Optical assemblies for transmitting and manipulating optical beams App 20050078376 - Gupta, Dinesh ; et al. | 2005-04-14 |
| Z interconnect structure and method App 20050051608 - Jimarez, Lisa J. ; et al. | 2005-03-10 |
| Fiber optic attachment method, structure, and system App 20040264861 - Lemmon, Michael S. ; et al. | 2004-12-30 |
| Optical assemblies for transmitting and manipulating optical beams Grant 6,836,015 - Denneau , et al. December 28, 2 | 2004-12-28 |
| Optical Assemblies For Transmitting And Manipulating Optical Beams App 20040217464 - Denneau, Monty M. ; et al. | 2004-11-04 |
| Optical communication assembly App 20040218288 - Pierson, Mark V. ; et al. | 2004-11-04 |
| Z interconnect structure and method Grant 6,805,280 - Jimarez , et al. October 19, 2 | 2004-10-19 |
| System and method for capturing contaminants within a disk drive App 20040201917 - Pierson, Mark V. | 2004-10-14 |
| Panel structure with plurality of chip compartments for providing high volume of chip modules Grant 6,774,472 - Pierson August 10, 2 | 2004-08-10 |
| Method for bonding heat sinks to overmolds and device formed thereby Grant 6,770,968 - Egitto , et al. August 3, 2 | 2004-08-03 |
| Flip chip C4 extension structure and process Grant 6,756,680 - Jimarez , et al. June 29, 2 | 2004-06-29 |
| Flip chip C4 extension structure and process App 20040094842 - Jimarez, Miguel A. ; et al. | 2004-05-20 |
| Method for bonding heat sinks to overmolds and device formed thereby Grant 6,719,871 - Egitto , et al. April 13, 2 | 2004-04-13 |
| Electrical coupling of a stiffener to a chip carrier Grant 6,699,736 - Dornbos , et al. March 2, 2 | 2004-03-02 |
| Low or no-force bump flattening structure and method Grant 6,674,647 - Pierson , et al. January 6, 2 | 2004-01-06 |
| Common heatsink for multiple chips and modules Grant 6,661,661 - Gaynes , et al. December 9, 2 | 2003-12-09 |
| LCD cover optical structure and method Grant 6,639,638 - Kodnani , et al. October 28, 2 | 2003-10-28 |
| Z interconnect structure and method App 20030127247 - Jimarez, Lisa J. ; et al. | 2003-07-10 |
| Common heatsink for multiple chips and modules App 20030128518 - Gaynes, Michael A. ; et al. | 2003-07-10 |
| Method for bonding heat sinks to overmolds and device formed thereby App 20030123229 - Egitto, Frank D. ; et al. | 2003-07-03 |
| Method and device for semiconductor testing using electrically conductive adhesives Grant 6,559,666 - Bernier , et al. May 6, 2 | 2003-05-06 |
| Electrical coupling of a stiffener to a chip carrier App 20030082853 - Dornbos, Terry J. ; et al. | 2003-05-01 |
| Electrical coupling of a stiffener to a chip carrier Grant 6,534,848 - Dornbos , et al. March 18, 2 | 2003-03-18 |
| Panel structure with plurality of chip compartments for providing high volume of chip modules App 20030017648 - Pierson, Mark V. | 2003-01-23 |
| Surface metal balancing to reduce chip carrier flexing Grant 6,497,943 - Jimarez , et al. December 24, 2 | 2002-12-24 |
| Circuit board construction App 20020166697 - Janecek, Mark L. ; et al. | 2002-11-14 |
| Chip C4 assembly improvement using magnetic force and adhesive Grant 6,429,384 - Downes, Jr. , et al. August 6, 2 | 2002-08-06 |
| Process For Making Semiconductor Chip Assembly App 20020046804 - CULNANE, THOMAS M. ; et al. | 2002-04-25 |
| Rolling ball connector Grant 6,358,627 - Benenati , et al. March 19, 2 | 2002-03-19 |
| Method for bonding heat sinks to overmolds and device formed thereby App 20020005245 - Egitto, Frank D. ; et al. | 2002-01-17 |
| Method of making electrically conductive contacts on substrates App 20020000462 - Mead, Donald I. ; et al. | 2002-01-03 |
| Method and device for semiconductor testing using electrically conductive adhesives App 20010035759 - Bernier, William E. ; et al. | 2001-11-01 |
| Semiconductor Testing Using Electrically Conductive Adhesives App 20010024127 - BERNIER, WILLIAM E. ; et al. | 2001-09-27 |
| Flip chip C4 extension structure and process App 20010018230 - Jimarez, Miguel A. ; et al. | 2001-08-30 |
| Rolling ball connector App 20010002330 - Benenati, Joseph A. ; et al. | 2001-05-31 |
| Method for bonding heat sinks to overmolds and device formed thereby App 20010001183 - Egitto, Frank D. ; et al. | 2001-05-17 |
| Method for bonding heat sinks to overmolds and device formed thereby Grant 6,206,997 - Egitto , et al. March 27, 2 | 2001-03-27 |
| Rolling ball connector Grant 6,177,729 - Benenati , et al. January 23, 2 | 2001-01-23 |
| Method of making electrically conductive contacts on substrates Grant 6,173,887 - Mead , et al. January 16, 2 | 2001-01-16 |
| Chip C4 assembly improvement using magnetic force and adhesive Grant 6,142,361 - Downes, Jr. , et al. November 7, 2 | 2000-11-07 |
| Encapsulation of solder bumps and solder connections Grant 6,100,114 - Milkovich , et al. August 8, 2 | 2000-08-08 |
| Semiconductor chip carrier assembly Grant 5,973,389 - Culnane , et al. October 26, 1 | 1999-10-26 |
| Electronic package assembly Grant 5,969,945 - Cutting , et al. October 19, 1 | 1999-10-19 |
| Advanced chip packaging structure for memory card applications Grant 5,889,654 - Pierson , et al. March 30, 1 | 1999-03-30 |
| Stiffeners with improved adhesion to flexible substrates Grant 5,889,321 - Culnane , et al. March 30, 1 | 1999-03-30 |
| Method for restraining circuit board warp during area array rework Grant 5,862,588 - Heim , et al. January 26, 1 | 1999-01-26 |
| Flexible circuit board and common heat spreader assembly Grant 5,831,828 - Cutting , et al. November 3, 1 | 1998-11-03 |
| Pressurized injection nozzle for screening paste Grant 5,565,033 - Gaynes , et al. October 15, 1 | 1996-10-15 |
| Method and apparatus for testing integrated circuit chips Grant 5,528,159 - Charlton , et al. June 18, 1 | 1996-06-18 |
| Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head Grant 5,478,700 - Gaynes , et al. December 26, 1 | 1995-12-26 |
| Dockable interface airlock between process enclosure and interprocess transfer container Grant 5,451,131 - Hecht , et al. September 19, 1 | 1995-09-19 |
| Method and apparatus for testing of integrated circuit chips Grant 5,420,520 - Anschel , et al. May 30, 1 | 1995-05-30 |
| Method of printed circuit panel manufacture Grant 5,364,225 - Hecht , et al. November 15, 1 | 1994-11-15 |
| Solar recharge station for electric vehicles Grant 5,315,227 - Pierson , et al. May 24, 1 | 1994-05-24 |
| Apparatus for maximizing light beam utilization Grant 5,290,992 - Lin , et al. March 1, 1 | 1994-03-01 |
| Automatic component dispensor Grant 4,273,393 - Foley , et al. June 16, 1 | 1981-06-16 |
| Longitudinally fed component insertion apparatus Grant 4,030,180 - Pierson June 21, 1 | 1977-06-21 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 